Pulsed Laser Melting: The Effect of Implanted Solutes on the Resolidification Velocity

1983 ◽  
Vol 23 ◽  
Author(s):  
G. J. Galvin ◽  
J. W. Mayer ◽  
P. S. Peercy
Keyword(s):  
Electrical Conductance ◽  
Pulsed Laser ◽  
Solute Concentration ◽  
Atomic Percent ◽  
Supersaturated Solution ◽  
Solidification Velocity ◽  
Laser Melting ◽  
Solid Interface ◽  
Solution Studies ◽  
Nonequilibrium Segregation

ABSTRACTTransient electrical conductance has been used to measure the resolidification velocity in silicon containing implanted solutes. Nonequilibrium segregation of the solutes occurs during the rapid resolidification following pulsed laser melting. The velocity of the liquid-solid interface is observed to depend on the type and concentration of the solute. A 25% reduction in solidification velocity is observed for an implanted indium concentration of three atomic percent. Implanted oxygen is also shown to reduce the solidification velocity. The dependence of the velocity on solute concentration impacts a variety of segregation, trapping and supersaturated solution studies.

scholarly journals Interface Velocity Transients During Melting of a-Si/C-Si Thin Films

1988 ◽  
Vol 100 ◽  
Author(s):  
J. Y. Tsao ◽  
M. J. Aziz ◽  
P. S. Peercy ◽  
M. O. Thompson
Keyword(s):  
Thin Films ◽  
Steady State ◽  
Pulsed Laser ◽  
Interface Velocity ◽  
Interface Temperature ◽  
Laser Melting ◽  
Systematic Procedure ◽  
Solid Interface ◽  
Amorphous Si ◽  
Si Films

ABSTRACTWe report transient conductance measurements of liquid/solid interface velocities during pulsed laser melting of amorphous Si (a-Si) films on crystalline Si (c-Si), and a more accurate, systematic procedure for analyzing these measurements than described in previous work [1]. From these analyses are extracted relations between the melting velocities of a-Si and c-Si at a given interface temperature, and between the temperatures during steady-state melting of a-Si and c-Si at a given interface velocity.

The Crystallization and Amorphization of Si from the Melt at Interface Velocities Approaching 20 m/sec

1981 ◽  
Vol 4 ◽  
Author(s):  
J. M. Poate
Keyword(s):  
Heat Flow ◽  
Amorphous Phase ◽  
Interface Velocity ◽  
Solidification Velocity ◽  
Laser Melting ◽  
Substrate Orientation ◽  
Significant Lowering ◽  
Solid Interface ◽  
Amorphous Si

ABSTRACTLaser melting has been used to controllably vary the Si solidification velocity in the range 1–20 m/sec. The segregation of implanted impurities is found to be critically dependent on the liquid-solid interface velocity and substrate orientation for velocities <10 m/sec. This behavior can be understood in terms of different degrees of undercooling of the melt. While the (100) epitaxy is generally excellent up to velocities ∼10 m/sec, twins are observed for (111) epitaxy in the range ∼5–10 m/sec. Amorphous Si is produced from the melt for velocities in the vicinity of 20 m/sec. The amorphous phase forms at lower velocities on the (111) interface than on the (100) interface. These estimates of interface velocities come from heat flow calculations which do not include undercooling of the melt. Undercooling does not affect interface velocities ∼3 m/sec but significant lowering of the higher velocities could result from such effects.

Interfacial overheating during melting of Si at 190 m/s

1987 ◽  
Vol 2 (1) ◽  
pp. 91-95 ◽  
Author(s):  
J. Y. Tsao ◽  
P. S. Peercy ◽  
Michael O. Thompson
Keyword(s):  
Energy Balance ◽  
Real Time ◽  
Pulsed Laser ◽  
Interface Velocity ◽  
Laser Melting ◽  
Solid Interface ◽  
Upper Limit ◽  
Balance Analysis ◽  
Energy Balance Analysis ◽  
Kinetics Of

An upper limit is placed on the overheating at the liquid/solid interface during melting of (100) Si at high interface velocity. The limit is based on an energy-balance analysis of melt depths measured in real time during pulsed-laser melting of Si on sapphire. When combined with previous measurements of the freezing kinetics of Si, this limit indicates that the kinetics of melting and freezing are nonlinear, i.e., the undercooling required to freeze at modest (15 m/s) velocities is proportionately much greater than the overheating required to melt at high (190 m/s) velocities.

scholarly journals The Al Doping Effect on Epitaxial (In,Mn)As Dilute Magnetic Semiconductors Prepared by Ion Implantation and Pulsed Laser Melting

Materials ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4138
Author(s):  
Ye Yuan ◽  
Yufang Xie ◽  
Ning Yuan ◽  
Mao Wang ◽  
René Heller ◽  
...  
Keyword(s):  
Curie Temperature ◽  
Ion Implantation ◽  
Diluted Magnetic Semiconductors ◽  
Laser Annealing ◽  
Magnetic Semiconductors ◽  
Dilute Magnetic Semiconductors ◽  
Pulsed Laser ◽  
Laser Melting ◽  
Co Doping ◽  
Diluted Magnetic

One of the most attractive characteristics of diluted ferromagnetic semiconductors is the possibility to modulate their electronic and ferromagnetic properties, coupled by itinerant holes through various means. A prominent example is the modification of Curie temperature and magnetic anisotropy by ion implantation and pulsed laser melting in III–V diluted magnetic semiconductors. In this study, to the best of our knowledge, we performed, for the first time, the co-doping of (In,Mn)As diluted magnetic semiconductors by Al by co-implantation subsequently combined with a pulsed laser annealing technique. Additionally, the structural and magnetic properties were systematically investigated by gradually raising the Al implantation fluence. Unexpectedly, under a well-preserved epitaxial structure, all samples presented weaken Curie temperature, magnetization, as well as uniaxial magnetic anisotropies when more aluminum was involved. Such a phenomenon is probably due to enhanced carrier localization introduced by Al or the suppression of substitutional Mn atoms.

Formation of single crystal sulfur supersaturated silicon based junctions by pulsed laser melting

2007 ◽  
Vol 25 (6) ◽  
pp. 1847 ◽  
Author(s):  
Malek Tabbal ◽  
Taegon Kim ◽  
Jeffrey M. Warrender ◽  
Michael J. Aziz ◽  
B. L. Cardozo ◽  
...  
Keyword(s):  
Single Crystal ◽  
Pulsed Laser ◽  
Laser Melting ◽  
Silicon Based

Ti-doped Gallium Phosphide Layers with Concentrations Above the Mott Limit

2009 ◽  
Vol 1210 ◽  
Author(s):  
Javier Olea Ariza ◽  
David Pastor ◽  
María Toledano-Luque ◽  
Ignacio Mártil ◽  
Germán González-Díaz ◽  
...  
Keyword(s):  
Gallium Phosphide ◽  
Vibrational Mode ◽  
Pulsed Laser ◽  
X Ray Diffraction ◽  
Laser Melting ◽  
Intermediate Band ◽  
X Ray ◽  
Tof Sims ◽  
Crystalline Domains ◽  
Secondary Ion

AbstractWe have studied the Pulsed-Laser Melting (PLM) effects on Ti implanted GaP to form an Intermediate Band (IB). Structural analysis has been carried out by means of Time of Flight Secondary Ion Mass Spectroscopy (ToF-SIMS), Raman spectroscopy and Glancing Incidence X-Ray Diffraction (GIXRD). After the PLM annealing, Ti concentration is over the Mott limit. Nevertheless, the Raman spectra show a forbidden TO vibrational mode of GaP. This result suggests the formation of crystalline domains with a different orientation in the annealed region regarding to the GaP unannealed substrate. This conclusion has been corroborated by GIXRD measurements. As a result of the polycrystalline lattice, a drop of the mobility is produced.

Heat Transfer and Phase Transformations in Laser Annealing of Thin a-Si Films

2001 ◽  
Author(s):  
Seung-Jae Moon ◽  
Minghong Lee ◽  
Costas P. Grigoropoulos
Keyword(s):  
Laser Annealing ◽  
Thermal Emission ◽  
Electrical Conductance ◽  
Nanosecond Laser ◽  
Solidification Velocity ◽  
Emission Measurement ◽  
Excimer Laser Annealing ◽  
In Situ Experiments ◽  
Si Films

Abstract The liquid-solid interface motion and the temperature history of thin Si films during excimer laser annealing are observed by in situ experiments combining time-resolved (∼lns) thermal emission measurements, optical reflectance and transmittance at near-IR wavelengths and electrical conductance measurements. The spontaneous nucleation temperature in the supercooled liquid melt is studied from the thermal emission measurement A new double laser recrystallization technique using a temporally modulated CW Ar+ laser in conjunction with a superposed nanosecond laser pulse produces lateral grain growth at the irradiated spot. The laser melting process is numerically simulated. High-resolution laser flash photography enabled in-situ direct visualization of the resolidification process. The images reveal lateral solidification velocity of about 10 m/s.

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