Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

2007 ◽  
Author(s):  
Ilho Kim ◽  
Soon-Bok Lee
Keyword(s):  
Fatigue Life ◽  
Lead Free ◽  
Lead Free Solder ◽  
Mechanical Loads ◽  
Life Evaluation ◽  
Fatigue Life Evaluation ◽  
Free Solder

scholarly journals Thermal Fatigue Life Evaluation of Lead-Free Solder Joint of Chip Size Package with Underfill

2008 ◽  
Vol 72 (3) ◽  
pp. 244-248 ◽  
Author(s):  
Tomotake Tohei ◽  
Ikuo Shohji ◽  
Keisuke Yoshizawa ◽  
Masaharu Nishimoto ◽  
Takayuki Kawano ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Life Evaluation ◽  
Chip Size ◽  
Fatigue Life Evaluation ◽  
Free Solder

Effect of Micro Structure on Fatigue Characteristics of Lead Free Solder Joints

2011 ◽  
Author(s):  
Takahiro Akutsu ◽  
Qiang Yu
Keyword(s):  
Grain Size ◽  
Fatigue Crack ◽  
Fatigue Life ◽  
Solder Joint ◽  
Crack Propagation ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Micro Structure ◽  
Free Solder

This paper presents the influence of the micro structure on the crack propagation in lead free solder joint. The author’s group have studied the Manson-Coffin’s law for lead free solder joint by using the isothermal fatigue test and FEM analytical approaches to establish the practicable evaluation of thermal fatigue life of solder joints, for example, for the Sn-Cu-Ni solder, because this solder is attracted from the aspect of the decrease of solder leach in the flow process and material cost. However, even if the same loading is given to the solder joints of BGA test piece, there was a large dispersion in the fatigue life. Even though the effect of the shape difference has been considered, the range of the dispersion could not been explained sufficiently. In the study, the fatigue crack propagation modes in the solder joints were investigated, and an internal fatigue crack mode and an interfacial fatigue crack mode were confirmed. And the tendency of a shorter on fatigue life in the interfacial fatigue mode was confirmed. To clarify the mechanism of these fatigue crack modes, the crystal grain size in the solder joints was investigated before the fatigue test and also after the test. Furthermore, the verification of the mechanism using FEM models considering the crystal grain size was carried out. First of all, each element in FEM models matching to the average crystal grain size was made. Second, the inelastic strain ranges in each FEM models were studied. As a result, it was shown that the influence of the crude density of the crystal grain to the fatigue crack progress can be evaluated. In addition, the micro structure of the solder joint of large-scale electronic devices is observed, and FEM model was made based on the observation result. As a result, it was shown that the influence of the directionality with the crystal grain to the fatigue crack progress can be evaluated.

A new creep–fatigue life model of lead-free solder joint

2015 ◽  
Vol 55 (7) ◽  
pp. 1097-1100 ◽  
Author(s):  
Yongxin Zhu ◽  
Xiaoyan Li ◽  
Chao Wang ◽  
Ruiting Gao
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Creep Fatigue ◽  
Life Model ◽  
Free Solder

RELIABILITY EVALUATION OF BGA SOLDER JOINTS DURING ACCELERATED LIFE TEST

2006 ◽  
Vol 20 (25n27) ◽  
pp. 4553-4558
Author(s):  
OUK SUB LEE ◽  
NO HOON MYOUNG ◽  
DONG HYEOK KIM ◽  
MAN JAE HUR ◽  
SI WOON HWANG
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Coefficient Of Thermal Expansion ◽  
Accelerated Life Test ◽  
Lead Free ◽  
Lead Free Solder ◽  
Metal Fatigue ◽  
Mechanical Loads ◽  
Free Solder

The use of BGA (Ball Grid Array) interconnects utilizing the lead-free solder joint has grown rapidly because of its small volume and diversity of application. Thus, it requires the continuous quantification and refinement of lead-free solder joint reliability. The lead-free solder creep and cyclically applied mechanical loads cause metal fatigue on the lead-free solder joint which inevitably leads to an electrical discontinuity. In the field application, BGA solder joints experience mechanical loads during temperature changes caused by power up/down events as the result of the CTE (Coefficient of Thermal Expansion) mismatch between the substrate and the Si die. In this paper, extremely small resistance changes at joint area corresponding to through-cracks generated by thermal fatigue were measured. In this way, the failure was defined in terms of anomalous changes in electrical resistance of the joint. Furthermore the reliability of BGA solder joints in thermal cycling is evaluated by using the modified coffin-Manson criterion which may define and distinguish failure. Any change in circuit resistance according to the accumulated damage induced by the thermal cycling in the joint was recorded and evaluated in order to quantitate reliability of solder joint.

Effect of Void on Fatigue Life of Lead-Free Solder Joints

2002 ◽  
Vol 2002 (0) ◽  
pp. 9-10
Author(s):  
Ken KAMINISHI ◽  
Yukihiro KAWAMURA ◽  
Motoharu TANEDA ◽  
Hirohide KAIDA
Keyword(s):  
Fatigue Life ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Free Solder

Thermal Fatigue Life Estimation of Lead-Free Solder Using Inelastic Constitutive Model

2002 ◽  
Vol 2002.6 (0) ◽  
pp. 283-284
Author(s):  
Hiroyuki TAKAHASHI ◽  
Takashi KAWAKAMI ◽  
Minoru MUKAI ◽  
Mineo KOBAYASHI ◽  
Nobutada OHNO ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Constitutive Model ◽  
Thermal Fatigue ◽  
Lead Free ◽  
Lead Free Solder ◽  
Life Estimation ◽  
Thermal Fatigue Life ◽  
Fatigue Life Estimation ◽  
Free Solder
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