Pore Characteristics of Low-Dielectric-Constant Films Grown by Plasma-Enhanced Chemical Vapor Deposition Studied by Positron Annihilation Lifetime Spectroscopy

2001 ◽  
Vol 40 (Part 2, No. 4B) ◽  
pp. L414-L416 ◽  
Author(s):  
Ryoichi Suzuki ◽  
Toshiyuki Ohdaira ◽  
Yoshimi Shioya ◽  
Tomomi Ishimaru
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Positron Annihilation ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Positron Annihilation Lifetime Spectroscopy ◽  
Low Dielectric Constant ◽  
Pore Characteristics ◽  
Positron Annihilation Lifetime ◽  
Low Dielectric

Preparation of low dielectric constant F‐doped SiO2 films by plasma enhanced chemical vapor deposition

1996 ◽  
Vol 68 (6) ◽  
pp. 832-834 ◽  
Author(s):  
Sang Woo Lim ◽  
Yukihiro Shimogaki ◽  
Yoshiaki Nakano ◽  
Kunio Tada ◽  
Hiroshi Komiyama
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Dielectric Constant ◽  
Sio2 Films ◽  
Low Dielectric

Low-Dielectric-Constant SiOC(-H) Films Prepared from DMDMS and O2 Precursors by Using Plasma Enhanced Chemical Vapor Deposition

2007 ◽  
Vol 50 (6) ◽  
pp. 1814 ◽  
Author(s):  
Seung Hyung Kim ◽  
R. Navamathavan ◽  
An Soo Jung ◽  
Yong Jun Jang ◽  
Kwang-Man Lee ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Dielectric Constant ◽  
Low Dielectric
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