Numerical and Experimental Investigation of Thermomechanical Deformation in High-Aspect-Ratio Electroplated Through-Silicon Vias

2008 ◽  
Vol 155 (12) ◽  
pp. H981 ◽  
Author(s):  
Pradeep Dixit ◽  
Sun Yaofeng ◽  
Jianmin Miao ◽  
John H. L. Pang ◽  
Ritwik Chatterjee ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Through Silicon Vias ◽  
Thermomechanical Deformation ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

scholarly journals Tailoring femtosecond 1.5-μm Bessel beams for manufacturing high-aspect-ratio through-silicon vias

2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Fei He ◽  
Junjie Yu ◽  
Yuanxin Tan ◽  
Wei Chu ◽  
Changhe Zhou ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Bessel Beams ◽  
Through Silicon Vias ◽  
Silicon Vias
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