R&D Activities for Nanoscale Manufacturing Processes and Enabling Equipment in Korea

2017 ◽  
pp. 389-396
Author(s):  
Chang-Soo Han ◽  
Jun-Hyuk Choi ◽  
Hak-Joo Lee ◽  
Jae-Jong Lee ◽  
Doo-Sun Choi ◽  
...  
2006 ◽  
pp. 389-396
Author(s):  
Jun-Ho Jeong ◽  
Doo-Sun Choi ◽  
Jun-Hyuk Choi ◽  
Chang-Soo Han ◽  
Hak-Joo Lee ◽  
...  

2006 ◽  
pp. 389-396
Author(s):  
Jun-Ho Jeong ◽  
Doo-Sun Choi ◽  
Jun-Hyuk Choi ◽  
Chang-Soo Han ◽  
Hak-Joo Lee ◽  
...  

Author(s):  
Ashwin Balasubramanian ◽  
Martin B. G. Jun ◽  
Richard E. DeVor ◽  
Shiv G. Kapoor

A piezoelectrically driven, submicron XY-positioning stage with multiprocess capability is developed and then integrated into two micro∕nanoscale manufacturing processes to improve their performance. The design is based on the HexFlex™ mechanism but is modified to improve structural robustness using a combination of factorial design, linear programming, and finite element analysis. Performance analysis reveals travel ranges of 16μm (X-axis) and 8μm (Y-axis), positioning accuracies of 87nm (X-axis) and 92nm (Y-axis), and overall stiffnesses of 32N∕μm (X-axis) and 36N∕μm (Y-axis). A comparison of microfluidic channels manufactured with a micromachine tool (mMT) alone and with the stage stacked on the mMT shows an improvement in feature accuracy from 870nmto170nm. The stage is integrated with an electrochemical deposition setup. Nanowire structures with sharp angles are fabricated. The diameter of these nanowires shows an improvement in uniformity by decreasing the standard deviation of diameter variation from 2.088μmto0.009μm.


TAPPI Journal ◽  
2018 ◽  
Vol 17 (08) ◽  
pp. 437-443
Author(s):  
Lebo Xu ◽  
Jeremy Meyers ◽  
Peter Hart

Coffee edge-wicking testing was conducted on two groups of highly-sized paperboard manufactured at two mills with similar manufacturing processes, but with vastly different local fiber sources. Although the Hercules size test (HST) indicated similar internal size levels between the two types of board, the edge-wicking behavior was noticeably different. Analysis of fiber structure revealed that the board with more edge-wicking had fibers with thicker fiber walls, which kept the fiber lumen more open after pressing and drying on a paper machine. It was demonstrated that liquid penetration through voids between fibers in highly-sized paperboard was limited, because the fiber surface was well protected by the presence of sufficient sizing agent. Nevertheless, freshly exposed fiber walls and lumens at the cut edge of the sheet were not protected by sizing material, which facilitated edge-wicking. The correlation between fiber structure and edge-wicking behavior was highlighted in this work to inspire development of novel sizing strategies that protect the freshly cut edge of the sheet from edge-wicking.


Author(s):  
Pei Y. Tsai ◽  
Junedong Lee ◽  
Paul Ronsheim ◽  
Lindsay Burns ◽  
Richard Murphy ◽  
...  

Abstract A stringent sampling plan is developed to monitor and improve the quality of 300mm SOI (silicon on insulator) starting wafers procured from the suppliers. The ultimate goal is to obtain the defect free wafers for device fabrication and increase yield and circuit performance of the semiconductor integrated circuits. This paper presents various characterization techniques for QC monitor and examples of the typical defects attributed to wafer manufacturing processes.


Author(s):  
Camelia Hora ◽  
Stefan Eichenberger

Abstract Due to the development of smaller and denser manufacturing processes most of the hardware localization techniques cannot keep up satisfactorily with the technology trend. There is an increased need in precise and accurate software based diagnosis tools to help identify the fault location. This paper describes the software based fault diagnosis method used within Philips, focusing on the features developed to increase its accuracy.


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