Line edge roughness of high deprotection activation energy photoresist by using sub-millisecond post exposure bake

2013 ◽  
Author(s):  
Jing Jiang ◽  
Byungki Jung ◽  
Michael O. Thompson ◽  
Christopher K. Ober
Keyword(s):  
Activation Energy ◽  
Line Edge Roughness ◽  
Post Exposure ◽  
Edge Roughness ◽  
Post Exposure Bake

scholarly journals Post-Exposure Bake Temperature Considerations for High Activation Energy Resist Systems.

2000 ◽  
Vol 13 (4) ◽  
pp. 513-518 ◽  
Author(s):  
Sanjay Malik ◽  
Jeff Eisele ◽  
Allyn Whewell ◽  
Lawrence Ferreira ◽  
Timothy Holt ◽  
...  
Keyword(s):  
Activation Energy ◽  
High Activation ◽  
High Activation Energy ◽  
Post Exposure ◽  
Post Exposure Bake

A novel post exposure bake technique to improve CD uniformity over product wafers

2005 ◽  
Author(s):  
Tomoyuki Takeishi ◽  
K. Hayasaki ◽  
Tsuyoshi Shibata
Keyword(s):  
Post Exposure ◽  
Post Exposure Bake

Characterization of Line-Edge Roughness in Cu/Low-kInterconnect Pattern

2008 ◽  
Vol 47 (4) ◽  
pp. 2501-2505 ◽  
Author(s):  
Atsuko Yamaguchi ◽  
Daisuke Ryuzaki ◽  
Ken-ichi Takeda ◽  
Jiro Yamamoto ◽  
Hiroki Kawada ◽  
...  
Keyword(s):  
Line Edge Roughness ◽  
Edge Roughness

Effect and procedures of post-exposure bake temperature optimization on the CD uniformity in a mass production environment

2007 ◽  
Author(s):  
Kirsten Ruck ◽  
Heiko Weichert ◽  
Steffen Hornig ◽  
Frank Finger ◽  
Göran Fleischer ◽  
...  
Keyword(s):  
Mass Production ◽  
Production Environment ◽  
Post Exposure ◽  
Temperature Optimization ◽  
Post Exposure Bake
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