E32 Effect of the grain depth of cut on cross sectional profile :Theoretical analysis of ground surface roughness

Roughness is important criterion of ground surface. When the surface roughness is demanded to be smooth, it is required to make the grinding conditions optimum. To optimize the grinding conditions, relationship between grinding conditions and ground surface roughness must be known. Therefore, it has been attempted to reveal the effect of grinding conditions on the roughness of ground surface over the years. From previous researches, it becomes possible to estimate the ground surface roughness with statistical grinding theory. However, there are some parameters, such as wheel depth of cut and distribution of abrasive grain, are not factored in the theory. In this paper, fundamental research on cross sectional profile is carried out to consider the relationship between the wheel depth of cut and ground surface roughness.

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Control of Nano-Topography on an Axisymmetric Ground Surface

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.389-390.96 ◽

2008 ◽

Vol 389-390 ◽

pp. 96-101 ◽

Cited By ~ 4

Author(s):

Nobuhito Yoshihara ◽

Ji Wang Yan ◽

Tsunemoto Kuriyagawa

Keyword(s):

Evaluation Criteria ◽

Ground Surface ◽

Maximum Height ◽

Cross Sectional ◽

Form Accuracy ◽

Optical Instruments ◽

Aspherical Lens ◽

Cross Sectional Profile ◽

Sectional Profile ◽

20 Nm

The use of aspherical optical parts has become common as optical instruments are becoming smaller with and are achieving higher resolution. Nano-order roughness and high-precision shapes are simultaneously required for the surface of aspherical optical parts. At present, form accuracy of the aspherical lens becomes less than 50 nm, and the maximum height roughness becomes less than 20 nm. These values of form accuracy and maximum height roughness satisfy the requirement for most precision optical parts. However, nano-topography, which causes grinding marks and deteriorates accuracy of optical parts, is generated on the ground surface. Conventional evaluation criteria such as form accuracy and surface roughness cannot estimate the nano-topography. In the present paper, the cross sectional profile of the axisymmetric ground surface is calculated in order to estimate the distribution of the nano-topography. As a result, the possibility of control of the nano-topography distribution is confirmed. In addition, controlling the amplitude of nano-topography is easier than controlling the distribution of nano-topography.

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Experimental Investigation on Effects of Depth of Cut on Micro-Geometric Properties in Quick-Point Grinding

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.359-360.103 ◽

2007 ◽

Vol 359-360 ◽

pp. 103-107

Author(s):

Shi Chao Xiu ◽

Chang He Li ◽

Guang Qi Cai

Keyword(s):

Surface Roughness ◽

Point Contact ◽

Ground Surface ◽

Depth Of Cut ◽

Grinding Wheel ◽

Abrasive Wheel ◽

Geometric Properties ◽

Edge Contact ◽

Contact Width ◽

Ground Surface Roughness

Quick-point grinding is used to machine the round surface with super abrasive wheel at high grinding speed. Because it is point contact between the grinding wheel and the workpiece due to the point grinding angles in the process, the grinding model is different from the conventional cylindrical grinding in theory. Especially, the edge contact width between the wheel and the workpiece is not always equal to the thickness of the wheel, but rests with the depth of cut and the grinding angles greatly. The depth of cut has the effects on the micro-geometric properties especially the ground surface roughness by means of the variations of the edge contact width, the grinding force and heat in the process. Based on the theoretical studies on the surface roughness, the quick-point grinding experiments and the measures for the surface roughness were performed at different depth of cut. The effective mechanism of the depth of cut on the ground surface roughness was analyzed deeply. Some conclusions to influence surface roughness were also gained.

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Effect of the Abrasive Grain Distribution on Ground Surface Roughness

International Journal of Automation Technology ◽

10.20965/ijat.2022.p0038 ◽

2022 ◽

Vol 16 (1) ◽

pp. 38-42

Author(s):

Nobuhito Yoshihara ◽

◽

Haruki Takahashi ◽

Masahiro Mizuno

Keyword(s):

Surface Roughness ◽

Theoretical Analysis ◽

Grain Shape ◽

Ground Surface ◽

Clear Understanding ◽

Abrasive Grain ◽

Grinding Conditions ◽

Grain Distribution ◽

Ground Surface Roughness ◽

The Relationship

In order to reduce the grinding surface roughness, it is necessary to optimize the grinding conditions; this requires clear understanding of the relationship between the grinding conditions and ground surface roughness. Therefore, various studies have been carried out over the decades on the ground surface roughness and have proposed statistical grinding theory to define the relationship between the grinding conditions and ground surface roughness. However, the statistical grinding theory does not consider a few grinding conditions such as abrasive grain shape and distribution of abrasive grain, which affect the ground surface roughness. In this study, we construct a statistical grinding theory that considers the effect of abrasive grain distribution and improves the accuracy of the theoretical analysis of the ground surface roughness.

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A Cross-sectional Profile Based Model for Stripline Conductor Surface Roughness

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI) ◽

10.1109/emcsi38923.2020.9191620 ◽

2020 ◽

Author(s):

Shaohui Yong ◽

Victor Khilkevich ◽

Yuanzhuo Liu ◽

Ruijie He ◽

Yuandong Guo ◽

...

Keyword(s):

Surface Roughness ◽

Cross Sectional ◽

Conductor Surface ◽

Cross Sectional Profile ◽

Sectional Profile

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Study on Effects of Grinding Speed on Finish and Precision Machining in Quick-Point Grinding

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.364-366.696 ◽

2007 ◽

Vol 364-366 ◽

pp. 696-700

Author(s):

Shi Chao Xiu ◽

Suo Xian Yuan ◽

Chang He Li ◽

Guang Qi Cai

Keyword(s):

Surface Roughness ◽

Point Contact ◽

Ground Surface ◽

Precision Machining ◽

Depth Of Cut ◽

Grinding Wheel ◽

Workpiece Surface ◽

Influencing Mechanism ◽

Grinding Speed ◽

Ground Surface Roughness

According to the analysis in theory, the model of quick-point grinding is different from conventional cylindrical grinding because it is point contact between the grinding wheel and the workpiece due to the point-grinding angles in two directions and the lower grain depth of cut in the process. Especially, the grinding speed has the great effects on the micro-geometry properties and the machining precision of the workpiece surface in the process. Based on the theoretical studies on the surface roughness, the grinding experiments and the measurements of the surface roughness at high grinding speeds were performed in quick-point grinding process. Furthermore, the influencing mechanism of the grinding speed on the ground surface roughness was analyzed. Some conclusions of the grinding parameters influencing precision machining and surface integrity were deduced.

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X-Ray Replication of Submicrometer Linewidth Patterns

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100078250 ◽

1977 ◽

Vol 35 ◽

pp. 136-137

Author(s):

Henry I. Smith ◽

D.C. Flanders

Keyword(s):

Electron Beam Lithography ◽

Cross Sectional ◽

X Ray ◽

Electron Backscattering ◽

Spatial Frequencies ◽

Cross Sectional Profile ◽

Carbon Foils ◽

Sectional Profile ◽

And Control ◽

Soft Radiation

Scanning electron beam lithography has been used for a number of years to write submicrometer linewidth patterns in radiation sensitive films (resist films) on substrates. On semi-infinite substrates, electron backscattering severely limits the exposure latitude and control of cross-sectional profile for patterns having fundamental spatial frequencies below about 4000 Å(l),Recently, STEM'S have been used to write patterns with linewidths below 100 Å. To avoid the detrimental effects of electron backscattering however, the substrates had to be carbon foils about 100 Å thick (2,3). X-ray lithography using the very soft radiation in the range 10 - 50 Å avoids the problem of backscattering and thus permits one to replicate on semi-infinite substrates patterns with linewidths of the order of 1000 Å and less, and in addition provides means for controlling cross-sectional profiles. X-radiation in the range 4-10 Å on the other hand is appropriate for replicating patterns in the linewidth range above about 3000 Å, and thus is most appropriate for microelectronic applications (4 - 6).

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Bonding widths of Deposited Polymer Strands in Additive Manufacturing

Materials ◽

10.3390/ma14040871 ◽

2021 ◽

Vol 14 (4) ◽

pp. 871

Author(s):

Cheng Luo ◽

Manjarik Mrinal ◽

Xiang Wang ◽

Ye Hong

Keyword(s):

Polymer Melt ◽

Acrylonitrile Butadiene Styrene ◽

High Viscosity ◽

Numerical Results ◽

Fused Filament Fabrication ◽

Cross Sectional ◽

Nozzle Height ◽

Special Cases ◽

Cross Sectional Profile ◽

Sectional Profile

In this study, we explore the deformation of a polymer extrudate upon the deposition on a build platform, to determine the bonding widths between stacked strands in fused-filament fabrication. The considered polymer melt has an extremely high viscosity, which dominates in its deformation. Mainly considering the viscous effect, we derive analytical expressions of the flat width, compressed depth, bonding width and cross-sectional profile of the filament in four special cases, which have different combinations of extrusion speed, print speed and nozzle height. We further validate the derived relations, using our experimental results on acrylonitrile butadiene styrene (ABS), as well as existing experimental and numerical results on ABS and polylactic acid (PLA). Compared with existing theoretical and numerical results, our derived analytic relations are simple, which need less calculations. They can be used to quickly predict the geometries of the deposited strands, including the bonding widths.

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