Experimental measurements of the shear force on surface mount components simulating the wave soldering process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deep Understanding ◽  
Critical Issue ◽  
Circuit Boards ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Wave Soldering ◽  
Pull Out ◽  
Minimum Force

Purpose This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures. Design/methodology/approach An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process. Findings The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component. Originality/value This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

Thermal fluid-structure interaction of PCB configurations during the wave soldering process

2015 ◽  
Vol 27 (1) ◽  
pp. 31-44 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Boards ◽  
Molten Solder ◽  
Circuit Boards ◽  
Fluid Structure ◽  
Content Type ◽  
Thermally Induced ◽  
C Language ◽  
Soldering Process ◽  
Wave Soldering

Purpose – This paper aims to investigate the thermal fluid–structure interactions (FSIs) of printed circuit boards (PCBs) at different component configurations during the wave soldering process and experimental validation. Design/methodology/approach – The thermally induced displacement and stress on the PCB and its components are the foci of this study. Finite volume solver FLUENT and finite element solver ABAQUS, coupled with a mesh-based parallel code coupling interface, were utilized to perform the analysis. A sound card PCB (138 × 85 × 1.5 mm3), consisting of a transistor, diode, capacitor, connector and integrated circuit package, was built and meshed by using computational fluid dynamics pre-processing software. The volume of fluid technique with the second-order upwind scheme was applied to track the molten solder. C language was utilized to write the user-defined functions of the thermal profile. The structural solver analyzed the temperature distribution, displacement and stress of the PCB and its components. The predicted temperature was validated by the experimental results. Findings – Different PCB component configurations resulted in different temperature distributions, thermally induced stresses and displacements to the PCB and its components. Results show that PCB component configurations significantly influence the PCB and yield unfavorable deformation and stress. Practical implications – This study provides PCB designers with a profound understanding of the thermal FSI phenomenon of the process control during wave soldering in the microelectronics industry. Originality/value – This study provides useful guidelines and references by extending the understanding on the thermal FSI behavior of molten solder for PCBs. This study also explores the behaviors and influences of PCB components at different configurations during the wave soldering process.

Numerical Modeling of the Wave Soldering Process and Experimental Validation

2021 ◽  
Author(s):  
Violeta Carvalho ◽  
Bruno Arcipreste ◽  
Delfim Soares ◽  
Luís Ribas ◽  
Nelson Rodrigues ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Fluid Dynamic ◽  
Circuit Boards ◽  
Electronic Components ◽  
Effective Technique ◽  
Soldering Process ◽  
Wave Soldering ◽  
Air Interface ◽  
Good Agreement

Abstract One of the most important procedures in the electronics industry is the assembly of electronic components onto Printed Circuit Boards (PCB) through the soldering process. Among the various soldering methods available, wave soldering is a very effective technique. In this process, the components are placed onto the PCB, which subsequently, is coated with flux and then passed across a preheat zone. In the end, the assembly is moved by the conveyor and passed over the surface of the molten solder wave in order to create a reliable connection both mechanically and electrically. Although this process has been frequently used, there are soldering defects that remain unsolved and continue to emerge, such as the missing of surface-mount components in the PCB after the soldering process. Aiming to understand if such defects are related to the force exerted by the solder wave in the PCB, in the present work, a numerical and experimental study was performed. For this purpose, a Computational Fluid Dynamic model was developed by using the Fluent® software to describe the interaction between the solder jet and the PCB with the integrated circuits, and the multiphase method, Volume of Fluid, was also applied to track the solder-air interface boundary. The results obtained numerically were validated by using an experimental setup designed and built to this end. In general, the data obtained showed to be in good agreement and it was concluded that the force exerted by the solder wave is approximately 0.02 N.

Path optimization of CNC PCB drilling using hybrid Taguchi genetic algorithm

Kybernetes ◽  
2016 ◽  
Vol 45 (1) ◽  
pp. 107-125 ◽  
Author(s):  
Dony Hidayat Al-Janan ◽  
Tung-Kuan Liu
Keyword(s):  
Genetic Algorithm ◽  
Printed Circuit Boards ◽  
Numerical Control ◽  
Circuit Boards ◽  
Improved Genetic Algorithm ◽  
Solution Quality ◽  
Content Type ◽  
Neighbor Search ◽  
Feasible Solutions ◽  
The Traveling Salesman Problem

Purpose – In this study, the hybrid Taguchi genetic algorithm (HTGA) was used to optimize the computer numerical control-printed circuit boards drilling path. The optimization was performed by searching for the shortest route for the drilling path. The number of feasible solutions is exponentially related to the number of hole positions. The paper aims to discuss these issues. Design/methodology/approach – Therefore, a traveling cutting tool problem (TCP), which is similar to the traveling salesman problem, was used to evaluate the drilling path; this evaluation is considered an NP-hard problem. In this paper, an improved genetic algorithm embedded in the Taguchi method and a neighbor search method are proposed for improving the solution quality. The classical TCP problems proposed by Lim et al. (2014) were used for validating the performance of the proposed algorithm. Findings – Results showed that the proposed algorithm outperforms a previous study in robustness and convergence speed. Originality/value – The HTGA has not been used for optimizing the drilling path. This study shows that the HTGA can be applied to complex problems.

Thermal decomposition of solder flux activators under simulated wave soldering conditions

2017 ◽  
Vol 29 (3) ◽  
pp. 133-143 ◽  
Author(s):  
Kamila Piotrowska ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Thermal Treatment ◽  
Heat Exposure ◽  
Copper Surface ◽  
Substrate Material ◽  
Content Type ◽  
Soldering Process ◽  
Wave Soldering ◽  
Solder Flux ◽  
Solder Mask ◽  
The Impact

Purpose The aim of this work is to investigate the decomposition behaviour of the activator species commonly used in the wave solder no-clean flux systems and to estimate the residue amount left after subjecting the samples to simulated wave soldering conditions. Design/methodology/approach Changes in the chemical structure of the activators were studied using Fourier transform infrared spectroscopy technique and were correlated to the exposure temperatures within the range of wave soldering process. The amount of residue left on the surface was estimated using standardized acid-base titration method as a function of temperature, time of exposure and the substrate material used. Findings The study shows that there is a possibility of anhydride-like species formation during the thermal treatment of fluxes containing weak organic acids (WOAs) as activators (succinic and DL-malic). The decomposition patterns of solder flux activators depend on their chemical nature, time of heat exposure and substrate materials. Evaporation of the residue from the surface of different materials (laminate with solder mask, copper surface or glass surface) was found to be more pronounced for succinic-based solutions at highest test temperatures than for adipic acid. Less left residue was found on the laminate surface with solder mask (∼5-20 per cent of initial amount at 350°C) and poorest acid evaporation was noted for glass substrates (∼15-90 per cent). Practical implications The findings are attributed to the chemistry of WOAs typically used as solder flux activators. The results show the importance WOA type in relation to its melting/boiling points and the impact on the residual amount of contamination left after soldering process. Originality/value The results show that the evaporation of the flux residues takes place only at significantly high temperatures and longer exposure times are needed compared to the temperature range used for the wave soldering process. The extended time of thermal treatment and careful choice of fluxing technology would ensure obtaining more climatically reliable product.

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby
Keyword(s):  
Printed Circuit Boards ◽  
Solution Method ◽  
Identification Problem ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Knowledge Based ◽  
Sequence Identification ◽  
Placement Machine ◽  
Solution Methodology

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

Non-destructive detection methods for discontinuities of interconnection structures

2016 ◽  
Vol 33 (1) ◽  
pp. 23-35 ◽  
Author(s):  
Tomas Blecha
Keyword(s):  
Transmission Lines ◽  
Printed Circuit Boards ◽  
Characteristic Impedance ◽  
Diagnostic Methods ◽  
Detection Methods ◽  
Circuit Boards ◽  
Content Type ◽  
Multiple Line ◽  
Detection And Localization ◽  
Non Destructive

Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

Thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components: a review

2016 ◽  
Vol 28 (2) ◽  
pp. 41-62 ◽  
Author(s):  
Chun Sean Lau ◽  
C.Y. Khor ◽  
D. Soares ◽  
J.C. Teixeira ◽  
M.Z. Abdullah
Keyword(s):  
Solder Joints ◽  
Simulation Modelling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Process ◽  
Reflow Soldering ◽  
Content Type ◽  
Surface Mount ◽  
Soldering Process ◽  
Free Solder

Purpose The purpose of the present study was to review the thermo-mechanical challenges of reflowed lead-free solder joints in surface mount components (SMCs). The topics of the review include challenges in modelling of the reflow soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface mount technology, especially toward the miniaturization of the advanced SMCs package. The challenges lead to more complex thermal responses when the PCB assembly passes through the reflow oven. The virtual modelling tools facilitate the modelling and simulation of the lead-free reflow process, which provide more data and clear visualization on the particular process. Findings With the growing trend of computer power and software capability, the multidisciplinary simulation, such as the temperature and thermal stress of lead-free SMCs, under the influenced of a specific process atmosphere can be provided. A simulation modelling technique for the thermal response and flow field prediction of a reflow process is cost-effective and has greatly helped the engineer to eliminate guesswork. Besides, simulated-based optimization methods of the reflow process have gained popularity because of them being economical and have reduced time-consumption, and these provide more information compared to the experimental hardware. The advantages and disadvantages of the simulation modelling in the reflow soldering process are also briefly discussed. Practical implications This literature review provides the engineers and researchers with a profound understanding of the thermo-mechanical challenges of reflowed lead-free solder joints in SMCs and the challenges of simulation modelling in the reflow process. Originality/value The unique challenges in solder joint reliability, and direction of future research in reflow process were identified to clarify the solutions to solve lead-free reliability issues in the electronics manufacturing industry.

New technologies of multi-layered printed circuit boards, intended of rapid-design electronic modules

Circuit World ◽  
2015 ◽  
Vol 41 (3) ◽  
pp. 121-124
Author(s):  
Wojciech Stęplewski ◽  
Mateusz Mroczkowski ◽  
Radoslav Darakchiev ◽  
Konrad Futera ◽  
Grażyna Kozioł
Keyword(s):  
Printed Circuit Boards ◽  
New Technologies ◽  
Circuit Board ◽  
Circuit Boards ◽  
Content Type ◽  
Signal Distribution ◽  
Printed Circuit ◽  
Rapid Design ◽  
Small Pitch ◽  
Signal Path

Purpose – The purpose of this study was the use of embedded components technology and innovative concepts of the printed circuit board (PCB) for electronic modules containing field-programmable gate array (FPGA) devices with a large number of pins (e.g. Virtex 6, FF1156/RF1156 package, 1,156 pins). Design/methodology/approach – In the multi-layered boards, embedded passive components that support FPGA device input/output (I/O), such as blocking capacitors and pull-up resistors, were used. These modules can be used in rapid design of electronic devices. In the study, the MC16T FaradFlex material was used for the inner capacitive layer. The Ohmega-Ply RCM 25 Ω/sq material was used to manufacture pull-up resistors for high-frequency pins. The embedded components have been connected to pins of the FPGA component by using plated-through holes for capacitors and blind vias for resistors. Also, a technique for a board-to-board joining, by using castellated terminations, is described. Findings – The fully functional modules for assembly of the FPGA were manufactured. Achieved resistance of embedded micro resistors, as small as the smallest currently used surface-mount device components (01005), was below required tolerance of 10 per cent. Obtained tolerance of capacitors was less than 3 per cent. Use of embedded components allowed to replace the pull-up resistors and blocking capacitors and shortens the signal path from the I/O of the FPGA. Correct connection to the castellated terminations with a very small pitch was also obtained. This allows in further planned studies to create a full signal distribution system from the FPGA without the use of unreliable plug connectors in aviation and space technology. Originality/value – This study developed and manufactured several innovative concepts of signal distribution from printed circuit boards. The signal distribution solutions were integrated with embedded components, which allowed for significant reduction in the signal path. This study allows us to build the target object that is the module for rapid design of the FPGA device. Usage of a pre-designed module would lessen the time needed to develop a FPGA-based device, as a significant part of the necessary work (mainly designing the signal and power fan-out) will already be done during the module development.

Mechanical reliability of solder joints in PCBs assembled in surface mount technology

2016 ◽  
Vol 28 (1) ◽  
pp. 18-26 ◽  
Author(s):  
Janusz Borecki ◽  
Tomasz Serzysko
Keyword(s):  
Mechanical Strength ◽  
Shear Force ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Electronic Device ◽  
Operating Conditions ◽  
Content Type ◽  
Operational Conditions ◽  
Soldering Process ◽  
The Individual

Purpose – The purpose of this paper is to determine the dependence of mechanical strength of solder joints on printed circuit boards from the soldering process parameters and operating conditions of the electronic device. Design/methodology/approach – The research was performed using the Taguchi method of planning of experiments. Evaluation of the quality of solder joints was made on the basis of microscopic observations, X-ray analysis and measurements of shear force of solder joints. Findings – The carried out research has shown the influence of the individual parameters of the soldering process on the mechanical strength of solder joints and the mechanism of damage of solder joints under the influence of shear force. Originality/value – The authors present results of their research using advanced techniques of experimental design and analysis of results. In this study, original approach was used to simulate the operational conditions of electronic devices including thermal imaging technology.

A computational fluid dynamics analysis of the wave soldering process

2015 ◽  
Vol 25 (5) ◽  
pp. 1231-1247 ◽  
Author(s):  
M.S. Abdul Aziz ◽  
M.Z. Abdullah ◽  
C.Y. Khor ◽  
M. Mazlan ◽  
A.M. Iqbal ◽  
...  
Keyword(s):  
Flow Behavior ◽  
Three Dimensional ◽  
Flow Profile ◽  
Content Type ◽  
Fountain Flow ◽  
Soldering Process ◽  
Wave Soldering ◽  
Computational Fluid Dynamics Analysis ◽  
Filling Time ◽  
Propeller Blades

Purpose – The purpose of this paper is to present a three-dimensional finite volume-based analysis on the effects of propeller blades on fountain flow in a wave soldering process and performs an experimental validation. Design/methodology/approach – Solder pot models with various numbers of propeller blades were developed and meshed by using hybrid elements and simulated by using the FLUENT fluid flow solver. The characteristics of the fountain, such as flow profile, velocity vector, filling time, and fountain advancement, were investigated. Molten solder (Sn63Pb37) material, a temperature of 250°C, and a propeller speed of 830 rpm were applied in the simulation. The predicted results were validated by the experimental fountain profile. Findings – The use of a six-blade propeller in a solder pot increased the fountain thickness profile and reduced the filling time. Moreover, a six-blade propeller design resulted in a stable fountain profile and was considered the best choice for current wave soldering processes. Practical implications – This study provides a better understanding of the effects of propeller blades on the fountain flow in the wave soldering process. Originality/value – The study explores the fountain flow behavior and provides a reference to the engineers and designers in order to improve the fountain flow of the wave soldering.

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