Reflectance and durability of Ag mirrors coated with thin layers of Al_2O_3 plus reactively deposited silicon oxide

1975 ◽  
Vol 14 (11) ◽  
pp. 2639 ◽  
Author(s):  
G. Hass ◽  
J. B. Heaney ◽  
H. Herzig ◽  
J. F. Osantowski ◽  
J. J. Triolo
Keyword(s):  
e-Polymers ◽  
2009 ◽  
Vol 9 (1) ◽  
Author(s):  
Guido Scavia ◽  
William Porzio ◽  
Silvia Destri ◽  
Alberto Giacometti Schieroni ◽  
Fabio Bertini

AbstractThe morphology and structure of the overlying poly(3-hexylthiophene) (P3HT) layer onto differently silanized silicon oxide has been studied by Atomic Force Microscopy (AFM) and X-Ray Diffraction (XRD) techniques. By increasing the silanizer alkyl chain length, the layer morphology evolves from a filament like to globular needle like as a consequence of the different SAM organization, while the P3HT conformation remains edge-on. For each case the effect of the annealing temperature has been studied. For all the cases a particular attention has been paid to the first thin layers close to the interface P3HT/SiOx. The effect of a polar substituent and presence of aromatic ring has been also studied.


Author(s):  
Shenda M. Baker ◽  
W. Stephen Kolthammer ◽  
Johannes B. Tan ◽  
Gregory S. Smith

AbstractSynthetic lipid bilayers are excellent mimics of cell membranes. In order to experimentally access these thin layers and oriented proteins in membranes, suitable supports which allow for membrane fluidity while assuring membrane stability need to be developed. Nanoporous polymer templates created from the natural phase segregation of immiscible diblock copolymers are uniform arrays with pore sizes naturally on the scale of macromolecules, tens of nanometers, and grain sizes currently on the order of microns. We study the suitability of such templates, appropriately treated to present a hydrophilic surface, as substrates for lipid bilayers with scanning force microscopy and neutron reflectometry. In the process, we use tip deflection curves to establish simple criteria for determining the presence of a lipid layer on the substrates. Gold coated porous polymers and silicon oxide templates in silicon both appear to be suitable support materials.


2011 ◽  
Vol 1321 ◽  
Author(s):  
E. Agocs ◽  
P. Petrik ◽  
M. Fried ◽  
A. G. Nassiopoulou

ABSTRACTWe have developed optical models for the characterization of grain size in nanocrystal thin films embedded in SiO2 and fabricated using low pressure chemical vapor deposition of Si from silane on a quartz substrate, followed by thermal oxidation. The as-grown nanocrystals thin film on quartz was composed of a two-dimensional array of Si nanocrystals (Si-NC) showing columnar structure in the z-direction and touching each other in the x-y plane. The nanocrystal size in the z-direction was equal to the Si nanocrystal film thickness, changing by the deposition time, while their x-y size was almost equal in all the samples, with small size dispersion. After high temperature thermal oxidation, a thin silicon oxide film was formed on top of the nanocrystals layer. The aim of this work was to measure the grain size and the nanocrystallinity of the Si nanocrystal thin films, a quantity related to the change of the dielectric function. We used a definition for the nanorcystallinity that is related to the effective medium analysis (EMA) of the material. The optical technique used for the investigations was spectroscopic ellipsometry. To measure the above sample properties the thickness and composition of several layers on a quartz substrate had to be determined by proper modeling of this complex system. We found that the nanocrystallinity (defined as the ratio of nc-Si/(c-Si+nc-Si) decreases systematically with increasing the Si-NC layer thickness. Using this approach we are sensitive to the lifetime broadening of electrons caused by the scattering on the grain boundaries, and not to the shift of the direct interband transition energies due to quantum confinement.


2006 ◽  
Vol 40 (8) ◽  
pp. 915-919 ◽  
Author(s):  
I. L. Baranov ◽  
L. V. Tabulina ◽  
L. S. Stanovaya ◽  
T. G. Rusalskaya

1984 ◽  
Vol 38 ◽  
Author(s):  
J. H. Thomas ◽  
G. Kaganowicz

AbstractThin layers (100Å) of SiO were deposited at room temperature in a RF glow discharge in a nitrous oxige – silane ambient. Surface properties of the deposit were studied using quantitative and qualitative XPS and AES. Abrupt changes in the energy difference between the O 1s and Si 2p photoelectron peaks, the O/Si stoichiometric ratio, and nitrogen incorporation are observed with varying amounts of silane in the gas ambient (for a fixed nitrous oxide flow). The abrupt change in binding energy difference correlates with the presence of free oxygen in the glow discharge as measured by in-situ mass spectrometry. At silane flows below the abrupt change, nitrogen is excluded from the deposit and the surfaces appear to be chemically silicon dioxide with a O/Si ratio of 2.1 as determined from quantitative XPS analysis. Above the abrupt change, the films exhibit a surface composition of less than 2.0.


1989 ◽  
Vol 160 ◽  
Author(s):  
Y. Mashimoto

Local stress measurement is becoming very important to evaluate electrical and reliability property of semiconductor. Raman spectroscopic method has been established to measure local stress at the area of one micron in diameter. The measurement problems came from the characteristics of a spectrometer have been solved by the following.–Ar Plasma line is utilized to calibrate wave numbers.–Gaussian and Lorentz distribution are utilized to determine the peaks of Plasma line and RAMAN shift.This method with introduction of a certain assumption can be applied to the stress measurement not only for Silicon single crystal like trench structure, but for deposited thin layers like silicon oxide or silicon nitride, and plastic packaging material.This paper describes the measurement methods of local stress, data processing techniques of measurement data and several examples of the measurement on a semiconductor thin layer and packaging plastic.


1991 ◽  
Vol 237 ◽  
Author(s):  
Tirthankar Dutta ◽  
N. M. Ravindra

ABSTRACTThermal oxidation of Silicon in the thin regime is of vital importance to VLSI device engineers because thin layers of SiO2 are exclusively used as the gate dielectric for high performance of MOS devices. There exists a number of models to explain this kinetics of oxidation. However there is a considerable variance among the reported rate constants, which are supposed to describe the oxidation process. Rather than arriving at an alternative model, the present study aims at simulation of existing models of oxidation in dry oxygen, with a recent set of experimental data and arrive at the best possible model and provide accurate rate constants for oxidation in dry oxygen. These experimental data have been obtained, earlier, using high-resolution transmission electron microscopy (HRTEM) and ellip-sometry techniques to measure thicknesses of silicon oxide, grown at 800° in dry oxygen, in the thickness range of 2–20 nm.


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