Studying the difference between OFHC mirrors and copper single-crystal mirrors under low CO2 laser energy to investigate the increasing surface roughness under thermal load

1990 ◽  
Author(s):  
Juergen Wisotzki
2020 ◽  
Vol 12 (1) ◽  
pp. 232-241
Author(s):  
Na Ta ◽  
Chutian Zhang ◽  
Hongru Ding ◽  
Qingfeng Zhang

AbstractTillage and slope will influence soil surface roughness that changes during rainfall events. This study tests this effect under controlled conditions quantified by geostatistical and fractal indices. When four commonly adopted tillage practices, namely, artificial backhoe (AB), artificial digging (AD), contour tillage (CT), and linear slope (CK), were prepared on soil surfaces at 2 × 1 × 0.5 m soil pans at 5°, 10°, or 20° slope gradients, artificial rainfall with an intensity of 60 or 90 mm h−1 was applied to it. Measurements of the difference in elevation points of the surface profiles were taken before rainfall and after rainfall events for sheet erosion. Tillage practices had a relationship with fractal indices that the surface treated with CT exhibited the biggest fractal dimension D value, followed by the surfaces AD, AB, and CK. Surfaces under a stronger rainfall tended to have a greater D value. Tillage treatments affected anisotropy differently and the surface CT had the strongest effect on anisotropy, followed by the surfaces AD, AB, and CK. A steeper surface would have less effect on anisotropy. Since the surface CT had the strongest effect on spatial variability or the weakest spatial autocorrelation, it had the smallest effect on runoff and sediment yield. Therefore, tillage CT could make a better tillage practice of conserving water and soil. Simultaneously, changes in semivariogram and fractal parameters for surface roughness were examined and evaluated. Fractal parameter – crossover length l – is more sensitive than fractal dimension D to rainfall action to describe vertical differences in soil surface roughness evolution.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
O. N. Senkov ◽  
D. B. Miracle

AbstractTwo classical criteria, by Pugh and Pettifor, have been widely used by metallurgists to predict whether a material will be brittle or ductile. A phenomenological correlation by Pugh between metal brittleness and its shear modulus to bulk modulus ratio was established more than 60 years ago. Nearly four decades later Pettifor conducted a quantum mechanical analysis of bond hybridization in a series of intermetallics and derived a separate ductility criterion based on the difference between two single-crystal elastic constants, C12–C44. In this paper, we discover the link between these two criteria and show that they are identical for materials with cubic crystal structures.


Author(s):  
Toshiki Hirogaki ◽  
Eiichi Aoyama ◽  
Keiji Ogawa ◽  
Tsukasa Ayuzawa

This report describes the quality assessment of Blind Via Holes (BVHs) of Printed Wiring Boards (PWBs) drilled by a CO2 laser using Cu-direct drilling. In the Cu-direct drilling method, the copper foil and the build-up layer are melted at the same time, and the surface is treated to increase the laser energy absorbed by the copper foil since an untreated copper surface reflects most of the 10.6-μm-wavelength CO2 laser beam. However, there are few reports dealing with Cu-direct laser drilling of PWBs. In addition, when copper and resin with different processing thresholds are drilled at the same time, occurrences of a defect called overhang have been observed. So, in this report, first we propose a new method using thermography to measure the absorptance of a PWB surface for a CO2 laser. Moreover, we investigate how surface treatment of the outer copper foil influences the quality of a laser-drilled hole. Then, we observe the circumference of a point irradiated with the CO2 laser and explain how melting processes are different from surface treatment. Finally, based on the research we establish a method in order to cut down the overhang length as a parameter of drilled-hole quality. We also show that a high absorptance improves BVH quality.


1994 ◽  
Vol 354 ◽  
Author(s):  
Shuji Kiyohara ◽  
Iwao Miyamoto

AbstractIn order to apply ion beam etching with hydrogen ions to the ultra-precision processing of diamond tools, hydrogen ion beam etching characteristics of single crystal diamond chips with (100) face were investigated. The etching rate of diamond for 500 eV and 1000 eV hydrogen ions increases with the increase of the ion incidence angle, and eventually reaches a maximum at the ion incidence angle of approximately 50°, then may decrease with the increase of the ion incidence angle. The dependence of the etching rate on the ion incidence angle of hydrogen ions is fairly similar to that obtained with argon ions. Furthermore, the surface roughness of diamond chips before and after hydrogen ion beam etching was evaluated using an atomic force microscope. Consequently, the surface roughness after hydrogen ion beam etching decreases with the increase of the ion incidence angle within range of the ion incidence angle of 60°.


JOM ◽  
1953 ◽  
Vol 5 (5) ◽  
pp. 672-679 ◽  
Author(s):  
Y. C. Liu ◽  
W. R. Hibbard

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