A novel high-shear and low-pressure grinding method using specially developed abrasive tools

2020 ◽  
Vol 235 (1-2) ◽  
pp. 166-172
Author(s):  
Yebing Tian ◽  
Linguang Li ◽  
Shuo Fan ◽  
Qianjian Guo ◽  
Xiang Cheng
Keyword(s):  
Tangential Force ◽  
Single Crystal Silicon ◽  
Low Pressure ◽  
Grinding Force ◽  
High Shear ◽  
Abrasive Tool ◽  
Crystal Silicon ◽  
Grinding Method ◽  
Grinding Conditions ◽  
Conventional Grinding

In this work, a novel grinding method using a special abrasive tool was first proposed to achieve high tangential grinding force and low normal grinding force. The abrasive tool was developed with flexible composites to remove workpiece materials under “high-shear and low-pressure” grinding mode. The concept of the high-shear and low-pressure grinding method was introduced in detail. Grinding tests were carried out on a precision grinder with the developed abrasive tool for single crystal silicon specimens. The results showed that the grinding force ratio between tangential force and normal force for the proposed grinding method was ranged between 0.9 and 1.3, which was three times larger than that of the conventional grinding method. It was verified that the developed abrasive tool possessed the grinding characteristics of high tangential grinding force and low normal grinding force. After grinding of silicon specimens for 120 min, the value of surface roughness decreased from 429.20 to 32.91 nm under the selected grinding conditions. The surface quality of the silicon specimens was greatly improved after grinding.

Synthesis of highly oriented, single-crystal silicon nanoparticles in a low-pressure, inductively coupled plasma

2003 ◽  
Vol 94 (3) ◽  
pp. 1969-1974 ◽  
Author(s):  
Ameya Bapat ◽  
Christopher R. Perrey ◽  
Steven A. Campbell ◽  
C. Barry Carter ◽  
Uwe Kortshagen
Keyword(s):  
Single Crystal ◽  
Inductively Coupled Plasma ◽  
Silicon Nanoparticles ◽  
Single Crystal Silicon ◽  
Low Pressure ◽  
Crystal Silicon ◽  
Inductively Coupled ◽  
Oriented Single Crystal

scholarly journals Simulation Analysis of Cluster Effect of High-Shear Low-Pressure Grinding with Flexible Abrasive Tools

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 827
Author(s):  
Chengjin Tian ◽  
Jinguo Han ◽  
Yebing Tian ◽  
Bing Liu ◽  
Zhiqiang Gu ◽  
...  
Keyword(s):  
Simulation Analysis ◽  
Tangential Force ◽  
Shear Thickening ◽  
Low Pressure ◽  
Strong Interactions ◽  
Grinding Wheel ◽  
High Shear ◽  
Abrasive Particles ◽  
Shear Thickening Fluids ◽  
Cutting Effect

Based on the clustering effect of shear-thickening fluids (STFs), a high-shear low-pressure flexible grinding wheel has been developed. In order to explore the material removal mechanism, the coupled Eulerian—Lagrangian (CEL) method is adopted to simulate the novel grinding process. The simulation results show that particle clustering effects do occur at the tangential and bottom positions of the micro-convex peak when it instantaneously strikes the workpiece surface. The particle clusters drive the harder abrasive particles to resist the strong interactions of micro-convex peaks. The micro-convex peaks are removed due to the cutting effect of the harder abrasive particles. Compared with traditional grinding, the ratio of tangential force to normal force for the high-shear low-pressure flexible grinding wheel is improved. The various trends in force ratio are consistent with the experimental results, which verifies the effectiveness of high-shear low-pressure grinding.

Synthesis of Crystalline Silicon Nanoparticles in Low-Pressure Inductive Plasmas

2002 ◽  
Vol 737 ◽  
Author(s):  
Ameya Bapat ◽  
Uwe Kortshagen ◽  
Stephen A. Campbell ◽  
Christopher R. Perrey ◽  
C. Barry Carter
Keyword(s):  
Thin Film ◽  
Thin Film Transistors ◽  
Silicon Nanoparticles ◽  
Crystalline Silicon ◽  
Single Crystal Silicon ◽  
Low Pressure ◽  
Crystal Silicon ◽  
Inductively Coupled ◽  
Low Pressure Plasma ◽  
Energy Conversion Devices

ABSTRACTAmorphous silicon has been used for a wide variety of electronic applications including thin film transistors and energy conversion devices. However, these devices suffer greatly from defect scattering and recombination. A method for depositing crystalline silicon would be highly desirable, especially if it can be remotely created and deposited on any kind of substrate. Our work aims at synthesis and deposition of mono-disperse, single crystal silicon nanoparticles, several tens of nm in diameter on varied substrates. Synthesis of nanocrystals of 2–10 nm diameter has been previously reported but larger particles were amorphous or polycrystalline. This work reports the use of an inductively coupled low-pressure plasma to produce nanocrystals with diameters between 20–80 nm. Electron microscopy studies confirm that the nanocrystals are highly oriented diamond-cubic silicon.

Process Parameters Influence on Semi-Fixed Abrasive Tool Wear

2011 ◽  
Vol 325 ◽  
pp. 251-256
Author(s):  
Qian Fa Deng ◽  
Ping Zhao ◽  
Bing Hai Lv ◽  
Ju Long Yuan ◽  
Zhi Wei Wang
Keyword(s):  
Process Parameters ◽  
Influencing Factor ◽  
Single Crystal Silicon ◽  
Abrasive Tool ◽  
Abrasive Machining ◽  
Advanced Ceramics ◽  
Crystal Silicon ◽  
Abrasive Tools ◽  
Ceramics Industry ◽  
Fixed Abrasive

Abrasive machining is an important process for the manufacturing of advanced ceramics. The demand for advanced ceramics with better quality and higher efficiency presents tremendous challenges for abrasive tools in the advanced ceramics industry. The concept of semi-fixed abrasive machining with a newly developed semi-fixed abrasive tool (SFAT) as machining tool is put forward. This paper presents an experimental investigation for SFAT wear into course of machining single crystal silicon with SFAT. Process parameters (water flow, load and velocity) influencing the SFAT wear are analyzed. Influencing factor of SFAT wear in processing course has been clearly demonstrated.

scholarly journals Effects of Anisotropy on Single Crystal Silicon in Polishing Non-Continuous Surface

Micromachines ◽  
2020 ◽  
Vol 11 (8) ◽  
pp. 742
Author(s):  
Guilian Wang ◽  
Zhijian Feng ◽  
Yahui Hu ◽  
Jie Liu ◽  
Qingchun Zheng
Keyword(s):  
Phase Transformation ◽  
Single Crystal ◽  
Normal Force ◽  
Tangential Force ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Obvious Effect ◽  
Fluctuation Range ◽  
Polishing Force ◽  
Crystallographic Orientations

A molecular dynamics model of the diamond abrasive polishing the single crystal silicon is established. Crystal surfaces of the single crystal silicon in the Y-direction are (010), (011), and (111) surfaces, respectively. The effects of crystallographic orientations on polishing the non-continuous single crystal silicon surfaces are discussed from the aspects of surface morphology, displacement, polishing force, and phase transformation. The simulation results show that the Si(010) surface accumulates chips more easily than Si(011) and Si(111) surfaces. Si(010) and Si(011) workpieces are deformed in the entire pore walls on the entry areas of pores, while the Si(111) workpiece is a local large deformation on entry areas of the pores. Comparing the recovery value of the displacement in different workpieces, it can be seen that the elastic deformation of the A side in the Si(011) workpiece is larger than that of the A side in other workpieces. Pores cause the tangential force and normal force to fluctuate. The fluctuation range of the tangential force is small, and the fluctuation range of the normal force is large. Crystallographic orientations mainly affect the position where the tangential force reaches the maximum and minimum values and the magnitude of the decrease in the tangential force near the pores. The position of the normal force reaching the maximum and minimum values near the pores is basically the same, and different crystallographic orientations have no obvious effect on the drop of the normal force, except for a slight fluctuation in the value. The high-pressure phase transformation is the main way to change the crystal structure. The Si(111) surface is the cleavage surface of single crystal silicon, and the total number of main phase transformation atoms on the Si(111) surface is the largest among the three types of workpieces. In addition, the phase transformation in Si(010) and Si(011) workpieces extends to the bottom of pores, and the Si(111) workpiece does not extend to the bottom of pores.

Effects of Different Types of Grinding Fluids on Grinding Force with a Semi-Empirical Based Model

2015 ◽  
Vol 809-810 ◽  
pp. 3-8 ◽  
Author(s):  
Guo Xu Yin ◽  
Ioan D. Marinescu ◽  
Michael Weismiller
Keyword(s):  
Process Parameters ◽  
Sliding Friction ◽  
Tangential Force ◽  
Grinding Force ◽  
Force Model ◽  
Grinding Process ◽  
Grinding Conditions ◽  
Force Components ◽  
Semi Empirical ◽  
Sliding Force

In present paper, a semi-empirical grinding force model is developed combined with the achievements of previous researchers by composing effects of normal and tangential grinding forces in two main parts respectively: cutting force and sliding force. Final equations for the total normal and tangential force components is established. This model is used to predict the total normal and tangential force in the surface grinding. These force components were expressed in terms of the grinding process parameters. There are four unknown coefficients in each equation which can be determined by experiment results at specific conditions with the variations of grinding process parameters. An equation for sliding force is established with the effect of specific sliding energy in terms of the experimental parameters. The average contact pressure and friction coefficient are taken into account. Four different water-based grinding fluids were tested for different specific grinding conditions. Low viscosity grinding fluid can have better performance than the high viscosity one due to the higher useful flow in the grinding contact area. The calculated normal and tangential grinding results are compared with the experimental ones. The verifications show that deviations can be affected by the performance of the fluid at heavy grinding conditions due to the sliding friction inside of rolling friction. To have a better agreement with experiment data. Shallow grinding condition is chosen to obtain the modified model.

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