Experimental Analysis of the Adhesion of Copper and Chromium Films Deposited on a Polymer
Keyword(s):
AbstractAn analysis of bulk and interfacial damage of film/substrate systems consisting of copper or chromium films deposited on a single polymer substrate, is presented here. For these systems (metal/single polymer substrate) the failure analysis is based on the experimental results obtained from deformation experiments performed in a scanning electron microscope. Critical parameters deduced from the experiments, and microstructural observations allow us to discuss the mechanical behaviour of these systems, and their interfacial adhesion properties.
2011 ◽
Vol 217-218
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pp. 1601-1605
2005 ◽
Vol 473-474
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pp. 465-470
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1973 ◽
Vol 31
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pp. 210-211
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pp. 20-21
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Vol 29
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pp. 26-27
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Vol 28
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pp. 386-387
1973 ◽
Vol 31
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pp. 44-45