Study on Abnormally Accelerated Oxidation of Tungsten Plugs during Tungsten Chemical Mechanical Polishing in Semiconductor Manufacturing

2021 ◽  
Author(s):  
Kyungho Hwang ◽  
Yohan Jeon ◽  
Seokjun Hong ◽  
Pengzhan Liu ◽  
Taesung Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Semiconductor Manufacturing ◽  
Mechanical Polishing ◽  
Accelerated Oxidation

Transformation of silica fume into chemical mechanical polishing (CMP) nano-slurries for advanced semiconductor manufacturing

2011 ◽  
Vol 205 (1-3) ◽  
pp. 149-154 ◽  
Author(s):  
M.M. Rashad ◽  
M.M. Hessien ◽  
E.A. Abdel-Aal ◽  
K. El-Barawy ◽  
R.K. Singh
Keyword(s):  
Silica Fume ◽  
Chemical Mechanical Polishing ◽  
Semiconductor Manufacturing ◽  
Mechanical Polishing

scholarly journals Development and Analysis of Double-Faced Radial and Cluster-Arranged CMP Diamond Disk

2014 ◽  
Vol 2014 ◽  
pp. 1-9 ◽  
Author(s):  
M. Y. Tsai ◽  
C. H. Chen ◽  
J. H. Chiang ◽  
T. S. Yeh
Keyword(s):  
Chemical Mechanical Polishing ◽  
Semiconductor Manufacturing ◽  
Production Cost ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Diamond Disk ◽  
Polishing Pad ◽  
Polishing Pads

In semiconductor manufacturing, diamond disks are indispensable for dressing chemical mechanical polishing (CMP) pads. Recently, 450 mm (18 inch) diameter wafers have been used to improve output and reduce wafer production cost. To polish 450 mm diameter wafers, the diameter of polishing pads must be increased to 1050 mm. In particular, because diamond disks are limited to 100 mm diameters, a much greater number of working crystals will be required for dressing a 1050 mm diameter pad. Consequently, new diamond disks must be developed. In this study, novel arrangements are made using a braze in diamond patterns, which are radial with a cluster arrangement of 3-4 grits per cluster. Furthermore, a double-faced combined diamond disk is developed. The polishing pad surface was characterized, and the effect of different diamond conditioners on wafer removal rate was studied. This research aims to develop a more suitable diamond disk for dressing 1050 mm diameter polishing pads.

scholarly journals Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad

2021 ◽  
Vol 11 (10) ◽  
pp. 4358
Author(s):  
Hanchul Cho ◽  
Taekyung Lee ◽  
Doyeon Kim ◽  
Hyoungjae Kim
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Shape Error ◽  
Profile Shape ◽  
Conditioning Process ◽  
Polishing Pad ◽  
Simulation Based ◽  
Diamond Conditioner ◽  
Pad Conditioning ◽  
Good Agreement

The uniformity of the wafer in a chemical mechanical polishing (CMP) process is vital to the ultra-fine and high integration of semiconductor structures. In particular, the uniformity of the polishing pad corresponding to the tool directly affects the polishing uniformity and wafer shape. In this study, the profile shape of a CMP pad was predicted through a kinematic simulation based on the trajectory density of the diamond abrasives of the diamond conditioner disc. The kinematic prediction was found to be in good agreement with the experimentally measured pad profile shape. Based on this, the shape error of the pad could be maintained within 10 μm even after performing the pad conditioning process for more than 2 h, through the overhang of the conditioner.

scholarly journals Non-spherical abrasives with ordered mesoporous structures for chemical mechanical polishing

2021 ◽  
Author(s):  
Peili Gao ◽  
Tingting Liu ◽  
Zhenyu Zhang ◽  
Fanning Meng ◽  
Run-Ping Ye ◽  
...  
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Ordered Mesoporous ◽  
Mesoporous Structures
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