Study on Effect of Tool Wear on Drilled Hole Quality of Printed Circuit Boards

2017 ◽  
Vol 2017.54 (0) ◽  
pp. F043
Author(s):  
Hiroki KAWAHARA ◽  
Hiromi YOSHIMURA ◽  
Masahide WATANABE
Keyword(s):  
Tool Wear ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Hole Quality ◽  
Printed Circuit

scholarly journals Development of a Physical Separation Route for the Concentration of Base Metals from Old Wasted Printed Circuit Boards

Minerals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1014
Author(s):  
Pedro Jorge Walburga Keglevich de Buzin ◽  
Weslei Monteiro Ambrós ◽  
Irineu Antônio Schadach de Brum ◽  
Rejane Maria Candiota Tubino ◽  
Carlos Hoffmann Sampaio ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Preliminary Evidence ◽  
Composition Analysis ◽  
Base Metals ◽  
Circuit Boards ◽  
Physical Separation ◽  
Printed Circuit ◽  
Processing Circuit

Wastes from old electronic devices represent a significant part of the electronic scrap generated in developing countries, being commonly sold by collectors as low-value material to recycling hubs abroad. Upgrading the quality of this waste type could drive the revenue of recyclers, and thus, boost the recycling market. On this basis, this study investigated the possibility of concentrating metals from old wasted printed circuit boards through a physical separation-based route. Preparation of samples comprised fragmentation, size classification, density, and magnetic separation steps, followed by chemical and macro composition analysis. Cu, Al, Fe, and Sn constituted the major metals encountered in the scraps, including some peak concentrations of Zn, Sb, Pb, Ba, and Mn. Four distinct concentrate products could be obtained after suitable processing: (a) a light fraction composed of plastics and resins; (b) an aluminum concentrate; (c) a magnetic material concentrate, containing mainly iron; (d) a final concentrate containing more than 50% in mass of copper and enriched with nonferrous metals. Preliminary evidence showed that further processes, like the separation of copper wires through drumming, can potentially improve the effectiveness of the proposed processing circuit and should guide future works.

scholarly journals THE QUALITY CONTROL OF PLATED-THROUGH HOLES OF PRINTED CIRCUIT BOARDS BY PULSED LASER HEATING

2021 ◽  
Vol 3 (65) ◽  
pp. 96-102
Author(s):  
Vyacheslav A. Sergeev ◽  
◽  
Maksim Y. Salnikov ◽  
Azat M. Nizametdinov ◽  
◽  
...  
Keyword(s):  
Quality Control ◽  
Temperature Measurement ◽  
Printed Circuit Boards ◽  
Heat Removal ◽  
Thermal Control ◽  
Contact Method ◽  
Circuit Boards ◽  
Ir Camera ◽  
Printed Circuit

The article gives a brief overview of standard methods of quality control and defect diagnostics of plated-through holes (PTH) of printed circuit boards (PCB) and considers their main disadvantages. It scrutinizes the methods of thermal control, which are reduced to PTH heating and monitoring the temperature. The main disadvantage of common methods is that they require a contact during heating the PTH and temperature measurement, which leads to significant errors and low reliability of control. The article describes a non-contact method involving heating only one side of the PTH by a laser beam and non-contact temperature measurement of the PTH ends by an IR camera. The authors propose a thermal equivalent scheme of PTH to analyze the transient thermal processes in PTH, which takes into account the heat removal from the plating of PTH into the PCB material. It is shown that the quality of plating can be estimated by the temperature difference between the upper (heated) and lower ends of the PTH, and the quality of adhesion between PTH plating and the PCB material can be estimated by the ratio of temperature increments. The article describes peculiarities of this method and gives the results of its testing on a real sample.

Evaluation of Drilled Hole Quality in Printed Circuit Boards

1995 ◽  
Vol 117 (2) ◽  
pp. 248-252 ◽  
Author(s):  
M. N. Srinivasan ◽  
C. L. Hough ◽  
R. W. Bolton ◽  
F. M. Davis
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Drilling Speed ◽  
Circuit Boards ◽  
Hole Quality ◽  
Printed Circuit ◽  
Hole Defects ◽  
Chip Load ◽  
Scanning Electron

The effect of drilling speed and the chip load on the hole quality in a printed circuit board was investigated. The hole defects considered were smear, burr, nail heading and void. Holes drilled with different combinations of the speed and chip load were sectioned and examined using a scanning electron microscope to identify and quantify the defects. Each defect was related to the drilling variables in order to explain the reason for its formation and discuss the broad trends in the relationships.

The tool-wear characteristics of flexible printed circuit board micro-drilling and its influence on micro-hole quality

Circuit World ◽  
2016 ◽  
Vol 42 (4) ◽  
pp. 162-169 ◽  
Author(s):  
Lijuan Zheng ◽  
Chengyong Wang ◽  
Xin Zhang ◽  
Xin Huang ◽  
Yuexian Song ◽  
...  
Keyword(s):  
Tool Wear ◽  
Circuit Board ◽  
Hole Quality ◽  
Content Type ◽  
Wear Characteristics ◽  
Printed Circuit ◽  
Micro Holes ◽  
Micro Drilling ◽  
Micro Hole

Purpose Micro-holes are drilled and plated in flexible printed circuit boards (FPCs) for connecting circuits from different layers. More holes, with diameters smaller than 0.3 mm, are required to be drilled in smaller areas with flexible circuits’ miniaturization. The micro-hole quality of micro-drilling is one of the biggest issues of the flexible circuit manufacturers’ production. However, it is not easy to control the quality of micro-holes. The purpose of this study was to conduct research on the tool wear characteristics of FPC drilling process and its influence on micro-hole quality to improve the micro-hole quality of FPC. Design/methodology/approach The tool-wear characteristics of micro-drills after FPC drilling were observed. The influence of spindle speed, feed rate, number of drilled holes and entry board materials on tool-wear was analyzed. The hole qualities of FPC micro-drilling were measured and observed. The relationship between tool-wear and hole quality was analyzed. Findings The result showed that the tool-wear characteristics of FPC micro-drilling was similar to the tool-wear characteristics of rigid printed circuit board (RPC) micro-drilling. Abrasive wear occurred on both the main cutting edges and the chisel edges of micro-drills, even though there was no glass fiber reinforcing the cloth inside FPC. Resin adhesion was observed on the chisel edge. The influence of feed and number of drilled holes on tool-wear was significant. Tool-wear significantly influences the hole quality of FPC. Tool-wear will largely decrease the hole position accuracy of FPC micro-holes. Tool-wear will increase the thickness of PI nail heads and the height of exit burrs. Fracture was the main difference between tool wear of FPC and RPC micro-drilling. Resin adhesion of RPC was much more severe than FPC micro-drilling. Increasing the spindle speed properly may improve tool life and hole quality. Originality/value The technology and manufacturing of FPC has been little investigated. Research on micro-drilling FPC and research data is lacking so far. The micro-hole quality directly affects the reliability of FPC. Thus, improving the micro-hole quality of FPC is very important.

scholarly journals Comparative assessment of the conditions of direct and electrochemical metallization of blind holes of multilayer printed circuit boards

2019 ◽  
Vol 58 (5) ◽  
pp. 98-104
Author(s):  
Radic R. Latypov ◽  
◽  
Alexandra O. Desyatova ◽  
Sergey V. Golybev ◽  
Larisa N. Maskaeva ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Comparative Assessment ◽  
Copper Coating ◽  
Circuit Board ◽  
Circuit Boards ◽  
Drilling Depth ◽  
Printed Circuit ◽  
Catalyst Layers

The metal blind holes acting as interconnectors allow significantly reduce the number of layers, increase the efficiency of trace and decrease interference between the holes and signal conductors in the high frequency printed circuit boards. In this work, a comparative assessment of the conditions of direct and electrochemical metallization blind holes with diameters: 0,2; 0.25; 0.3; 0.4; 0.6; 0.8; 1.0 mm and a drilling depth of 0.5 mm located on experimental four-layer multilayer printed circuit boards, differing in the method of applying a conductive and copper coating was carried out. It has been established that in case non-fulfillment of mandatory conditions for the production of blind holes, in particular the aspect ratio is less than or equal to unity, incomplete metallization of the walls and especially the bottom of the holes is observed. The ways of combining the processes of direct and electrochemical metallization of holes, which provide the required thickness and quality of the copper coating at reduction of general duration of operations have been proposed based on the experimental data obtained during the work with multilayer printed boards. Also it has been established that the joint placement of blind holes with a smaller and larger diameter on one multilayer printed circuit board requires a more long direct metallization in combination with electrochemical at low values of current density. Copper films deposited on the walls of the holes and on the surface of the contact pads, regardless of the proposed way of metallization, have a highly dispersed structure. The composition of the palladium catalyst layers has been studied by energy dispersive analysis. The conductive coating on the blind hole’s walls contains between 1.55 and 6.77 at.% palladium.

scholarly journals Development of the Digital Site for Chemical Processes in the Manufacturing of Printed Circuit Boards

Inventions ◽  
2021 ◽  
Vol 6 (3) ◽  
pp. 48
Author(s):  
Fedor V. Vasilyev ◽  
Arkadiy M. Medvedev ◽  
Fedor A. Barakovsky ◽  
Maksim A. Korobkov
Keyword(s):  
Process Parameters ◽  
Printed Circuit Boards ◽  
Chemical Processes ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Digital Production ◽  
System Components ◽  
Digital Methods ◽  
Controllable Process

The article defines digital methods for controlling the quality of chemical processes. An architecture of a digital production line, which ensures the distribution of the computational load between the system components, is proposed. We considered the process of developing a prototype of a digital production site for servicing the etching operation during which controllable process parameters are determined; both hardware and software structures of the digital site are proposed. Studying the site operability, we determined the relationships between the process parameters, which made it possible to determine the boundaries of the designed system.

scholarly journals Polypropylene Composites Reinforced by Nonmetallic from Waste Printed Circuit Boards Using Spout-Fluid Bed Coating with PP Particles Enhance Fluidization

Polymers ◽  
2021 ◽  
Vol 13 (18) ◽  
pp. 3106
Author(s):  
Man Wu ◽  
Jingxia Jiang ◽  
Cuiping Meng ◽  
Xiude Hu ◽  
Henglai Xie ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Polypropylene Composites ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
Fluid Bed ◽  
Coating Methods ◽  
Ft Ir ◽  
Fluid Bed Coating

Nonmetallic materials recycled from waste printed circuit boards (N-WPCBs) were modified by coating KH-550 in a spout-fluid bed. To improve the effect of the modification, PP particles were used to enhance the fluidization quality of the N-WPCB particles in the coating modification. Then, the modified N-WPCBs were used as fillers to fabricate PP/N-WPCB composites. The method of coating in a spout-fluid bed with PP particles enhanced fluidization and showed the best modification effect compared to other coating methods. The FT-IR and SEM results demonstrated that interfacial bonding between N-WPCBs and PP could be enhanced by modified N-WPCBs, which improved the mechanical properties of the composites. When the mass ratio of PP to N-WPCBs is 100:75 and the dose of KH-550 is 4 phr, the flexural strength, tensile strength, and impact strength of the composites increase by 16.60%, 23.22%, and 23.64%, respectively. This would realize the high-value utilization of N-WPCBs with coating modification in the spout-fluid bed.

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