scholarly journals Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

2016 ◽  
Vol 3 (3) ◽  
pp. 16-00081-16-00081 ◽  
Author(s):  
Noritake HIYOSHI
Keyword(s):  
Fatigue Life ◽  
Low Temperatures ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Evaluation ◽  
Creep Fatigue ◽  
Fatigue Life Evaluation ◽  
Free Solder

scholarly journals Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

2008 ◽  
Vol 72 (3) ◽  
pp. 244-248 ◽  
Author(s):  
Tomotake Tohei ◽  
Ikuo Shohji ◽  
Keisuke Yoshizawa ◽  
Masaharu Nishimoto ◽  
Takayuki Kawano ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Chip Size ◽  
Fatigue Life Evaluation ◽  
Free Solder

A new creep–fatigue life model of lead-free solder joint

2015 ◽  
Vol 55 (7) ◽  
pp. 1097-1100 ◽  
Author(s):  
Yongxin Zhu ◽  
Xiaoyan Li ◽  
Chao Wang ◽  
Ruiting Gao
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Life Model ◽  
Free Solder

scholarly journals OSO204 EBSD Study of Creep-Fatigue Crack Propagation in Lead Free Solder

2011 ◽  
Vol 2011 (0) ◽  
pp. _OS0204-1_-_OS0204-3_
Author(s):  
Keisuke TANAKA ◽  
Yusuke SAKAGAWA ◽  
Ryuji SHIBUE ◽  
Kazunari FUJIYAMA
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder ◽  
Creep Fatigue Crack

scholarly journals Effect of Load Waveform on Creep-Fatigue Crack Propagation in Lead-Free Solder

2010 ◽  
Vol 59 (11) ◽  
pp. 833-839 ◽  
Author(s):  
Keisuke TANAKA ◽  
Takuya HIRASAWA ◽  
Yusuke SAKAGAWA ◽  
Kazunari FUJIYAMA
Keyword(s):  
Fatigue Crack ◽  
Crack Propagation ◽  
Fatigue Crack Propagation ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Free Solder ◽  
Creep Fatigue Crack

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

2011 ◽  
Author(s):  
Takahiro Akutsu ◽  
Qiang Yu
Keyword(s):  
Grain Size ◽  
Fatigue Crack ◽  
Fatigue Life ◽  
Solder Joint ◽  
Crack Propagation ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Micro Structure ◽  
Free Solder

This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author’s group have studied the Manson-Coffin’s law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu-Ni solder, because this solder is attracted from the aspect of the decrease of solder leach in the flow process and material cost. However, even if the same loading is given to the solder joints of BGA test piece, there was a large dispersion in the fatigue life. Even though the effect of the shape difference has been considered, the range of the dispersion could not been explained sufficiently. In the study, the fatigue crack propagation modes in the solder joints were investigated, and an internal fatigue crack mode and an interfacial fatigue crack mode were confirmed. And the tendency of a shorter on fatigue life in the interfacial fatigue mode was confirmed. To clarify the mechanism of these fatigue crack modes, the crystal grain size in the solder joints was investigated before the fatigue test and also after the test. Furthermore, the verification of the mechanism using FEM models considering the crystal grain size was carried out. First of all, each element in FEM models matching to the average crystal grain size was made. Second, the inelastic strain ranges in each FEM models were studied. As a result, it was shown that the influence of the crude density of the crystal grain to the fatigue crack progress can be evaluated. In addition, the micro structure of the solder joint of large-scale electronic devices is observed, and FEM model was made based on the observation result. As a result, it was shown that the influence of the directionality with the crystal grain to the fatigue crack progress can be evaluated.

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