Synthesis of Crystalline Silicon Nanoparticles in Low-Pressure Inductive Plasmas

2002 ◽  
Vol 737 ◽  
Author(s):  
Ameya Bapat ◽  
Uwe Kortshagen ◽  
Stephen A. Campbell ◽  
Christopher R. Perrey ◽  
C. Barry Carter

ABSTRACTAmorphous silicon has been used for a wide variety of electronic applications including thin film transistors and energy conversion devices. However, these devices suffer greatly from defect scattering and recombination. A method for depositing crystalline silicon would be highly desirable, especially if it can be remotely created and deposited on any kind of substrate. Our work aims at synthesis and deposition of mono-disperse, single crystal silicon nanoparticles, several tens of nm in diameter on varied substrates. Synthesis of nanocrystals of 2–10 nm diameter has been previously reported but larger particles were amorphous or polycrystalline. This work reports the use of an inductively coupled low-pressure plasma to produce nanocrystals with diameters between 20–80 nm. Electron microscopy studies confirm that the nanocrystals are highly oriented diamond-cubic silicon.

2003 ◽  
Vol 94 (3) ◽  
pp. 1969-1974 ◽  
Author(s):  
Ameya Bapat ◽  
Christopher R. Perrey ◽  
Steven A. Campbell ◽  
C. Barry Carter ◽  
Uwe Kortshagen

2006 ◽  
Vol 100 (1) ◽  
pp. 013708 ◽  
Author(s):  
Hao-Chih Yuan ◽  
Zhenqiang Ma ◽  
Michelle M. Roberts ◽  
Donald E. Savage ◽  
Max G. Lagally

Nanomaterials ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 1060 ◽  
Author(s):  
Jiaqi Zhang ◽  
Yi Zhang ◽  
Dazheng Chen ◽  
Weidong Zhu ◽  
He Xi ◽  
...  

Bendable single crystal silicon nanomembrane thin film transistors (SiNMs TFTs), employing a simple method which can improve the metal/n-Silicon (Si) contact characteristics by inserting the titanium dioxide (TiO2) interlayer deposited by atomic layer deposition (ALD) at a low temperature (90 °C), are fabricated on ITO/PET flexible substrates. Current-voltage characteristics of titanium (Ti)/insertion layer (IL)/n-Si structures demonstrates that they are typically ohmic contacts. X-ray photoelectron spectroscopy (XPS) results determines that TiO2 is oxygen-vacancies rich, which may dope TiO2 and contribute to a lower resistance. By inserting TiO2 between Ti and n-Si, Ids of bendable single crystal SiNMs TFTs increases 3–10 times than those without the TiO2 insertion layer. The fabricated bendable devices show superior flexible properties. The TFTs, whose electrical properties keeps almost unchanged in 800 cycles bending with a bending radius of 0.75 cm, obtains the durability in bending test. All of the results confirm that it is a promising method to insert the TiO2 interlayer for improving the Metal/n-Si ohmic contact in fabrication of bendable single crystal SiNMs TFTs.


1982 ◽  
Vol 13 ◽  
Author(s):  
N. M. Johnson ◽  
H. C. Tuan ◽  
M. D. Moyer ◽  
M. J. Thompson ◽  
D. K. Biegelsen ◽  
...  

ABSTRACTThin-film transistors (TFT) have been fabricated in scanned CO2 laser-crystallized silicon films on bulk fused silica. In n-channel enhancement-mode transistors, it is demonstrated that an excessively large leakage current can be electric-field modulated with a gate electrode located beneath the silicon layer. This dual-gate configuration provides direct verification on bulk glass substrates of back-channel leakage as has recently been demonstrated for beam-crystallized silicon films on thermal oxides over silicon wafers. With the application of deep-channel ion implantation to suppress back-channel leakage, high-peformance TFTs have been fabricated in single-crystal silicon films on fused silica. The results demonstrate that scanned CO 2 laser processing of silicon films on bulk glass can provide the basis for a silicon-on-insulator technology.


1992 ◽  
Vol 284 ◽  
Author(s):  
Dimitrios N. Kouvatsos ◽  
Ji-Ho Kung ◽  
Miltiadis K. Hatalis ◽  
Ralph J. Jaccodine

ABSTRACTSilicon dioxide films have been grown on polysilicon films at low temperatures in dry ambients by utilizing NF3 - enhanced oxidation, which affords markedly enhanced oxidation kinetics. This facilitates thin film transistor applications, for which low thermal budget processing is essential. The grown oxide films are thicker than corresponding oxides grown on (100) single crystal silicon. Thin film transistors having a polysilicon self-aligned gate structure were fabricated on polycrystalline silicon. The gate oxide films were thermally grown by NF3 -enhanced oxidation at 650°C or 800°C. Electrical characterization of the TFTs having 800°C gate oxides showed on/off current ratios up to 5×107, effective electron mobilities (μneff) of 26 to 38 cm2/Vsec, threshold voltage (VT) values of 0±0.7 V and subthreshold swing (S) values as low as 0.3 V/dec. The devices were stable under dc electrical stressing at a field of 3 MV/cm. Further, the source to drain current activation energy was determined as a function of the gate voltage. The 650°C gate oxide TFTs exhibited on/off current ratio of 105, VT of 3.5 V, Uneffof10 cm2/V.sec and S of 0.7 V/dec.


2006 ◽  
Vol 27 (6) ◽  
pp. 460-462 ◽  
Author(s):  
Jong-Hyun Ahn ◽  
Hoon-Sik Kim ◽  
Keon Jae Lee ◽  
Zhengtao Zhu ◽  
E. Menard ◽  
...  

1996 ◽  
Vol 32 (8) ◽  
pp. 775 ◽  
Author(s):  
D.N. Kouvatsos ◽  
D. Tsoukalas ◽  
G.T. Sarcona ◽  
M.K. Hatalis ◽  
J. Stoemenos

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