Three-dimensional processing for plastic bulk material by a segmented pixel-drawing method using a CO 2 laser

2005 ◽  
Author(s):  
Noriyo Sakurada ◽  
Yoshio Ishii ◽  
Yuzuru Kubota ◽  
Kazuhiro Watanabe
Author(s):  
Jean-Numa Gillet ◽  
Yann Chalopin ◽  
Sebastian Volz

Owing to their thermal insulating properties, superlattices have been extensively studied. A breakthrough in the performance of thermoelectric devices was achieved by using superlattice materials. The problem of those nanostructured materials is that they mainly affect heat transfer in only one direction. In this paper, the concept of canceling heat conduction in the three spatial directions by using atomic-scale three-dimensional (3D) phononic crystals is explored. A period of our atomic-scale 3D phononic crystal is made up of a large number of diamond-like cells of silicon atoms, which form a square supercell. At the center of each supercell, we substitute a smaller number of Si diamond-like cells by other diamond-like cells, which are composed of germanium atoms. This elementary heterostructure is periodically repeated to form a Si/Ge 3D nanostructure. To obtain different atomic configurations of the phononic crystal, the number of Ge diamond-like cells at the center of each supercell can be varied by substitution of Si diamond-like cells. The dispersion curves of those atomic configurations can be computed by lattice dynamics. With a general equation, the thermal conductivity of our atomic-scale 3D phononic crystal can be derived from the dispersion curves. The thermal conductivity can be reduced by at least one order of magnitude in an atomic-scale 3D phononic crystal compared to a bulk material. This reduction is due to the decrease of the phonon group velocities without taking into account that of the phonon average mean free path.


PLoS ONE ◽  
2014 ◽  
Vol 9 (8) ◽  
pp. e105735 ◽  
Author(s):  
Tsuneo Yamashiro ◽  
Tetsuhiro Miyara ◽  
Osamu Honda ◽  
Hisashi Kamiya ◽  
Kiyoshi Murata ◽  
...  

2020 ◽  
Vol 26 (1) ◽  
pp. 107-121 ◽  
Author(s):  
Vladimir E. Kuznetsov ◽  
Alexey N. Solonin ◽  
Azamat Tavitov ◽  
Oleg Urzhumtsev ◽  
Anna Vakulik

Purpose This paper aims to investigate how the user-controlled parameters of the fused filament fabrication three-dimensional printing process define temperature conditions on the boundary between layers of the part being fabricated and how these conditions influence the structure and strength of the polylactic acid part. Design/methodology/approach Fracture load in a three-point bending test and calculated related stress were used as a measure. The samples were printed with the long side along the z-axis, thus, in the bend tests, the maximum stress occurred orthogonally to the layers. Temperature distribution on the sample surface during printing was monitored with a thermal imager. Sample mesostructure was analyzed using scanning electron microscopy. The influence of the extrusion temperature, the intensity of part cooling, the printing speed and the time between printing individual layers were considered. Findings It is shown that the optimization of the process parameters responsible for temperature conditions makes it possible to approximate the strength of the interlayer cohesion to the bulk material strength. Originality/value The novelty of the study consists in the generalization of the outcomes. All the parameters varied can be expressed through two factors, namely, the temperature of the previous layer and the extrusion efficiency, determining the ratio of the amount of extruded plastic to the calculated. A regression model was proposed that describes the effect of the two factors on the printed part strength. Along with interlayer bonding strength, these two factors determine the formation of the part mesostructure (the geometry of the boundaries between individual threads).


2010 ◽  
Vol 160 ◽  
pp. 17-22 ◽  
Author(s):  
David P. Field ◽  
Colin C. Merriman ◽  
Ioannis N. Mastorakos

Electron backscatter diffraction (EBSD) techniques have been used to measure the dislocation density tensor for various materials. Orientation data are typically obtained over a planar array of measurement positions and the minimum dislocation content required to produce the observed lattice curvature is calculated as the geometrically necessary (or excess) dislocation density. The present work shows a comparison of measurements in two-dimensions and three-dimensions using a dual beam instrument (focused ion beam, electron beam) to obtain the data. The two-dimensional estimate is obviously lower than that obtained from three-dimensional data since the 2D analysis necessarily assumes that the third dimension has no curvature in the lattice. Effects of the free-surface on EBSD measurements are discussed in conjunction with comparisons against X-ray microdiffraction experiments and a discrete dislocation dynamics model. It is observed that the EBSD measurements are sensitive to free-surface effects that may yield dislocation density observations that are not consistent with that of the bulk material.


Author(s):  
Yashar Javadi ◽  
Mohammadreza Hadizadeh Raeisi ◽  
Hamed Salimi Pirzaman ◽  
Mehdi Ahmadi Najafabadi

When a material is under mechanical load, the stresses change the velocity of acoustic waves because of acoustoelastic effect. This property can be employed for stress measurement in the material itself when the stress concerns the surface of the material, or in the bulk material. This technique involves with critically refracted longitudinal waves that propagate parallel to the surface, i. e. LCR waves. This paper presents a three dimensional thermo-mechanical analysis to evaluate welding residual stresses in plate-plate joint of AISI stainless steel 304L. After finite element simulation, the residual stresses were evaluated by LCR ultrasonic waves. This paper introduces a combination of “Finite Element Welding Simulation” and “Ultrasonic Stress Measurement using the LCR Wave” which is called as “FELcr”. The capabilities of FELCR in residual stress measurement are confirmed here. It has been shown that predicted residual stress from three dimensional FE analyses is in reasonable agreement with measured residual stress from LCR method.


1997 ◽  
Vol 474 ◽  
Author(s):  
C. B. Eom ◽  
R. A. Rao ◽  
Q. Gan ◽  
R. J. Cava ◽  
J. J. Krajewski ◽  
...  

ABSTRACTWe have observed both metallic and semiconducting behavior in epitaxial thin films of the metallic oxide CaRuO3 deposited under identical conditions on (100) SrTiO3 substrates of varying crystalline quality. X-ray diffraction studies showed that while semiconducting films with enlarged unit cells were obtained on single crystal SrTiO3 substrates, metallic films with lattice parameters close to the bulk material grew on poor crystalline quality SrTiO3 substrates. The films deposited on (100) LaAlO3 substrates consistently showed metallic behavior. Atomic force microscope images suggest that the semiconducting films had a coherent two dimensional nucleation. In contrast, three dimensional island-like incoherent growth was seen in the metallic films. It is believed that in the coherent films a strain induced substitution of the small Ru4+ cations by the larger Ca2+ cations occurs, breaking the conduction pathway within the three dimensional network of the RUO6 octahedra and leading to a metal-insulator transition. This unique phenomenon - which is not observed in bulk material - can be significant in technologically important epitaxial perovskite oxide heterostructures.


2018 ◽  
Vol 29 (6) ◽  
pp. 1586-1602 ◽  
Author(s):  
Olayinka Oderinde ◽  
Shunli Liu ◽  
Kewen Li ◽  
Mengmeng Kang ◽  
Hussain Imtiaz ◽  
...  

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