Thermal cycling fatigue and deformation mechanism in aluminum alloy thin films on silicon

1998 ◽  
Vol 13 (11) ◽  
pp. 3256-3264 ◽  
Author(s):  
J. Koike ◽  
S. Utsunomiya ◽  
Y. Shimoyama ◽  
K. Maruyama ◽  
H. Oikawa
Keyword(s):  
Thin Films ◽  
Aluminum Alloy ◽  
Thermal Cycling ◽  
Deformation Mechanism ◽  
Thermal Cycling Fatigue

Thermal Cycling Fatigue In Aluminum-Alloy Thin Films On Silicon Substrate

1997 ◽  
Vol 505 ◽  
Author(s):  
J. Koike ◽  
S. Utsunomiya ◽  
K. Maruyama
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Aluminum Alloy ◽  
Thermal Cycling ◽  
Silicon Substrate ◽  
Room Temperature ◽  
Crack Formation ◽  
Continuous Decrease ◽  
Thermal Cycling Fatigue

ABSTRACTThermal cycling was performed in Al-lmo%Si thin films deposited on Si wafers. After a given number of cycling between room temperature and 723 K, residual stress was measured at room temperure. Residual stress was found to increase with increasing the cycling number up to the 4th cycle, followed by further a continuous decrease by further cycling. The intial increase was found to be related to the increase of lattice dislcocations and their tangling. The following decrease was caused by crack formation along grain boundaties or by film delamination in some cases.

scholarly journals Bonding and Thermal Cycling Performances of Two (Poly)Aryl–Ether–Ketone (PAEKs) Materials to an Acrylic Denture Base Resin

Polymers ◽  
2021 ◽  
Vol 13 (4) ◽  
pp. 543 ◽  
Author(s):  
Tzu-Yu Peng ◽  
Saiji Shimoe ◽  
Lih-Jyh Fuh ◽  
Chung-Kwei Lin ◽  
Dan-Jae Lin ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Thermal Cycling ◽  
Fatigue Testing ◽  
Lower Surface ◽  
Aryl Ether ◽  
Bonding Performance ◽  
Significant Difference ◽  
Aryl Ether Ketone ◽  
Ether Ketone ◽  
Thermal Cycling Fatigue

Poly(aryl–ether–ketone) materials (PAEKs) are gaining interest in everyday dental practices because of their natural properties. This study aims to analyze the bonding performance of PAEKs to a denture acrylic. Testing materials were pretreated by grinding, sandblasting, and priming prior to polymerization with the denture acrylic. The surface morphologies were observed using a scanning electron microscope and the surface roughness was measured using atomic force microscopy. The shear bond strength (SBS) values were determined after 0 and 2500 thermal cycles. The obtained data were analyzed using a paired samples t-test and Tukey’s honestly significant difference (HSD) test (α = 0.05). The surface characteristics of testing materials after different surface pretreatments showed obvious differences. PAEKs showed lower surface roughness values (0.02–0.03 MPa) than Co-Cr (0.16 MPa) and zirconia (0.22 MPa) after priming and sandblasting treatments (p < 0.05). The SBS values of PAEKs (7.60–8.38 MPa) met the clinical requirements suggested by ISO 10477 (5 MPa). Moreover, PAEKs showed significantly lower SBS reductions (p < 0.05) after thermal cycling fatigue testing compared to Co-Cr and zirconia. Bonding performance is essential for denture materials, and our results demonstrated that PAEKs possess good resistance to thermal cycling fatigue, which is an advantage in clinical applications. The results imply that PAEKs are potential alternative materials for the removable of prosthetic frameworks.

An Investigation on Strength Deterioration of Aluminum Alloy Welded Joint under Thermal Cycling Conditions

2012 ◽  
Vol 482-484 ◽  
pp. 981-984
Author(s):  
Cheng Jin ◽  
Chun Yuan Shi
Keyword(s):  
Aluminum Alloy ◽  
Thermal Cycling ◽  
Welded Joint ◽  
Minor Effect ◽  
Key Factors ◽  
Strength Deterioration ◽  
Cyclic Temperature ◽  
Damage Process ◽  
A Minor ◽  
Cycling Condition

Effects of thermal cycling on the tensile strength of aluminum alloy welded joints are studied experimentally in this paper. The damage mechanisms are also analyzed based on the microstructure observations. Results reveal that certain thermal cycling can cause strength decrease especially at the heat affected zone of the aluminum alloy welded joint. The cyclic temperature and the external load are the key factors which influence the strength of the welded joint specimens, while the cyclic period has a minor effect in thermal cycling conditions. Microstructure analysis also shows that voids nucleation and evolution governs the damage process under thermal cycling condition.

Void damage evolution of LF6 aluminum alloy welded joints under external load and thermal cycling conditions

2010 ◽  
Vol 20 (10) ◽  
pp. 1968-1973 ◽  
Author(s):  
Guo-fa MI ◽  
Da-wei ZHAO ◽  
Cui-fen DONG ◽  
Ji-tai NIU ◽  
Cheng JIN
Keyword(s):  
Aluminum Alloy ◽  
Thermal Cycling ◽  
Welded Joints ◽  
External Load ◽  
Damage Evolution ◽  
Void Damage

scholarly journals Thin films produced on 5052 aluminum alloy by plasma electrolytic oxydation with Red Mud-containing Electrolytes

2014 ◽  
Vol 17 (6) ◽  
pp. 1404-1409 ◽  
Author(s):  
Lívia Sottovia ◽  
Maria Lúcia Pereira Antunes ◽  
César Augusto Antonio ◽  
Elidiane Cipriano Rangel ◽  
Nilson Cristino da Cruz
Keyword(s):  
Thin Films ◽  
Aluminum Alloy ◽  
Red Mud ◽  
Plasma Electrolytic

Effects of Confinement on Plastic Deformation in Passivated AL Films

1993 ◽  
Vol 308 ◽  
Author(s):  
S.G.H. Anderson ◽  
I.-S. Yeo ◽  
P.S. Ho ◽  
S. Ramaswami ◽  
R. Cheung
Keyword(s):  
Thin Films ◽  
Plastic Deformation ◽  
Thermal Cycling ◽  
Temperature Behavior ◽  
Weighted Sum ◽  
Wafer Curvature ◽  
Tension And Compression ◽  
Curvature Measurements

ABSTRACTWafer curvature measurements of a trilayer (SiO2 / AlSiCu / Si) structure are compared to that predicted by a weighted sum of individual measurements of SiO2 and AlSiCu films on Si, and significant differences are found to exist for temperatures above 200°C. A straightforward analysis of the stresses in each layer has been modeled using an extension of a model by Feng et al. which assumes uniform plastic deformation throughout the Al. The modeling results suggest a straightforeward method for determining stresses in deformable thin films that are confined by elastic overlayers. A comparison of the stress-temperature behavior for unpassivated and passivated AlSiCu films reveals that the confined films exhibit less plastic deformation and both higher tension and compression during thermal cycling.

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