Cold-Curing Epoxy Resins: Aging and Environmental Effects. Part II - Mechanical Properties

2001 ◽  
Vol 21 (4) ◽  
Author(s):  
M. Frigione ◽  
C. Naddeo ◽  
D. Acierno
Author(s):  
Georgel MIHU ◽  
Claudia Veronica UNGUREANU ◽  
Vasile BRIA ◽  
Marina BUNEA ◽  
Rodica CHIHAI PEȚU ◽  
...  

Epoxy resins have been presenting a lot of scientific and technical interests and organic modified epoxy resins have recently receiving a great deal of attention. For obtaining the composite materials with good mechanical proprieties, a large variety of organic modification agents were used. For this study gluten and gelatin had been used as modifying agents thinking that their dispersion inside the polymer could increase the polymer biocompatibility. Equal amounts of the proteins were milled together and the obtained compound was used to form 1 to 5% weight ratios organic agents modified epoxy materials. To highlight the effect of these proteins in epoxy matrix mechanical tests as three-point bending and compression were performed.


Polymer ◽  
2020 ◽  
Vol 190 ◽  
pp. 122225 ◽  
Author(s):  
H.J. Zhang ◽  
S. Sellaiyan ◽  
K. Sako ◽  
A. Uedono ◽  
Y. Taniguchi ◽  
...  

Polymers ◽  
2021 ◽  
Vol 13 (7) ◽  
pp. 1129
Author(s):  
Bo-Young Lee ◽  
Dae-Hyeon Lee ◽  
Keon-Soo Jang

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.


2009 ◽  
Vol 10 (4) ◽  
pp. 314-319 ◽  
Author(s):  
Young-Seak Lee ◽  
Ji-Sun Im ◽  
Seok-Min Yun ◽  
Young-Chang Nho ◽  
Phil-Hyun Kang ◽  
...  

RSC Advances ◽  
2021 ◽  
Vol 11 (49) ◽  
pp. 30943-30954
Author(s):  
Wei Peng ◽  
Yu-xuan Xu ◽  
Shi-bin Nie ◽  
Wei Yang

Phosphorus-containing flame retardants have received huge interest for improving the flame retardant behavior of epoxy resins (EP) over the past few decades.


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