Analysis of the compression behavior of an E-glass composite pipe after aging in water

2019 ◽  
Vol 28 (8-9) ◽  
pp. 523-529
Author(s):  
José RM d’Almeida ◽  
Leonardo M Ottolini

E-glass-reinforced composite pipes are being increasingly used in petrochemical facilities. After years of contact with the fluid being transported, the mechanical integrity of the pipes can be compromised, and their failure mode can be altered. This work analyzes the effect of temperature and pressure on the compressive behavior of an E-glass pipe after exposure to water. The results indicate that temperature causes more damage than pressure on the mechanical response of the composite. A macroscopic damage parameter quantified the effect on the mechanical behavior of the composite. Surface gloss changes were also correlated with the effects caused by aging.

2020 ◽  
Vol 117 ◽  
pp. 107965
Author(s):  
M.Yu. Petrushina ◽  
E.S. Dedova ◽  
K.V. Yusenko ◽  
A.S. Portnyagin ◽  
E.K. Papynov ◽  
...  

1952 ◽  
Vol 44 (1) ◽  
pp. 211-212 ◽  
Author(s):  
E. J. Bradbury ◽  
Dorothy McNulty ◽  
R. I. Savage ◽  
E. E. McSweeney

1992 ◽  
Vol 276 ◽  
Author(s):  
D-G. Oei ◽  
S. L. McCarthy

ABSTRACTMeasurements of the residual stress in polysilicon films made by Low Pressure Chemical Vapor Deposition (LPCVD) at different deposition pressures and temperatures are reported. The stress behavior of phosphorus (P)-ion implanted/annealed polysilicon films is also reported. Within the temperature range of deposition, 580 °C to 650 °C, the stress vs deposition temperature plot exhibits a transition region in which the stress of the film changes from highly compressive to highly tensile and back to highly compressive as the deposition temperature increases. This behavior was observed in films that were made by the LPCVD process at reduced pressures of 210 and 320 mTORR. At deposition temperatures below 590 °C the deposit is predominantly amorphous, and the film is highly compressive; at temperatures above 610 °C (110) oriented polycrystalline silicon is formed exhibiting high compressive residual stress.


Nanoscale ◽  
2015 ◽  
Vol 7 (19) ◽  
pp. 8803-8810 ◽  
Author(s):  
Ya. Grosu ◽  
G. Renaudin ◽  
V. Eroshenko ◽  
J.-M. Nedelec ◽  
J.-P. E. Grolier

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