Optimizing signal collection efficiency of the VIPA-based Brillouin spectrometer

Brillouin spectroscopy is an emerging tool for microscopic optical imaging as it allows for noninvasive and direct assessment of the viscoelastic properties of materials. Recent advances of background-free confocal Brillouin spectrometer allows investigators to acquire the Brillouin spectra for turbid samples as well as transparent ones. However, due to strong signal loss induced by the imperfect optical setup, the Brillouin photons are usually immersed in background noise. In this report, we proposed and experimentally demonstrated multiple approaches to enhance the signal collection efficiency. A signal enhancement by > 4 times can be observed, enabling observation of ultra-weak signals.

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Improving localization precision of Brillouin measurements using spectral autocorrelation analysis

Journal of Innovative Optical Health Sciences ◽

10.1142/s1793545817420044 ◽

2017 ◽

Vol 10 (06) ◽

pp. 1742004 ◽

Cited By ~ 6

Author(s):

Eitan Edrei ◽

Milos Nikolic ◽

Giuliano Scarcelli

Keyword(s):

Mechanical Properties ◽

Numerical Simulation ◽

Autocorrelation Function ◽

Background Noise ◽

Intrinsic Noise ◽

Theoretical Treatment ◽

Autocorrelation Analysis ◽

Brillouin Spectroscopy ◽

Localization Precision ◽

Properties Of Materials

Brillouin spectroscopy is a powerful tool for measuring the mechanical properties of materials without contact. The sensitivity to mechanical changes that a Brillouin spectrometer can detect is determined by the precision to which a spectral peak can be localized. The localization precision is however fundamentally limited by the low number of photons within a Brillouin measurement, as well as by intrinsic noise of the setup. Here, we present a method to improve the spectral sensitivity of Brillouin measurements by exploiting the autocorrelation function of the spectrum. We show that by performing a localization process on the autocorrelation function nearly 20% increase in localization precision can be obtained. This result is consistent between our theoretical treatment, numerical simulation and experimental results. We further study the effect of background noise on the precision improvement for realistic scenarios.

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Reduction of Acquisition Time for RIL, SDL, and LADA

ISTFA 2007: Conference Proceedings from the 33rd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2007p0006 ◽

2007 ◽

Author(s):

Arjan Mels ◽

Frank Zachariasse

Keyword(s):

Background Noise ◽

Signal Strength ◽

Acquisition Time ◽

Optimal Conditions ◽

Signal Collection ◽

Defect Localization ◽

Model Equations ◽

Set Up ◽

Main Operating ◽

Quantitative Tool

Abstract Although RIL, SDL and LADA are slightly different, the main operating principle is the same and the theory for defect localization presented in this paper is applicable to all three methods. Throughout this paper the authors refer to LADA, as all experimental results in this paper were obtained with a 1064nm laser on defect free circuits. This paper first defines mathematically what 'signal strength' actually means in LADA and then demonstrates a statistical model of the LADA situation that explains the optimal conditions for signal collection and the parameters involved. The model is tested against experimental data and is also used to optimise the acquisition time. Through this model, equations were derived for the acquisition time needed to discern a LADA response from the background noise. The model offers a quantitative tool to estimate the feasibility of a given LADA measurement and a guide to optimising the required experimental set-up.

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Measurement of the viscoelastic properties of materials with a very large loss factor by a two-parameter method

Measurement Techniques ◽

10.1007/bf02504086 ◽

1997 ◽

Vol 40 (3) ◽

pp. 251-254

Author(s):

V. M. Kulik ◽

S. L. Morozova

Keyword(s):

Viscoelastic Properties ◽

Loss Factor ◽

Parameter Method ◽

Large Loss ◽

Properties Of Materials ◽

Two Parameter

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Transmission Electron Microscopy Imaging of Structural Transformation Dynamics in a Single Nanocrystal

Microscopy Today ◽

10.1017/s1551929511001556 ◽

2012 ◽

Vol 20 (1) ◽

pp. 18-22

Author(s):

Haimei Zheng

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Collection Efficiency ◽

Single Atom ◽

Microscopy Imaging ◽

High Brightness ◽

Rapid Acquisition ◽

Signal Collection ◽

Transmission Electron ◽

Resolution Imaging

Over the last decade, transmission electron microscopy (TEM) has advanced remarkably. With the development of aberration-corrected optics, improved recording systems, high brightness guns, and so on, imaging with single-atom sensitivity across the periodic table has become a reality. Atomic resolution imaging with rapid acquisition and with greater signal collection efficiency opens many opportunities in the study of dynamic processes of materials.

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Suggested Method of Test for Some Viscoelastic Properties of Materials, Especially Frozen and Nonfrozen Soils, Under Vibratory Loads.

Special Procedures for Testing Soil and Rock for Engineering Purposes: Fifth Edition ◽

10.1520/stp38549s ◽

2009 ◽

pp. 530-530-17

Author(s):

HW Stevens

Keyword(s):

Viscoelastic Properties ◽

Suggested Method ◽

Properties Of Materials

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Covering a fiber taper with a refractive index matching gel residue: a significant increase in evanescent-wave signal collection efficiency

Chinese Optics Letters ◽

10.3788/col201109.s10701 ◽

2011 ◽

Vol 9 (s1) ◽

pp. s10701-310703 ◽

Cited By ~ 1

Author(s):

Huacai Chen Huacai Chen ◽

Jianjun Ma Jianjun Ma ◽

Jiahua Chen Jiahua Chen ◽

Wojtek J. Bock Wojtek J. Bock ◽

Andrea Cusano Andrea Cusano

Keyword(s):

Refractive Index ◽

Evanescent Wave ◽

Collection Efficiency ◽

Wave Signal ◽

Index Matching ◽

Signal Collection ◽

Fiber Taper ◽

Refractive Index Matching

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A Thermo-Viscoelastic Analysis and Reliability Evaluation for a Single-Sided CSP

Advances in Electronic Packaging, Parts A, B, and C ◽

10.1115/ipack2005-73096 ◽

2005 ◽

Author(s):

Hideo Koguchi ◽

Mirai Ishida ◽

Kazuto Nishida ◽

Tomoaki Kuroishi

Keyword(s):

Normal Stress ◽

Viscoelastic Properties ◽

Normal Stresses ◽

Layered Plate ◽

Heat Cycle ◽

Viscoelastic Analysis ◽

Chip Size ◽

Properties Of Materials ◽

Rigid Walls ◽

Gold Bump

In the present paper, a reliability of a single-sided chip-size package (CSP) manufactured using a non-conductive adhesive stud bump direct interconnection method is investigated. The reliability of the CSP is closely related with normal stress between an IC chip and a gold bump. Total normal stress can be decomposed into two parts, deflection related and thermal expansion related. The deflection for a three-layered plate, which is taken into account viscoelastic properties for the resin-sealed sheet and the substrate, respectively, is calculated and compared with experimental results on the deflection of the single-sided CSP. A relationship between the normal stress and the curvature derived from deflection is deduced. Through the use of this relationship, the variation of normal stress with the heat cycle is obtained considering the viscoelastic properties of materials. Furthermore, a relaxation behavior for the thermal stress in the resin-sealed sheet between two rigid walls considering its viscoelastic property is investigated. Summing up normal stresses for each calculation yields the normal stress between the IC and the bump. A relationship between the normal stress and the life of single-sided CSP is investigated for heat cycle. The life in experiment can be explained by the relaxation in the normal stress and the amplitude of the normal stress.

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On the Applicability of Sneddon's Solution for Interpreting the Indentation of Nonlinear Elastic Biopolymers

Journal of Applied Mechanics ◽

10.1115/1.4027973 ◽

2014 ◽

Vol 81 (9) ◽

Cited By ~ 14

Author(s):

Man-Gong Zhang ◽

Jinju Chen ◽

Xi-Qiao Feng ◽

Yanping Cao

Keyword(s):

Elastic Properties ◽

Viscoelastic Properties ◽

Contact Theory ◽

Elastic Contact ◽

Flat Punch ◽

Linear Elastic ◽

Contact Models ◽

Properties Of Materials ◽

Nonlinear Elastic ◽

Viscoelastic Contact

Indentation has been widely used to characterize the mechanical properties of biopolymers. Besides Hertzian solution, Sneddon's solution is frequently adopted to interpret the indentation data to deduce the elastic properties of biopolymers, e.g., elastic modulus. Sneddon's solution also forms the basis to develop viscoelastic contact models for determining the viscoelastic properties of materials from either conical or flat punch indentation responses. It is worth mentioning that the Sneddon's solution was originally proposed on the basis of linear elastic contact theory. However, in both conical and flat punch indentation of compliant materials, the indented solid may undergo finite deformation. In this case, the extent to which the Sneddon's solution is applicable so far has not been systematically investigated. In this paper, we use the combined theoretical, computational, and experimental efforts to investigate the indentation of hyperelastic compliant materials with a flat punch or a conical tip. The applicability of Sneddon's solutions is examined. Furthermore, we present new models to determine the elastic properties of nonlinear elastic biopolymers.

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