Investigation into the Seebeck Coefficient in a Two-Layer Assembly during Laser Short-Pulse Heating

2005 ◽  
Vol 44 (8) ◽  
pp. 6068-6074 ◽  
Author(s):  
Bekir S. Yilbas ◽  
M. Kassas
Author(s):  
B S Yilbas

Laser short-pulse heating of a lead—silicon—gold-layered structure is considered and non-equilibrium equation in the lattice and electron subsystems is formulated using the electron kinetic theory approach. The Seebeck coefficient in the metallic and silicon layers is also formulated. Electron and lattice site temperature rise in the subsystems and the Seebeck coefficients are computed for time exponentially decaying pulse. The study is extended to include the influence of the first layer (lead layer) thickness on temperature rise and the Seebeck coefficients. It is found that the lattice site temperature across the interface of the lead and silicon layers increases sharply. The Seebeck coefficient predicted in the silicon layer is higher than in the metallic layers in the structure.


2011 ◽  
Vol 42 (9-10) ◽  
pp. 601-618 ◽  
Author(s):  
S. Bin Mansoor ◽  
B. S. Yilbas
Keyword(s):  

Author(s):  
B S Yilbas ◽  
A F M Arif

Laser short-pulse heating of solid surfaces results in non-equilibrium energy transport in the region irradiated by the laser beam. Owing to the large temperature gradients in the lattice subsystem, high stress levels develop in the surface region of the substrate material. In the present study, temperature and stress fields in the substrate material are presented for the case of the laser short-pulse heating of gold. Electron kinetic theory and a two-equation heating model are introduced to account for non-equilibrium energy transport during the laser heating pulse. Laser pulses exponentially decaying with time are accommodated in the simulations. It is found that lattice site temperature gradients attain high values inspite of the low magnitude of the lattice site temperature. This, in turn, results in high stress levels in the surface region of the substrate material. Thermal stress is compressive owing to high thermal strain development and low displacement of the surface.


Sign in / Sign up

Export Citation Format

Share Document