BALL-MAP: HOMEOMORPHISM BETWEEN COMPATIBLE SURFACES

2010 ◽  
Vol 20 (03) ◽  
pp. 285-306 ◽  
Author(s):  
FRÉDÉRIC CHAZAL ◽  
ANDRÉ LIEUTIER ◽  
JAREK ROSSIGNAC ◽  
BRIAN WHITED

Homeomorphisms between curves and between surfaces are fundamental to many applications of 3D modeling, graphics, and animation. They define how to map a texture from one object to another, how to morph between two shapes, and how to measure the discrepancy between shapes or the variability in a class of shapes. Previously proposed maps between two surfaces, S and S′, suffer from two drawbacks: (1) it is difficult to formally define a relation between S and S′ which guarantees that the map will be bijective and (2) mapping a point x of S to a point x′ of S′ and then mapping x′ back to S does in general not yield x, making the map asymmetric. We propose a new map, called ball-map, that is symmetric. We define simple and precise conditions for the ball-map to be a homeomorphism. We show that these conditions apply when the minimum feature size of each surface exceeds their Hausdorff distance. The ball-map, BM S,S′, between two such manifolds, S and S′, maps each point x of S to a point x′ = BM s,s′(x) of S′. BM S′,S is the inverse of BM S,S′, hence BM is symmetric. We also show that, when S and S′ are Ck (n - 1)-manifolds in ℝn, BM S,S′ is a Ck-1 diffeomorphism and defines a Ck-1 ambient isotopy that smoothly morphs between S to S′. In practice, the ball-map yields an excellent map for transferring parameterizations and textures between ball compatible curves or surfaces. Furthermore, it may be used to define a morph, during which each point x of S travels to the corresponding point x′ of S′ along a broken line that is normal to S at x and to S′ at x′.

2007 ◽  
Vol 17 (05) ◽  
pp. 403-421 ◽  
Author(s):  
FREDERIC CHAZAL ◽  
ANDRE LIEUTIER ◽  
JAREK ROSSIGNAC

Consider two (n−1)-dimensional manifolds, S and S′ in ℝn. We say that they are normal-compatible when the closest projection of each one onto the other is a homeomorphism. We give a tight condition under which S and S′ are normal-compatible. It involves the minimum feature size of S and of S′ and the Hausdorff distance between them. Furthermore, when S and S′ are normal-compatible, their Frechet distance is equal to their Hausdorff distance. Our results hold for arbitrary dimension n.


Author(s):  
Joshua Grose ◽  
Obehi G. Dibua ◽  
Dipankar Behera ◽  
Chee S. Foong ◽  
Michael Cullinan

Abstract Additive Manufacturing (AM) technologies are often restricted by the minimum feature size of parts they can repeatably build. The microscale selective laser sintering (μ-SLS) process, which is capable of producing single micron resolution parts, addresses this issue directly. However, the unwanted dissipation of heat within the powder bed of a μ-SLS device during laser sintering is a primary source of error that limits the minimum feature size of the producible parts. A particle scale thermal model is needed to characterize the thermal properties of the nanoparticles undergoing sintering and allow for the prediction of heat affected zones (HAZ) and the improvement of final part quality. Thus, this paper presents a method for the determination of the effective thermal conductivity of metal nanoparticle beds in a microscale selective laser sintering process using finite element simulations in ANSYS. CAD models of nanoparticle groups at various timesteps during sintering are developed from Phase Field Modeling (PFM) output data, and steady state thermal simulations are performed on each group. The complete simulation framework developed in this work is adaptable to particle groups of variable sizes and geometric arrangements. Results from the thermal models are used to estimate the thermal conductivity of the copper nanoparticles as a function of sintering duration.


Author(s):  
Ivin Varghese ◽  
M. D. Murthy Peri ◽  
Dong Zhou ◽  
A. T. John Kadaksham ◽  
Thomas J. Dunbar ◽  
...  

Nano-scale substrate cleanliness is an essential requirement in variety of nanotechnology applications. Currently, the detachment and removal of sub-100nm particles is of a particular interest and challenge in semiconductor manufacture, lithography, and nanotechnology. The proposed particle removal technique based on pressure shock waves generated by a laser induced plasma (LIP) core is of interest in various nano/micro fabrication applications in which the minimum feature size has been reducing rapidly. Any removal technique adopted in a fabrication process must be on the same shrinking feature reduction curve since, for device reliability, the minimum tolerable foreign particle size on a substrate depends on the minimum feature size on a nano/micro-system or device. In recent years, we have demonstrated that nanoparticles can be detached and removed from substrates using LIP shock wavefronts. While we have experimentally established the effectiveness of the LIP technique for removing nanoparticles in the sub-100nm range, the removal mechanisms were not well-understood. In the current work, we introduce a set of novel removal mechanisms based on moment resistance of the particle-substrate bond and discuss their effectiveness and applicability in laser-induced plasma shock nanoparticle removal. To gain better understanding for the detachment mechanisms, the resultant force and rolling moment induced on the nanoparticle by the LIP shockwave front need to be determined. Since, for sub-100nm nanoparticles, the Knudsen number Kn exceeds 0.1, the applicability of the Navier-Stokes equations for the gas motion becomes questionable as the continuum assumption for the medium breaks down due to the invalidity of the transport terms in these equations. Detachment and detachment mechanisms of nanoparticles from flat surfaces subjected to shockwaves are investigated by employing molecular gas dynamic simulations using the direct simulation Monte Carlo method and experimental transient pressure data. Two new mechanisms for nanoparticle detachment based on rolling moment resistance of the adhesion bond and the elastic restitution effect are introduced. As a result of present simulations, it is computationally demonstrated that the pulsed laser-induced shockwaves can generate sufficient rolling moments to detach sub-100nm particles and initiate removal. The transient moment exerted on a 60nm polystyrene latex (PSL) particle on a silicon substrate are presented and discussed.


Micromachines ◽  
2020 ◽  
Vol 11 (9) ◽  
pp. 859
Author(s):  
Zan Zhang ◽  
Beiju Huang ◽  
Zanyun Zhang ◽  
Chuantong Cheng ◽  
Bing Bai ◽  
...  

We propose a broadband high-efficiency grating coupler for perfectly vertical fiber-to-chip coupling. The up-reflection is reduced, hence enhanced coupling efficiency is achieved with the help of a Fabry-Perot-like cavity composed of a silicon nitride reflector and the grating itself. With the theory of the Fabry-Perot cavity, the dimensional parameters of the coupler are investigated. With the optimized parameters, up-reflection in the C-band is reduced from 10.6% to 5%, resulting in an enhanced coupling efficiency of 80.3%, with a 1-dB bandwidth of 58 nm, which covers the entire C-band. The minimum feature size of the proposed structure is over 219 nm, which makes our design easy to fabricate through 248 nm deep-UV lithography, and lowers the fabrication cost. The proposed design has potential in efficient and fabrication-tolerant interfacing applications, between off-chip light sources and integrated chips that can be mass-produced.


Author(s):  
Wei Lek Kwan ◽  
Ricky J. Tseng ◽  
Yang Yang

Multi-layer stackable polymer memory architecture is an interesting new direction for polymer memory. The memory density can be increased by increasing the number of stacked layers without reducing the minimum feature size. To achieve multi-level stacking, the polymer used must be able to be cross-linked so that it will not be dissolved upon deposition of additional layers. This requirement also makes the polymer robust enough to withstand conventional lithographic processes. In this paper, the various approaches to achieve cross-linkable polymer memory are discussed. Device fabrication and performance are also reported.


2018 ◽  
Vol 24 (2) ◽  
pp. 436-440 ◽  
Author(s):  
Benjamin Weiss ◽  
Olaf Diegel ◽  
Duane Storti ◽  
Mark Ganter

Purpose Manufacturer specifications for the resolution of an additive manufacturing (AM) machine can be ten times smaller (more optimistic) than the actual size of manufacturable features. Existing methods used to establish a manufacturable design rule-set are conservative piecewise-constant approximations. This paper aims to evaluate the effectiveness of a first-order model for producing improved design rule-sets for feature manufacturability, accounting for process variation. Design/methodology/approach A framework is presented which uses an interpolation method and a statistical model to estimate the minimum size for a wide range of features from a set of iterative experiments. Findings For an SLS process, using this approach improves the accuracy and reliability of minimum feature size estimates for a wider variety of features than assessed by most existing test artifacts. Research limitations/implications More research is needed to provide better interpolation models, broaden applicability and account for additional geometric and process parameters which significantly impact the results. This research focuses on manufacturability and does not address dimensional accuracy of the features produced. Practical implications An application to the design of thin channels in a prosthetic hand shows the utility of the results in a real-world scenario. Originality/value This study is among the first to investigate statistical variation of “pass/fail” features in AM process characterization, propose a means of estimating minimum feature sizes for shapes not directly tested and incorporate a more efficient iterative experimental protocol.


2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Alexandre Poulin ◽  
Xavier Aeby ◽  
Gilberto Siqueira ◽  
Gustav Nyström

AbstractEmerging technologies such as smart packaging are shifting the requirements on electronic components, notably regarding service life, which counts in days instead of years. As a result, standard materials are often not adapted due to economic, environmental or manufacturing considerations. For instance, the use of metal conductive tracks in disposable electronics is a waste of valuable resources and their accumulation in landfills is an environmental concern. In this work, we report a conductive ink made of carbon particles dispersed in a solution of shellac. This natural and water-insoluble resin works as a binder, favourably replacing petroleum-derived polymers. The carbon particles provide electrical conductivity and act as a rheology modifier, creating a printable shear-thinning gel. The ink’s conductivity and sheet resistance are 1000 S m−1 and 15 Ω sq−1, respectively, and remain stable towards moisture. We show that the ink is compatible with several industry-relevant patterning methods such as screen-printing and robocasting, and demonstrate a minimum feature size of 200 μm. As a proof-of-concept, a resistor and a capacitor are printed and used as deformation and proximity sensors, respectively.


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