Low-Pressure Chemical Vapor Deposition of Semi-insulating Polycrystalline Silicon Thin Films: II. Theoretical Local Analysis of the Process

2001 ◽  
Vol 148 (3) ◽  
pp. C156
Author(s):  
P. Barathieu ◽  
B. Caussat ◽  
E. Scheid ◽  
J. P. Couderc
1987 ◽  
Vol 36 (17) ◽  
pp. 9168-9170 ◽  
Author(s):  
P. X. Zhang ◽  
X. W. Wu ◽  
J. Yao ◽  
S. K. Wong ◽  
P. K. John ◽  
...  

1997 ◽  
Vol 71 (3) ◽  
pp. 359-361 ◽  
Author(s):  
Chau-Hong Kuo ◽  
In-Cha Hsieh ◽  
Dieter K. Schroder ◽  
George N. Maracas ◽  
Sheau Chen ◽  
...  

2017 ◽  
Vol 19 (8) ◽  
pp. 1700193 ◽  
Author(s):  
Mattias Vervaele ◽  
Bert De Roo ◽  
Jolien Debehets ◽  
Marilyne Sousa ◽  
Luman Zhang ◽  
...  

1995 ◽  
Vol 403 ◽  
Author(s):  
J. J. Pedroviejo ◽  
B. Garrido ◽  
J. C. Ferrer ◽  
A. Cornet ◽  
E. Scheid ◽  
...  

AbstractConventional and Rapid Thermal Annealing of Semi-Insulating Polycrystalline Silicon layers obtained by Low Pressure Chemical Vapor Deposition (LPCVD) from disilane Si2H6 have been performed in order to determine the structural modifications induced on the layers by these thermal treatments. The study of these modifications has been carried out by several analysis methods like FTIR, XPS, TEM, RAMAN and ellipsometry. The results obtained are presented, contrasted and discussed in this work.


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