Beam Shaping for Cw Laser Recrystallization of Polysilicon Films
Keyword(s):
Cw Laser
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ABSTRACTA shaped laser beam has been used for laterally seeded recrystallization of polysilicon films over oxide. Direct maps of the shaped-beam intensity distribution in the wafer plane are correlated with the grain structure of the recrystallized polysilicon. Using 60% overlapping of shaped-beam scans along <100> directions, we have obtained seeded areas one mm wide and 50 to 500μm long. These consist of 40μm-wide adjacent single-crystal strips regularly separated by low-angle grain boundaries extending laterally away from the seed openings. The spacing between grain boundaries is equal to the scan spacing, providing a means for controlling the location of grain boundaries in otherwise defect-free, single-crystal films.
1965 ◽
Vol 11
(113)
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pp. 977-991
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1969 ◽
Vol 6
(4)
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pp. 641-644
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Structure of Palladium Single-Crystal Films Prepared by Flash Evaporation onto (001) NaCl Substrates
1970 ◽
Vol 28
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pp. 456-457
Keyword(s):
1998 ◽
Vol 157-158
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pp. 143-150
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Keyword(s):
1998 ◽
Vol 16
(4)
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pp. 2277-2280
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