scholarly journals Thick Film Temperature Sensors Using Standard Pastes

1986 ◽  
Vol 12 (2) ◽  
pp. 91-101 ◽  
Author(s):  
I. Janoska ◽  
M. R. Haskard
Keyword(s):  
Aspect Ratio ◽  
Temperature Coefficient ◽  
Thick Film ◽  
Film Industry ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Temperature Coefficient Of Resistance ◽  
Film Resistor ◽  
Dielectric Layers ◽  
Thick Film Resistor

Standard thick film resistor pastes exhibit changes in their electrical characteristics when printed on top of dielectric layers. Of particular interest is the inherent change in their temperature coefficient of resistance. Simple temperature sensors were formed by deliberately printing thick film resistor pastes on top of larger area dielectric layers. Temperature tests carried out on these devices have shown that by selecting the correct paste combination and resistor aspect ratio stable, repeatable, temperature sensors with good linearity can be manufactured. A comparison is made of these sensors to other commercially available products currently used in the thick film industry.

Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor

2010 ◽  
Vol 2010 (1) ◽  
pp. 000752-000759
Author(s):  
Xudong Chen ◽  
W. Kinzy Jones
Keyword(s):  
Electrical Properties ◽  
Temperature Coefficient ◽  
Thick Film ◽  
Glass Frit ◽  
Lead Free ◽  
Temperature Coefficient Of Resistance ◽  
Film Resistor ◽  
Thick Film Resistor ◽  
Glass Compositions ◽  
Free Glass

Glass frit is a major component of thick film resistor (TFR) for the production of hybrid circuits. More than thirty commercial lead-free glass frits with different compositions have been evaluated for developing a lead-free thick film resistor that is compatible with typical industry thick film processing and has comparable electrical properties as the lead bearing counterpart. Two glass compositions were selected out of 33 candidates for preparation of RuO2 based TFR inks, which were screen printed on alumina substrates and fired at 850°C. The preliminary results of these resistors showed that the sheet resistance spanned from 400 ohms per square (Ω/□) to 0.4 mega-ohms per square (MΩ/□) with 5–15% RuO2 and the hot temperature coefficient of resistance (HTCR) fell in a range of ±350ppm/°C.

scholarly journals Microstructural Studies of Ni-P Thick Film Resistor Temperature Sensors

1986 ◽  
Vol 12 (2) ◽  
pp. 127-135 ◽  
Author(s):  
Barbara Holodnik ◽  
Abram Jakubowicz ◽  
Marian Lukaszewicz ◽  
Wolfgang Hauffe
Keyword(s):  
Thick Film ◽  
Electrical Conduction ◽  
Temperature Sensors ◽  
Film Resistor ◽  
Metallic Character ◽  
Thick Film Resistor ◽  
Microstructural Studies

Thick Ni-P films have been widely investigated at our Institute. This article tends to visualize by use of various microscopic methods how the growth and sintering of individual conducting grains, results in the formation of nickel dendrites responsible for the metallic character of electrical conduction.

Thermal Expansion and Laser Trim Stability of Ruthenium Based Thick Film Resistors on Alumina and on Multilayer Dielectric

1982 ◽  
Vol 1 (1) ◽  
pp. 24-27 ◽  
Author(s):  
I. Taitl
Keyword(s):  
Thermal Expansion ◽  
Thick Film ◽  
Chemical Structure ◽  
Coefficient Of Thermal Expansion ◽  
Ruthenium Dioxide ◽  
Theoretical Conclusion ◽  
Film Resistor ◽  
Thick Film Resistor ◽  
The Relationship ◽  
Multilayer Dielectric

Fired resistors exhibit variations which are minimised by abrasive and laser trimming. The latter may cause unstable behaviour which is further aggravated by thermal shock. The chemical structure of a thick film resistor is analysed with respect to mechanical stress, and the theoretical conclusion that the coefficient of thermal expansion of the resistor should be equal to or smaller than that of the substrate is verified experimentally. The thermal behaviour of ruthenium dioxide is examined and a range of CTE values are determined for materials of varying chemical composition. The relationship between CTE and post laser trimming stability is demonstrated on four thick film resistors which differ in thermal expansion. It is pointed out that formulations with high metallic content can absorb tensile stress by elastic deformation, thus minimising the formation or propagation of laser induced cracks.

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