Dummy-Gate Structure to Improve Turn-on Speed of Silicon-Controlled Rectifier (SCR) Device for Effective Electrostatic Discharge (ESD) Protection

2003 ◽  
Vol 42 (Part 2, No. 11B) ◽  
pp. L1366-L1368
Author(s):  
Ming-Dou Ker ◽  
Kuo-Chun Hsu

Electronics ◽  
2021 ◽  
Vol 10 (4) ◽  
pp. 443
Author(s):  
Mihaela-Daniela Dobre ◽  
Philippe Coll ◽  
Gheorghe Brezeanu

This paper proposes an investigation of a CDM (charge device model) electrostatic discharge (ESD) protection method used in submicronic input–output (I/O) structures. The modeling of the commonly used ESD protection devices as well as the modeling of the breakdown caused by ESD is not accurate using traditional commercial tools, hence the need for test-chip implementation, whenever a new technology node is used in production. The proposed method involves defining, implementing, testing, and concluding on one test-chip structure named generically “CDM ground resistance”. The structure assesses the maximum ground resistance allowed for the considered technology for which CDM protection is assured. The findings are important because they will be actively used as CDM protection for all I/O structures developed in the considered submicronic technology node. The paper will conclude on the constraints in terms of maximum resistance of ground metal track allowed to be CDM protected.



1999 ◽  
Vol 39 (6-7) ◽  
pp. 1143-1148 ◽  
Author(s):  
D. Pogany ◽  
N. Seliger ◽  
M. Litzenberger ◽  
H. Gossner ◽  
M. Stecher ◽  
...  


ETRI Journal ◽  
2009 ◽  
Vol 31 (6) ◽  
pp. 725-731 ◽  
Author(s):  
Yong-Seo Koo ◽  
Kwangsoo Kim ◽  
Shihong Park ◽  
Kwidong Kim ◽  
Jong-Kee Kwon


2017 ◽  
Vol 31 (19-21) ◽  
pp. 1740004 ◽  
Author(s):  
Yibo Jiang ◽  
Hui Bi ◽  
Liangwei Dong ◽  
Qinglong Li

Implementation of Electrostatic Discharge (ESD) protection in Silicon on Insulator (SOI) technology is a challenge because of the inherent properties of poor heat conductor and heat trapping. In this paper, a novel device as ESD clamp is proposed as Fix-Base SOI FinFET clamp which addresses the troublesome problem of floating base. Moreover, its manufacturing process is compatible to the normal SOI process flow well. Finally, a detailed discussion including current density and thermal distribution are presented with the technique of 3D TCAD simulation.



2020 ◽  
Vol 29 (9) ◽  
pp. 098502
Author(s):  
Wenqiang Song ◽  
Fei Hou ◽  
Feibo Du ◽  
Zhiwei Liu ◽  
Juin J. Liou


2020 ◽  
Vol 67 (3) ◽  
pp. 1353-1356
Author(s):  
Feibo Du ◽  
Wenqiang Song ◽  
Fei Hou ◽  
Jizhi Liu ◽  
Zhiwei Liu ◽  
...  
Keyword(s):  
Turn On ◽  


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