Application of thermal management technique to thermal control for ultraviolet imaging spectrometers

2014 ◽  
Vol 22 (7) ◽  
pp. 1877-1885
Author(s):  
郭亮 GUO Liang ◽  
吴清文 WU Qing-wen ◽  
黄勇 HUANG Yong ◽  
王淑荣 WANG Shu-rong
2003 ◽  
Author(s):  
Jihad Y. Hammoud

The heat generated by microprocessors is steadily increasing as die size shrinks. The trend towards increasing microprocessor heat flux is forcing thermal engineers to consider alternative system cooling technologies. Greater thermal control is also an issue during the engineering test of microprocessors and package characterization. The thermal challenges posed during test and debug are significant as power levels are higher than system power and temperature control requirements are very tight. Thermo-electric cooling technology (TEC) integrated with liquid cooling has evolved significantly in the past few years as a thermal management technique for engineering test and debug. In this study, an experimental approach was taken to characterize a TEC-based thermal control unit (TCU). The TCU thermal resistance was calculated as a function of the water temperature and device heat outputs. Several tests evaluated the suitability of using the TCU to control a device at low and elevated package case temperatures. Test results indicated that the TEC-Liquid system can operate in a cold or hot mode and that the thermal management capability of the system is a strong function of the liquid bulk temperature on the hot side of the TEC surface. The water bulk temperature at which the TCU fails to maintain the required device temperature is also reported in this paper.


Author(s):  
Amip J. Shah ◽  
Van P. Carey ◽  
Cullen E. Bash ◽  
Chandrakant D. Patel

Data centers today contain more computing and networking equipment than ever before. As a result, a higher amount of cooling is required to maintain facilities within operable temperature ranges. Increasing amounts of resources are spent to achieve thermal control, and tremendous potential benefit lies in the optimization of the cooling process. This paper describes a study performed on data center thermal management systems using the thermodynamic concept of exergy. Specifically, an exergy analysis has been performed on sample data centers in an attempt to identify local and overall inefficiencies within thermal management systems. The development of a model using finite volume analysis has been described, and potential applications to real-world systems have been illustrated. Preliminary results suggest that such an exergy-based analysis can be a useful tool in the design and enhancement of thermal management systems.


Author(s):  
George Damoulakis ◽  
Mohamad Jafari-Gukeh ◽  
Theodore P. Koukoravas ◽  
Constantine Megaridis

Abstract The characterization "thermal diode" has been used to portray systems that spread heat very efficiently in a specific direction but obstruct it from flowing in the opposite direction. In this study, a planar vapor chamber with a wickless, wettability-patterned condenser is fabricated and tested as a thermal diode. When the chamber operates in the forward mode, heat is naturally driven away from the heat source; in the reverse mode, the system blocks heat backflow, thus working as a thermal diode. The low-profile assembly takes advantage of the phase-changing properties of water inside a closed loop comprised of a classical thin-wick evaporator opposing a wickless wettability-patterned condenser, when the chamber operates in the forward (heat-transporting) mode. The wettability patterned plate -when on the cooled side- enables spatial controlled dropwise and filmwise condensation and offers an efficient transport mechanism of the condensed medium on superhydrophilic wedge tracks by way of capillary forces. The same chamber acts as a thermal blocker when the opposing wick-covered plate is on the cool side, trapping the liquid in the pores and blocking heat flow. With this system, thermal diodicities exceeding 20 have been achieved, and are tunable by altering the wettability pattern as needed for different purposes. The present vapor chamber - thermal diode design could be well-suited for an extensive range of thermal-management applications, ranging from aerospace, spacecraft, and construction building materials, to electronics protection, electronics packaging, refrigeration, thermal control during energy harvesting, thermal isolation, etc.


2018 ◽  
Vol 140 (5) ◽  
Author(s):  
R. J. Doshi ◽  
Deepak Ghodgaonkar

This paper presents a novel adaptive thermal management technique to improve the efficiency of solid-state power amplifier (SSPA) for geo-synchronous satellites. The thermal management for space segment is very important as it determines the reliability of the satellite. The microwave power amplifiers (MPAs), either traveling wave tube amplifiers (TWTAs) or SSPAs, are the maximum power consuming and heat dissipative elements in the satellite and their power efficiency determines weight, volume, cost, and reliability of the satellite. So, it is necessary to improve the efficiency of the SSPA. A novel technique is presented, which improves the efficiency of the SSPA and hence, saving of costly DC power generation on-board and reduction of the heat dissipation.


Author(s):  
Austin A. Phoenix ◽  
Evan Wilson

The novel adaptive thermal metamaterial developed in this paper provides a unique thermal management capability that can address the needs of future spacecraft. While advances in metamaterials have provided the ability to generate materials with a broad range of material properties, relatively little advancement has been made in the development of adaptive metamaterials. This metamaterial concept enables the development of materials with a highly nonlinear thermal conductivity as a function of temperature. Through enabling active or passive control of the metamaterials bulk effective thermal conductivity, this metamaterial that can improve the spacecraft's thermal management systems performance. This variable thermal conductivity is achieved through induced contact that results in changes in the F path length and the conductive path area. The contact can be generated internally using thermal strain from shape memory alloys, bimetal springs, and mismatches in coefficient of thermal expansion (CTE) or it can be generated externally using applied mechanical loading. The metamaterial can actively control the temperature of an interface by dynamically changing the bulk thermal conductivity controlling the instantaneous heat flux through the metamaterial. The design of thermal stability regions (regions of constant thermal conductivity versus temperature) into the nonlinear thermal conductivity as a function of temperature can provide passive thermal control. While this concept can be used in a wide range of applications, this paper focuses on the development of a metamaterial that achieves highly nonlinear thermal conductivity as a function of temperature to enable passive thermal control of spacecraft systems on orbit.


2012 ◽  
Vol 134 (6) ◽  
Author(s):  
Man Prakash Gupta ◽  
Minki Cho ◽  
Saibal Mukhopadhyay ◽  
Satish Kumar

In this paper, a proactive thermal management technique called “power multiplexing” is explored for many-core processors. Power multiplexing involves redistribution of the locations of active cores at regular time intervals to obtain uniform thermal profile with low peak temperature. Three different migration policies namely random, cyclic, and global coolest replace have been employed for power multiplexing and their efficacy in reducing the peak temperature and thermal gradient on chip is investigated. For a given migration frequency, global coolest replace policy is found to be the most effective among the three policies considered as this policy provides 10 °C reduction in peak temperature and 20 °C reduction in maximum spatial temperature difference on a 256 core chip. Power configuration on the chip is characterized by a parameter called “proximity index” which emerges as an important parameter to represent the spatial power distribution on a chip. We also notice that the overall performance of the chip could be improved by 10% using global multiplexing.


Author(s):  
Eric Baird ◽  
Kamran Mohseni

This paper presents estimates of heat removal capabilities of a Digitized Heat Transfer (DHT) cooled device, a novel active thermal management technique for high power density electronics and integrated microsystems. In DHT, thermal energy is transported by a discrete array of electrostatically activated microdroplets of liquid metals, alloys or aqueous solutions with the potential of supporting significantly higher heat transfer rates than classical air-cooled heat sinks. Actuation methods for dispensing and transporting individual fluid slugs with a high degree of precision and programmability are described, and numerical results for the amount of heat flux removal a DHT device can obtain are presented.


2011 ◽  
Vol 347-353 ◽  
pp. 984-988
Author(s):  
Fang Zhou ◽  
Yong Zhong ◽  
Pei Zhang

Thermal management technique is one of the key techniques for the vehicle application of lithium-ion power batteries. Based on the analysis of thermal characteristics of the lithium-ion power batteries, the establishment of thermal model and numerical simulation for the lithium-ion power batteries were discussed. Finally, a procedure for designing battery thermal management system (BTMS) was proposed, and the key techniques during designing a BTMS were studied, including selection of heat transfer medium, design of cooling/heating structure and so on. This research provides a technique support for designing a good and effective BTMS, as well as improving the working performance and security of the lithium-ion power batteries and the electric vehicles.


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