scholarly journals Resistance Switching Characteristics in ZnO-Based Nonvolatile Memory Devices

2013 ◽  
Vol 2013 ◽  
pp. 1-5 ◽  
Author(s):  
Fu-Chien Chiu

Bipolar resistance switching characteristics are demonstrated in Pt/ZnO/Pt nonvolatile memory devices. A negative differential resistance or snapback characteristic can be observed when the memory device switches from a high resistance state to a low resistance state due to the formation of filamentary conducting path. The dependence of pulse width and temperature on set/reset voltages was examined in this work. The exponentially decreasing trend of set/reset voltage with increasing pulse width is observed except when pulse width is larger than 1 s. Hence, to switch the ZnO memory devices, a minimum set/reset voltage is required. The set voltage decreases linearly with the temperature whereas the reset voltage is nearly temperature-independent. In addition, the ac cycling endurance can be over 106switching cycles, whereas, the dependence of HRS/LRS resistance distribution indicates that a significant memory window closure may take place after about 102  dc switching cycles.

2019 ◽  
Vol 41 (3) ◽  
pp. 475-482 ◽  
Author(s):  
Yu-Ting Tsai ◽  
Ting-Chang Chang ◽  
Chao-Cheng Lin ◽  
Lan-Shin Chiang ◽  
Shih-Cheng Chen ◽  
...  

2007 ◽  
Vol 997 ◽  
Author(s):  
Pang Shiu Chen ◽  
Heng-Yuan Lee ◽  
Ching-Chiun Wang ◽  
Ming-Jinn Tsai ◽  
Kou-Chen Liu

AbstractThe materials properties and resistance switching characteristics of hafnium oxide-based binary oxide were investigated for next generation memory device application. A nonstoichometric hafnium oxide (HfOx) film with a mixture structure of monoclinic and tetragonal phase and some metallic Hf-Hf bonds on TiN/Si were prepared by atomic layer chemical vapor deposition (ALCVD). Resistance random access memory devices consisting of Pt/HfOx/TiN/Si with low power operation (< 0.4 mW) and reset current (< 100 mA) were fabricated. The resistance ratio of high resistance state to low resistance state maintains 100∼1000 and after 1000 cycles of repetitively switching. A 1-nm-thick Al2O3 film in the interface between top electrode and HfOx films, the Pt/Al2O3/HfOx/TiN/Si memory devices were found that soft-error of set and reset process often occurred. Interface states in the anode side play an important role in maintaining a stable resistive switching for HfOx-based memory devices.


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