Metal Organic Chemical Vapor Deposition of Zinc Oxide

2005 ◽  
Vol 892 ◽  
Author(s):  
William E. Fenwick ◽  
Vincent T. Woods ◽  
Ming Pan ◽  
Nola Li ◽  
Matthew H. Kane ◽  
...  

AbstractThin films of ZnO were grown by metal organic chemical vapor deposition (MOCVD) in a vertical injection rotating disk reactor (RDR) system on sapphire substrates. Kinetics of ZnO growth by MOCVD were studied and an optimal growth window for a RDR tool was determined. Experimental growth conditions were chosen based on calculations of Reynolds Number (Re) and mixed convection parameter in order to select a growth window with stable gas flow and uniform heat transfer. Growth parameters were systemically varied within this window to determine the optimal growth conditions for this MOCVD tool and to study how these parameters affect film growth and quality. Properties of ZnNiO films grown by MOCVD were also studied to determine the effects of Ni incorporation on structural, optical, and magnetic properties.

1994 ◽  
Vol 340 ◽  
Author(s):  
R. M. Biefeld ◽  
K. C. Baucom ◽  
S. R. Kurtz

ABSTRACTWe have prepared InAsSb/InGaAs strained-layer superlattice (SLS) semiconductors by metal-organic chemical vapor deposition (MOCVD) using a variety of growth conditions. The presence of an InGaAsSb interface layer is indicated by the x-ray diffraction patterns. The optimized growth conditions involved the use of low pressure, short purge times between the growth of the layers, and no reactant flow during the purges. We used MOCVD to prepare an optically pumped, single heterostructure InAsSb/InGaAs SLS / InPSb laser which emitted at 3.9 μm with a maximum operating temperature of approximately 100 K.


1993 ◽  
Vol 8 (10) ◽  
pp. 2644-2648 ◽  
Author(s):  
Jie Si ◽  
Seshu B. Desu

Pure and conducting RuO2 thin films were successfully deposited on Si, SiO2/Si, and quartz substrates at temperatures as low as 550 °C by a hot wall metal-organic chemical vapor deposition (MOCVD). Bis(cyclopentadienyl)ruthenium, Ru(C5H5)2, was used as the precursor. An optimized MOCVD process for conducting RuO2 thin films was established. Film structure was dependent on MOCVD process parameters such as bubbler temperature, dilute gas flow rates, deposition temperature, and total pressure. Either pure RuO2, pure Ru, or a RuO2 + Ru mixture was obtained under different deposition conditions. As-deposited pure RuO2 films were specular, crack-free, and well adhered on the substrates. The Auger electron spectroscopy depth profile showed good composition uniformity across the bulk of the films. The MOCVD RuO2 thin films exhibited a resistivity as low as 60 μω-cm. In addition, the reflectance of RuO2 in the NIR region had a metallic character.


1997 ◽  
Vol 12 (5) ◽  
pp. 1214-1236 ◽  
Author(s):  
Bruce J. Hinds ◽  
Richard J. McNeely ◽  
Daniel B. Studebaker ◽  
Tobin J. Marks ◽  
Timothy P. Hogan ◽  
...  

Epitaxial Tl2Ba2CaCu2O8 thin films with excellent electrical transport characteristics are grown in a two-step process involving metal-organic chemical vapor deposition (MOCVD) of a BaCaCuO(F) thin film followed by a postanneal in the presence of Tl2O vapor. Vapor pressure characteristics of the recently developed liquid metal-organic precursors Ba(hfa)2 • mep (hfa = hexafluoroacetylacetonate, mep = methylethylpentaglyme), Ca(hfa)2 • tet (tet = tetraglyme), and the solid precursor Cu(dpm)2 (dpm = dipivaloylmethanate) are characterized by low pressure thermogravimetric analysis. Under typical film growth conditions, transport is shown to be diffusion limited. The transport rate of Ba(hfa)2 • mep is demonstrated to be stable for over 85 h at typical MOCVD temperatures (120 °C). In contrast, the vapor pressure stability of the commonly used Ba precursor, Ba(dpm)2, deteriorates rapidly at typical growth temperatures, and the decrease in vapor pressure is approximately exponential with a half-life of ∼9.4 h. These precursors are employed in a low pressure (5 Torr) horizontal, hot-wall, film growth reactor for growth of BaCaCuO(F) thin films on (110) LaAlO3 substrates. From the dependence of film deposition rate on substrate temperature and precursor partial pressure, the kinetics of deposition are shown to be mass-transport limited over the temperature range 350–650 °C at a 20 nm/min deposition rate. A ligand exchange process which yields volatile Cu(hfa)2 and Cu(hfa) (dpm) is also observed under film growth conditions. The MOCVD-derived BaCaCuO(F) films are postannealed in the presence of bulk Tl2Ba2CaCu2O8 at temperatures of 720–890 °C in flowing atmospheres ranging from 0–100% O2. The resulting Tl2Ba2CaCu2O8 films are shown to be epitaxial by x-ray diffraction and transmission electron microscopic (TEM) analysis with the c-axis normal to the substrate surface, with in-plane alignment, and with abrupt film-substrate interfaces. The best films exhibit a Tc = 105 K, transport-measured Jc= 1.2 × 105 A/cm2 at 77 K, and surface resistances as low as 0.4 mΩ (40 K, 10 GHz).


1995 ◽  
Vol 10 (6) ◽  
pp. 1516-1522 ◽  
Author(s):  
Donhang Liu ◽  
Q. Wang ◽  
H.L.M. Chang ◽  
Haydn Chen

Tin oxide (SnO2) thin films were deposited on sapphire (0001) substrate by metal-organic chemical vapor deposition (MOCVD) at temperatures of 600 and 700 °C. The microstructure of the deposited films was characterized by x-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). At the growth conditions studied, films were single-phase rutile and epitaxial, but showed variant structures. Three distinct in-plane epitaxial relationships were observed between the films and the substrate. A crystallographic model is proposed to explain the film morphology. This model can successfully predict the ratio of the width to the length of an averaged grain size based upon the lattice mismatch of the film-substrate interface.


2008 ◽  
Vol 1068 ◽  
Author(s):  
Jung Hun Jang ◽  
A M Herrero ◽  
Seungyoung Son ◽  
B Gila ◽  
C Abernathy ◽  
...  

ABSTRACTGaN layers were grown on c-plane sapphire substrates by using a conventional two step growth method via metal organic chemical vapor deposition (MOCVD). The effect of different growth conditions used in the deposition of the low temperature nucleation layer and high temperature islands on the crystalline quality of the GaN layers was investigated by high resolution X-ray diffraction (HRXRD) and transmission electron microscopy (TEM). The polar (tilt) and azimuthal (twist) spread were estimated from the full width at half maximum (FWHM) values of the omega rocking curves (¥ø-RCs) recorded from the planes parallel and perpendicular to the sample surface. It was found from the XRD and TEM study that the edge and mixed type threading dislocations are dominant defects so that the relevant figure of merit (FOM) for the crystalline quality should be considered only by the FWHM value of ¥ø-RC of the surface perpendicular plane. The result showed that the mixed- and edge-types dislocations were strongly associated with the growth conditions used in the deposition of the nucleation layer and high temperature islands.


1992 ◽  
Vol 282 ◽  
Author(s):  
R. M. Biefeld

ABSTRACTIn metal organic chemical vapor deposition (MOCVD), the most commonly used sources are the trimethyls of Al, Ga, In, and Sb, and PH3 and ASH3. New organometallic sources are being developed as the understanding of the deposition process improvesand allows for the determination of the effects of source type and growth condition on the properties of the grown films. These new sources are safer and allow for the growth of higher purity materials using more favorable growth conditions. InSb and AlSb prepared using these trimethyl-sources are not of high enough quality to be used in many current device applications. Alternate organometallic Sb sources are being investigated to improve the materials characteristics of InSb grown by MOCVD.InSb grown using trimethylindium (TMIn) and trimethylantimony (TMSb) or triethylantimony (TESb) yielded similar quality materials under similar growth conditions. InSb grown using triethylindium (TEIn) and TESb under similar growth conditions yielded very poor quality n-type material. Three new organometallic Sb sources, triisopropylantimony (TIPSb), tris(dimethylamino)antimony (TDMASb), and tertiarybutyldimethylantimony (TBDMSb) are being investigated. The growth of InSb using TIPSb, TDMASb, or TBDMSb and TMIn was investigated over a temperature range of 350 to 475 °C. InSb grown from TDMASb had similar properties to InSb grown from TMIn and TMSbwhen using a similar temperature and V/III ratio range. The growth rates of InSb using TMIn and either TIPSb or TBDMSb at temperatures <= 425 °C were proportional to both the TMIn flow rate and the temperature. The surface morphology of InSb grown using eitherTIPSb or TBDMSb was very rough for growth temperatures <=425 °C. This may be due to the complex decomposition mechanisms involved and the presence of methyl groups on the surface. The InSb with the highest mobility was grown at 400 °C and a V/III ratioof 3 using TIPSb. It was n-type with a carrier concentration of 2.5 × 1015 cm−3 and a mobility of 78,160 cm2/Vs at 77 K. Both n- and p-type InSb were grown using TBDMSb with mobilities up to 67,530 and 7773 cm2/Vs, respectively at 77 K. The mobility for InSb using either TIPSb or TBDMSb was optimized by going to lower temperatures, pressures and V/III ratios. The opposite was truefor surface morphology which improved with higher temperature, pressure, and V/III ratio. The growth of high mobility InSb with smooth surfaces at T<=425 °C was not achieved with TIPSb or TBDMSb and TMIn under the conditions investigated in this work.


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