Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel� Centrino� Mobile Technology

This paper presents a novel adaptive thermal management technique to improve the efficiency of solid-state power amplifier (SSPA) for geo-synchronous satellites. The thermal management for space segment is very important as it determines the reliability of the satellite. The microwave power amplifiers (MPAs), either traveling wave tube amplifiers (TWTAs) or SSPAs, are the maximum power consuming and heat dissipative elements in the satellite and their power efficiency determines weight, volume, cost, and reliability of the satellite. So, it is necessary to improve the efficiency of the SSPA. A novel technique is presented, which improves the efficiency of the SSPA and hence, saving of costly DC power generation on-board and reduction of the heat dissipation.

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Thermal Investigation Into Power Multiplexing for Homogeneous Many-Core Processors

Journal of Heat Transfer ◽

10.1115/1.4006012 ◽

2012 ◽

Vol 134 (6) ◽

Cited By ~ 4

Author(s):

Man Prakash Gupta ◽

Minki Cho ◽

Saibal Mukhopadhyay ◽

Satish Kumar

Keyword(s):

Thermal Management ◽

Power Distribution ◽

Peak Temperature ◽

Management Technique ◽

Time Intervals ◽

Regular Time ◽

Overall Performance ◽

On Chip ◽

Many Core ◽

Power Configuration

In this paper, a proactive thermal management technique called “power multiplexing” is explored for many-core processors. Power multiplexing involves redistribution of the locations of active cores at regular time intervals to obtain uniform thermal profile with low peak temperature. Three different migration policies namely random, cyclic, and global coolest replace have been employed for power multiplexing and their efficacy in reducing the peak temperature and thermal gradient on chip is investigated. For a given migration frequency, global coolest replace policy is found to be the most effective among the three policies considered as this policy provides 10 °C reduction in peak temperature and 20 °C reduction in maximum spatial temperature difference on a 256 core chip. Power configuration on the chip is characterized by a parameter called “proximity index” which emerges as an important parameter to represent the spatial power distribution on a chip. We also notice that the overall performance of the chip could be improved by 10% using global multiplexing.

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Numerical Simulations for Digitized Heat Transfer

ASME 2009 InterPACK Conference, Volume 2 ◽

10.1115/interpack2009-89264 ◽

2009 ◽

Cited By ~ 1

Author(s):

Eric Baird ◽

Kamran Mohseni

Keyword(s):

Heat Transfer ◽

Thermal Management ◽

Liquid Metals ◽

Heat Removal ◽

Heat Sinks ◽

Management Technique ◽

High Power Density ◽

Transfer Rates ◽

Integrated Microsystems ◽

High Degree

This paper presents estimates of heat removal capabilities of a Digitized Heat Transfer (DHT) cooled device, a novel active thermal management technique for high power density electronics and integrated microsystems. In DHT, thermal energy is transported by a discrete array of electrostatically activated microdroplets of liquid metals, alloys or aqueous solutions with the potential of supporting significantly higher heat transfer rates than classical air-cooled heat sinks. Actuation methods for dispensing and transporting individual fluid slugs with a high degree of precision and programmability are described, and numerical results for the amount of heat flux removal a DHT device can obtain are presented.

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Research on Thermal Management System for the Vehicle Application of Lithium-Ion Power Batteries

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.347-353.984 ◽

2011 ◽

Vol 347-353 ◽

pp. 984-988

Author(s):

Fang Zhou ◽

Yong Zhong ◽

Pei Zhang

Keyword(s):

Thermal Management ◽

Management System ◽

Thermal Characteristics ◽

Lithium Ion ◽

Management Technique ◽

Battery Thermal Management ◽

Thermal Management System ◽

Battery Thermal Management System ◽

Medium Design ◽

Key Techniques

Thermal management technique is one of the key techniques for the vehicle application of lithium-ion power batteries. Based on the analysis of thermal characteristics of the lithium-ion power batteries, the establishment of thermal model and numerical simulation for the lithium-ion power batteries were discussed. Finally, a procedure for designing battery thermal management system (BTMS) was proposed, and the key techniques during designing a BTMS were studied, including selection of heat transfer medium, design of cooling/heating structure and so on. This research provides a technique support for designing a good and effective BTMS, as well as improving the working performance and security of the lithium-ion power batteries and the electric vehicles.

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An MCM-D module using newly structured thermal management technique

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) ◽

10.1109/iemtim.1998.704632 ◽

2002 ◽

Author(s):

N. Yamanaka ◽

A. Harada ◽

K. Kaizu ◽

T. Kawamura

Keyword(s):

Thermal Management ◽

Management Technique

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Computational Form Factor Study of a 3rd Generation Open Compute Server for Single-Phase Immersion Cooling

ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems ◽

10.1115/ipack2019-6602 ◽

2019 ◽

Cited By ~ 1

Author(s):

Jimil M. Shah ◽

Chinmay Bhatt ◽

Pranavi Rachamreddy ◽

Ravya Dandamudi ◽

Satyam Saini ◽

...

Keyword(s):

Form Factor ◽

Thermal Management ◽

Single Phase ◽

Data Centers ◽

Computational Study ◽

Research Work ◽

Modern World ◽

Management Technique ◽

Air Cooling ◽

Immersion Cooling

Abstract Networking and computing dependency has been increasing in the modern world, thus, boosting the growth of data centers in leading business domains like banking, education, transportation, social media etc. Data center is a facility that incorporates an organization’s IT operations and equipment, as well as where it stores, processes and manages the data. To fulfill the increasing demands of data storage and data processing, a corresponding increase in server performance is needed. This causes a subsequent increment in power consumption and heat generation in the servers due to high performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling high packaging densities. Therefore, industries are looking for single-phase immersion cooling using various dielectric fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. This research work aims at increasing the rack density by reducing the form factor of a 3rd Generation Open Compute Server using single-phase immersion cooling. A computational study is conducted in the operational range of temperatures and the thermal efficiency is optimized. A parametric study is conducted by changing the inlet velocities and inlet temperatures of cooling liquid for different heights of the open compute 3rd generation server. A comparative study is then carried out for white mineral oil and synthetic fluid (EC100).

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