The Depth Profiling of the Crystal Quality in Laser-Annealed Polycrystalline Si Films by Raman Microprobe

ABSTRACTA comparative study of solid phase epitaxy (SPE) of deposited and ion-implanted amorphous Si films was conducted with the use of a newly developed laser technique. The effects of interface contaminants and contaminants distributed within a deposited film on the rate of SPE and final crystal quality are reported. In the absence of impurities, deposited Si films crystallize at the same rate as ion-implanted layers and yield epitaxial films with comparable crystal quality. The presence of impurities in deposited films at the interface or distributed within the film can severely retard the SPE growth, causing several deleterious effects which ultimately degrade the film quality. These effects are more severe at high temperatures.

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Round‐robin test of medium‐energy ion scattering for quantitative depth profiling of ultrathin HfO 2 /SiO 2 /Si films

Surface and Interface Analysis ◽

10.1002/sia.6642 ◽

2019 ◽

Vol 51 (7) ◽

pp. 712-721 ◽

Cited By ~ 2

Author(s):

Won Ja Min ◽

Gabriel Marmitt ◽

Pedro L. Grande ◽

DaeWon Moon ◽

Keyword(s):

Depth Profiling ◽

Round Robin ◽

Medium Energy ◽

Ion Scattering ◽

Round Robin Test ◽

Medium Energy Ion Scattering ◽

Si Films

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Amorphous Silicon Precipitates in (100) c-SI Films Grown by ECRCVD

MRS Proceedings ◽

10.1557/proc-557-555 ◽

1999 ◽

Vol 557 ◽

Cited By ~ 2

Author(s):

M. Birkholz ◽

J. Platen ◽

I. Sieber ◽

W. Bohne ◽

J. Röhrich ◽

...

Keyword(s):

Thin Films ◽

Raman Spectroscopy ◽

Electron Cyclotron Resonance ◽

Depth Profiling ◽

Film Surface ◽

Chemical Vapor ◽

Elastic Recoil ◽

Pronounced Increase ◽

Detection Analysis ◽

Si Films

AbstractSilicon films were grown on (100) n-Si with an electron-cyclotron resonance chemical vapor deposition (ECRCVD) system by decomposition of SiH4 at 325°C. Structure and composition of thin films were investigated by SEM, Raman spectroscopy, elastic recoil detection analysis (ERDA) and TEM. Excellent epitaxial growth was achieved for some hundred nm thickness. For more than 1 μm thick films, however, SEM revealed the occurrence of conical structures orientated upside-down with their basal plane in the film surface. Depth-profiling of the elemental composition of thin films by means of ERDA showed the hydrogen content CH to exhibit a pronounced increase with increasing film thickness. Raman spectroscopy evidenced the coexistence of c-Si and a-Si:H by the occurrence of two bands at 520 and 480 cm-1, the ratio of which was found to depend sensitively upon the position of the laser spot on the sample. All experimental results could be consistently explained by assuming the conical precipitates to consist of a-Si:H which was finally proven by coherent electron beam diffraction (CEBD).

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Preferential Sputtering of Ni3Al Single Crystals Studied Using Atom-Probe Field-Ion Microscopy and XPS

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100096813 ◽

1981 ◽

Vol 39 ◽

pp. 16-17

Author(s):

M.P. Thomas ◽

A.R. Waugh ◽

M.J. Southon ◽

Brian Ralph

Keyword(s):

Single Crystals ◽

Photoelectron Spectroscopy ◽

Surface Composition ◽

Depth Profiling ◽

Analytical Techniques ◽

Atom Probe ◽

Probe Field ◽

Preferential Sputtering ◽

Argon Ion Bombardment ◽

Argon Ion

It is well known that ion-induced sputtering from numerous multicomponent targets results in marked changes in surface composition (1). Preferential removal of one component results in surface enrichment in the less easily removed species. In this investigation, a time-of-flight atom-probe field-ion microscope A.P. together with X-ray photoelectron spectroscopy XPS have been used to monitor alterations in surface composition of Ni3Al single crystals under argon ion bombardment. The A.P. has been chosen for this investigation because of its ability using field evaporation to depth profile through a sputtered surface without the need for further ion sputtering. Incident ion energy and ion dose have been selected to reflect conditions widely used in surface analytical techniques for cleaning and depth-profiling of samples, typically 3keV and 1018 - 1020 ion m-2.

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Electron Energy Analysis of Germanium and Silica Layers on Silicon Substrates

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100114104 ◽

1975 ◽

Vol 33 ◽

pp. 96-97

Author(s):

R. W. Ditchfield ◽

A. G. Cullis

Keyword(s):

Epitaxial Growth ◽

Electron Energy ◽

Silicon Substrates ◽

Secondary Phases ◽

Si Substrates ◽

Transmission Electron ◽

Layer Structures ◽

Si Films ◽

Electron Energy Loss ◽

Growth Centres

An energy analyzing transmission electron microscope of the Möllenstedt type was used to measure the electron energy loss spectra given by various layer structures to a spatial resolution of 100Å. The technique is an important, method of microanalysis and has been used to identify secondary phases in alloys and impurity particles incorporated into epitaxial Si films.Layers Formed by the Epitaxial Growth of Ge on Si Substrates Following studies of the epitaxial growth of Ge on (111) Si substrates by vacuum evaporation, it was important to investigate the possible mixing of these two elements in the grown layers. These layers consisted of separate growth centres which were often triangular and oriented in the same sense, as shown in Fig. 1.

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Growth of near noble metal Pd and Pt thin film silicides morphology and structure

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100112464 ◽

1984 ◽

Vol 42 ◽

pp. 498-499

Author(s):

E. I. Alessandrini ◽

M. O. Aboelfotoh

Keyword(s):

Noble Metals ◽

Annealing Temperature ◽

Chemical Compounds ◽

Barrier Properties ◽

Solid State Reactions ◽

Transmission Electron ◽

Stable Chemical ◽

Metal Thickness ◽

Amorphous Si ◽

Si Films

Considerable interest has been generated in solid state reactions between thin films of near noble metals and silicon. These metals deposited on Si form numerous stable chemical compounds at low temperatures and have found applications as Schottky barrier contacts to silicon in VLSI devices. Since the very first phase that nucleates in contact with Si determines the barrier properties, the purpose of our study was to investigate the silicide formation of the near noble metals, Pd and Pt, at very thin thickness of the metal films on amorphous silicon.Films of Pd and Pt in the thickness range of 0.5nm to 20nm were made by room temperature evaporation on 40nm thick amorphous Si films, which were first deposited on 30nm thick amorphous Si3N4 membranes in a window configuration. The deposition rate was 0.1 to 0.5nm/sec and the pressure during deposition was 3 x 10 -7 Torr. The samples were annealed at temperatures in the range from 200° to 650°C in a furnace with helium purified by hot (950°C) Ti particles. Transmission electron microscopy and diffraction techniques were used to evaluate changes in structure and morphology of the phases formed as a function of metal thickness and annealing temperature.

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