Quantification of Oxidizer Systems for Porous Silicon Combustion

2015 ◽  
Vol 1758 ◽  
Author(s):  
Ani Abraham ◽  
Nicholas W. Piekiel ◽  
Cory R. Knick ◽  
Christopher J. Morris ◽  
Edward Dreizin
Keyword(s):  
Porous Silicon ◽  
Gas Adsorption ◽  
Energetic Material ◽  
Sodium Perchlorate ◽  
Metal Nitrate ◽  
Etch Depth ◽  
Bomb Calorimetry ◽  
Combustion Dynamics ◽  
Moisture Stability ◽  
On Chip

ABSTRACTWe present the first quantitative assessment of combustion dynamics of on-chip porous silicon (PS) energetic material using sulfur and nitrate-based oxidizers with potential for improved moisture stability and/or minimized environmental impact compared to sodium perchlorate (NaClO4). Material properties of the PS films were characterized using gas adsorption porosimetry, and profilometry to calculate specific surface area, porosity and etch depth. The PS/sulfur energetic composite was formed using three pore loading techniques, where the combustion speeds ranged from 2.9 – 290 m/s. The nitrate-based oxidizers were solution-deposited using different compatible solvents, and depending on the metal-nitrate yielded combustion speeds of 3.1 – 21 m/s. Additionally, the combustion enthalpies from bomb calorimetry experiments are reported for the alternative PS/oxidizer systems in both nitrogen and oxygen environments.

Exploring the Length Scale Limits of Porous Silicon Combustion

2015 ◽  
Vol 1758 ◽  
Author(s):  
Nicholas W. Piekiel ◽  
Christopher J. Morris ◽  
Wayne A. Churaman ◽  
David M. Lunking
Keyword(s):  
Porous Silicon ◽  
Crystalline Silicon ◽  
Energetic Material ◽  
Sodium Perchlorate ◽  
Flame Speed ◽  
Small Scale ◽  
Length Scale ◽  
Sem Images ◽  
Thermal Insulator ◽  
On Chip

ABSTRACTThe present study explores the burning of microscale porous silicon channels with sodium perchlorate. These on-chip porous silicon energetics were embedded in crystalline silicon, and therefore surrounded on three sides by an efficient thermal conductor. For slow burning systems, this presents complications as heat loss to the crystalline silicon substrate can result in inconsistent burning or flame extinction. We investigated <100 μm wide porous silicon strips, sparsely filled with sodium perchlorate (NaClO4), to probe the limits of on-chip combustion. Four different etch times were attempted to decrease the dimensions of the porous silicon strips. The smallest size achieved was 12 x 64 µm, and despite the small dimensions, demonstrated the same flame speed as the larger porous silicon strips of 6-7 m/s. We predict that unreacted porous silicon acts as a thermal insulator to aid combustion for slow burning porous silicon channels, and SEM images provide evidence to support this. We also investigated the small scale combustion of a rapidly burning sample (∼1200 m/s). Despite the rapid flame speed, the propagation followed a designed, winding flame path. The use of these small scale porous silicon samples could significantly reduce the energetic material footprint for future microscale applications.

FAST COMBUSTION MODES OF COMPOSITES "MOUND OF POROUS SILICON FRAGMENTS-SODIUM PERCHLORATE MONOHYDRATE" IN THE ATMOSPHERE

2020 ◽  
Author(s):  
V. N. MIRONOV ◽  
◽  
O. G. PENYAZKOV ◽  
E. S. GOLOMAKO ◽  
S. O. SHUMLYAEV ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Energetic Material ◽  
Sodium Perchlorate ◽  
Nanostructured Silicon ◽  
Combustion Modes ◽  
Potential Use

Numerous studies have demonstrated the potential use of porous silicon (pSi) as an energetic material. However, there are a number of dificulties in such an application of nanostructured silicon. Here are two of the most serious dificulties.

FAST COMBUSTION MODES OF COMPOSITES “MOUND OF POROUS SILICON FRAGMENTS - SODIUM PERCHLORATE MONOHYDRATE” IN THE ATMOSPHERE

2021 ◽  
Vol 14 (2) ◽  
pp. 83-91
Author(s):  
V.N. MIRONOV ◽  
◽  
O.G. PENYAZKOV ◽  
E.S. GOLOMAKO ◽  
S.O. SHUMLYAEV ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Porous Layer ◽  
Sodium Perchlorate ◽  
High Energy ◽  
Combustion Dynamics ◽  
Porous Layers ◽  
Combustion Modes ◽  
Series Of Experiments ◽  
Induction Times ◽  
Energy Processes

One of the criteria for the development of high-energy processes is the large specific surface area of the solid component of composites. Therefore, the maximum preservation of its nanostructured skeleton when separating the porous layer from the monocrystal substrate is relevant. Based on the analysis of the quality of the porous layer under various methods and modes of its formation, two methods were selected that provide simple and effective separation of the porous structure from the monocrystal. For composites based on mounds of porous silicon (pSi) fragments (MPSF), three series of experiments were carried out with fragments of porous layers of different age (formed within the previously established time limits before composites creation) with registration of combustion dynamics, temperatures and combustion spectra, as well as intensity of disturbances in the atmosphere forming during combustion of MPSF-composites. Four combustion modes of MPSF-composites were established: smoldering, frontal, aerosol, and frontal-aerosol. The ignition induction times were determined: from 1 to 50 ^s, pressure pulses in the atmosphere at a distance of 260 mm from the ignition site - up to 1.6 bar (with a mass of composites up to 0.4 g). Combustion velocities ofMPSF-composites and their dependences onthe coefficient of stoichiometry and humidity of sodium perchlorate monohydrate are established.

COMBUSTION OF PSI-NACLO4 ■ H2O COMPOSITIONS WITH MICROPARTICLES OF NANOSTRUCTURED SILICON AT THE NEAR-STOICHIOMETRIC EQUIVALENCE RATIOS OF COMPONENTS

2020 ◽  
Author(s):  
V. N. MIRONOV ◽  
◽  
O. G. PENYAZKOV ◽  
E. S. GOLOMAKO ◽  
S. O. SHUMLYAEV ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Microelectromechanical Systems ◽  
Energetic Material ◽  
Sodium Perchlorate ◽  
Energy Sources ◽  
Solid Fuels ◽  
Nanoporous Silicon ◽  
Nanostructured Silicon ◽  
Initiation And Propagation ◽  
Composite Solid

Currently, various groups of scientists are investigating the possibility of using nanostructured porous silicon as promising solid fuels (or additives to composite solid fuels) and as miniature energy sources for microelectromechanical systems. The results presented in the paper demonstrate the prospects of the proposed novations aimed at increasing the efficiency of nanoporous silicon as an energetic material. They are based on the use of mounds of porous silicon fragments treated with sodium perchlorate solutions and dried under low warming (MPSF-composites) as energy composites. For example, when the weights of the MPSF-composites and the porous layer composites on monocrystal substrates treated with sodium perchlorate solutions (PS-composites) are close to each other, the overpressure at the front of the shock waves developing at the initiation and propagation of combustion in the case of MPSF-composites is 5-6 times higher.

ON THE MECHANISMS OF POROUS SILICON COMBUSTION IN OXYGEN AND AIR ATMOSPHERE WHEN SODIUM PERCHLORATE IS INCORPORATED IN PORES

2020 ◽  
Author(s):  
V. N. MIRONOV ◽  
◽  
O. G. PENYAZKOV ◽  
P. N. KRIVOSHEYEV ◽  
I. A. IVANOV ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Porous Layer ◽  
Sodium Perchlorate ◽  
Spark Ignition ◽  
Joule Heat ◽  
Air Atmosphere ◽  
Breakdown Region ◽  
Ignition And Combustion ◽  
Heating Up

The processes of pSi ignition and combustion in oxygen are described. When spark ignition in the porous layer releases the Joule heat, it leads to a significant heating-up of the breakdown region.

Effect of the Porous Silicon Layer Structure on Gas Adsorption

2020 ◽  
Vol 12 (4) ◽  
pp. 04020-1-04020-5
Author(s):  
A. P. Oksanich ◽  
◽  
S. E. Pritchin ◽  
M. A. Mashchenko ◽  
A. Yu. Bobryshev ◽  
...  
Keyword(s):  
Porous Silicon ◽  
Gas Adsorption ◽  
Layer Structure ◽  
Silicon Layer ◽  
Porous Silicon Layer

Microfluidic Channel Fabrication With Tailored Wall Roughness

2012 ◽  
Author(s):  
Jing Ren ◽  
Sriram Sundararajan
Keyword(s):  
Flow Behavior ◽  
Surface Texturing ◽  
Microfluidic Channel ◽  
Dip Coating ◽  
Etch Depth ◽  
Wall Roughness ◽  
Random Surface ◽  
Lab On Chip ◽  
On Chip ◽  
Autocorrelation Length

Realistic random roughness of channel surfaces is known to affect the fluid flow behavior in microscale fluidic devices. This has relevance particularly for applications involving non-Newtonian fluids, such as biomedical lab-on-chip devices. In this study, a surface texturing process was developed and integrated into microfluidic channel fabrication. The process combines colloidal masking and Reactive Ion Etching (RIE) for generating random surfaces with desired roughness parameters on the micro/nanoscale. The surface texturing process was shown to be able to tailor the random surface roughness on quartz. A Large range of particle coverage (around 6% to 67%) was achieved using dip coating and drop casting methods using a polystyrene colloidal solution. A relation between the amplitude roughness, autocorrelation length, etch depth and particle coverage of the processed surface was built. Experimental results agreed reasonably well with model predictions. The processed substrate was further incorporated into microchannel fabrication. Final device with designed wall roughness was tested and proved a satisfying sealing performance.

Thermal Analysis of the Exothermic Reaction between Galvanic Porous Silicon and Sodium Perchlorate

2010 ◽  
Vol 2 (11) ◽  
pp. 2998-3003 ◽  
Author(s):  
Collin R. Becker ◽  
Luke J. Currano ◽  
Wayne A. Churaman ◽  
Conrad R. Stoldt
Keyword(s):  
Thermal Analysis ◽  
Porous Silicon ◽  
Exothermic Reaction ◽  
Sodium Perchlorate

Integration of lateral porous silicon membranes into planar microfluidics

Lab on a Chip ◽  
2015 ◽  
Vol 15 (3) ◽  
pp. 833-838 ◽  
Author(s):  
Thierry Leïchlé ◽  
David Bourrier
Keyword(s):  
Porous Silicon ◽  
Fabrication Process ◽  
Microfluidic Channels ◽  
Dead End ◽  
Silicon Membranes ◽  
On Chip ◽  
Mesoporous Membranes

A unique fabrication process was developed to integrate lateral porous silicon membranes into planar microfluidic channels. These mesoporous membranes were demonstrated to be suitable for on-chip dead-end microfiltration.

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