Nano-indentation simulation on mechanical properties and microstructural evolutions of Ni-based single crystal alloy

2018 ◽  
Vol 8 (5) ◽  
pp. 435-442
Author(s):  
Ben Li ◽  
Chao Dong ◽  
Jingui Yu ◽  
Dong Chen ◽  
Qiaoxin Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Nano Indentation ◽  
Single Crystal Alloy

Mechanical Properties and Dislocation Structure of Single Crystal Cdte Deformed in Compression at 300°C

1976 ◽  
Vol 34 ◽  
pp. 592-593
Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Dislocation Structure ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Strain Curve ◽  
Optical Devices ◽  
Semiconductor Compound ◽  
Wide Range ◽  
Sample Orientation

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.

CMSX-2

Alloy Digest ◽  
1992 ◽  
Vol 41 (11) ◽  
Keyword(s):  
Physical Properties ◽  
Single Crystal ◽  
Alloy Development ◽  
Single Crystal Alloy ◽  
High Level

Abstract CMSX-2 is a single crystal alloy development of Cannon-Muskegon Corporation designed to achieve a high level of balanced properties. This datasheet provides information on composition, physical properties, as well ascreep and fatigue. Filing Code: Ni-417. Producer or source: Cannon-Muskegon Corporation.

Elastic Modulus of Pb/Sn Solder Joints in Microelectronics

2002 ◽  
Author(s):  
Cemal Basaran ◽  
Jianbin Jiang
Keyword(s):  
Grain Size ◽  
Elastic Modulus ◽  
Single Crystal ◽  
Solder Alloy ◽  
Ultrasonic Testing ◽  
Heterogeneous Materials ◽  
Testing Methods ◽  
Nano Indentation ◽  
Deformation Kinetics ◽  
Kinetics Of

Young’s modulus (E) values published in literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.

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