Influence of Tin-Chloride Pretreatment on Mirror Coating Adhesion

2005 ◽  
Vol 473-474 ◽  
pp. 465-470 ◽  
Author(s):  
A. Nagy ◽  
Norbert Hegman
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Glass Surface ◽  
Scratch Test ◽  
Float Glass ◽  
Properties Of Coatings ◽  
Adhesion Properties ◽  
Tin Chloride ◽  
Scratch Track ◽  
Scanning Electron

Our research focused on the adhesion properties of mirror coating on silica float glass due to applying different quantity of tin-chloride sensitizing agent. Investigation was carried out to detect the distribution and quantity of tin containing clusters deposited on the glass surface working as crystallization centre. The adhesion properties of coatings were tested by scratch test where critical peeling forces were evaluated. The morphology of the formed scratch track was measured with scanning electron microscope. The surface topography was scanned by AFM technique.

Effects of Bias Voltage on Properties of (Ti, Al)N Coatings

2013 ◽  
Vol 281 ◽  
pp. 426-429
Author(s):  
Tao Chen ◽  
Hua Wu ◽  
Qing Hui Wang
Keyword(s):  
Mechanical Properties ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Bias Voltage ◽  
X Ray Diffraction ◽  
Properties Of Coatings ◽  
X Ray ◽  
Research Results ◽  
Microstructure And Mechanical Properties ◽  
Scanning Electron

PVD method is used to deposit (Ti,Al)N coatings on the surface of W6Mo5Cr4V2 steels. The value of bias voltage changes from -100V to -400V. X-ray diffraction (XRD), Scanning electron microscope(SEM) and UNMT-1 were employed to analysis the microstructure and mechanical properties of (Ti,Al)N coatings. The research results showed that the microstructure and mechanical properties of coatings became better when the value of bias voltage was -400V. The size and quantity of particles on coatings both decreased obviously. The adhesion between coatings and substrates increase to 54.6N. The hardness of (Ti,Al)N coatings rise to 39.7N.

Experimental Analysis of the Adhesion of Copper and Chromium Films Deposited on a Polymer

1992 ◽  
Vol 264 ◽  
Author(s):  
M. Ignat ◽  
L. Fayette ◽  
P. Normandon ◽  
F. Templier ◽  
J. Torres
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Interfacial Adhesion ◽  
Polymer Substrate ◽  
Critical Parameters ◽  
Interfacial Damage ◽  
Adhesion Properties ◽  
Film Substrate ◽  
Chromium Films ◽  
Scanning Electron

AbstractAn analysis of bulk and interfacial damage of film/substrate systems consisting of copper or chromium films deposited on a single polymer substrate, is presented here. For these systems (metal/single polymer substrate) the failure analysis is based on the experimental results obtained from deformation experiments performed in a scanning electron microscope. Critical parameters deduced from the experiments, and microstructural observations allow us to discuss the mechanical behaviour of these systems, and their interfacial adhesion properties.

Effect of Welding on Hardness and Deformation Behavior of Polypropylene by Scratch Test

2016 ◽  
Vol 848 ◽  
pp. 27-30
Author(s):  
Thanaporn Boonchoo ◽  
Jirasak Tharajak
Keyword(s):  
Electron Microscope ◽  
Wear Rate ◽  
Scanning Electron Microscope ◽  
Deformation Behavior ◽  
Welding Process ◽  
Scratch Test ◽  
Hardness Tester ◽  
Hot Gas ◽  
Automotive Parts ◽  
Scanning Electron

Hot gas welding has been used in the process of polypropylene (PP) welding in many applications. It was appropriate for various multipart productions such as plastic constructions, automotive parts, tanks and pipeline. However, the surface properties of welded areas were varied particularly at each zone and thus affected numerous scratch resistances. The microstructure of scratch trace, hardness and scratch wear rate were studied by scanning electron microscope, hardness tester and scratch tester, respectively. From the results, it was found that the deformation of PP was induced with welding process. The scratch trace was showed that it related with decreasing of hardness properties.

scholarly journals Adaptability of different canal sealers to the root canal dentin - scanning electron microscopy analysis

2017 ◽  
Vol 70 (5-6) ◽  
pp. 141-145
Author(s):  
Sonja Apostolska ◽  
Elizabeta Gjorgievska ◽  
Vasilka Rendzova ◽  
Marina Eftimoska ◽  
Rade Zivkovic ◽  
...  
Keyword(s):  
Zinc Oxide ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Root Canal ◽  
Canal Wall ◽  
Adhesive Properties ◽  
Adhesion Properties ◽  
Gutta Percha ◽  
Sealing Ability ◽  
Scanning Electron

Introduction. The aim of this in vitro study was to test and analyze the sealing ability of three endodontic materials used for permanent obturation, in between the dentin walls and the gutta-percha points, using a scanning electron microscope. Material and Methods. Forty-five recently extracted single-root teeth, treated by a step-back technique, were divided into three groups (15 teeth in each); the canals were filled with three different permanent obturation materi?als: N2 - zinc oxide root canal cement, Gutta Flow (Coltene), and Endomethasone N (Septodont). Their sealing ability and adhesive properties were analyzed using field emission gun scanning electron microscope, at the time when they were applied between the dentin walls of the canal and the gutta-percha. Results. The results of the scanning electron microscope analysis have shown that all the three sealers have good adhesion properties when used over the root canal walls in the apical third. Good adaptation of the filling used for the root canal walls in the middle and the cervical third was found only in teeth obturated using Gutta Flow, while samples obturated by N2 - zinc oxide root canal cement and Endomethasone showed the weak?est adhesion, and greatest number of cracks between the sealer and the canal wall. Conclusion. When using a single-cone obturation technique, compared to other obturation materials, Gutta Flow shows considerably better adaptation to the root canal wall and the gutta-percha points in the apical, middle, and the cervical third of the root.

The Alteration of the Pore Spaces in Sandstones

1973 ◽  
Vol 31 ◽  
pp. 210-211
Author(s):  
R. E. Ferrell ◽  
G. G. Paulson
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
The Other ◽  
Coarse Grained ◽  
Depositional Fabric ◽  
Soluble Components ◽  
Scanning Electron ◽  
Shape And Size

The pore spaces in sandstones are the result of the original depositional fabric and the degree of post-depositional alteration that the rock has experienced. The largest pore volumes are present in coarse-grained, well-sorted materials with high sphericity. The chief mechanisms which alter the shape and size of the pores are precipitation of cementing agents and the dissolution of soluble components. Each process may operate alone or in combination with the other, or there may be several generations of cementation and solution.The scanning electron microscope has ‘been used in this study to reveal the morphology of the pore spaces in a variety of moderate porosity, orthoquartzites.

The Broad Applications of the Scanning Electron Microscope

1969 ◽  
Vol 27 ◽  
pp. 20-21
Author(s):  
C. T. Nightingale ◽  
S. E. Summers ◽  
T. P. Turnbull
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Light Microscopy ◽  
Surface Topography ◽  
Great Depth ◽  
Resolving Power ◽  
Depth Of Field ◽  
Pictorial Representations ◽  
Scanning Electron

The ease of operation of the scanning electron microscope has insured its wide application in medicine and industry. The micrographs are pictorial representations of surface topography obtained directly from the specimen. The need to replicate is eliminated. The great depth of field and the high resolving power provide far more information than light microscopy.

Observability of Very Thick Specimen by Using Transmission Scanning Electron Microscope

1971 ◽  
Vol 29 ◽  
pp. 26-27
Author(s):  
K. Shibatomi ◽  
T. Yamanoto ◽  
H. Koike
Keyword(s):  
Electron Microscope ◽  
Image Quality ◽  
Scanning Electron Microscope ◽  
Chromatic Aberration ◽  
Image Contrast ◽  
Objective Lens ◽  
Thick Specimen ◽  
Transmission Electron ◽  
Scanning Electron

In the observation of a thick specimen by means of a transmission electron microscope, the intensity of electrons passing through the objective lens aperture is greatly reduced. So that the image is almost invisible. In addition to this fact, it have been reported that a chromatic aberration causes the deterioration of the image contrast rather than that of the resolution. The scanning electron microscope is, however, capable of electrically amplifying the signal of the decreasing intensity, and also free from a chromatic aberration so that the deterioration of the image contrast due to the aberration can be prevented. The electrical improvement of the image quality can be carried out by using the fascionating features of the SEM, that is, the amplification of a weak in-put signal forming the image and the descriminating action of the heigh level signal of the background. This paper reports some of the experimental results about the thickness dependence of the observability and quality of the image in the case of the transmission SEM.

Resolution of a Transmitted Electron Image Formed by A Scanning Electron Microscope

1970 ◽  
Vol 28 ◽  
pp. 386-387
Author(s):  
S. Takashima ◽  
H. Hashimoto ◽  
S. Kimoto
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Chromatic Aberration ◽  
Objective Lens ◽  
Specimen Thickness ◽  
Probe Diameter ◽  
Transmission Electron ◽  
Electron Image ◽  
Conventional Transmission Electron Microscope ◽  
Scanning Electron

The resolution of a conventional transmission electron microscope (TEM) deteriorates as the specimen thickness increases, because chromatic aberration of the objective lens is caused by the energy loss of electrons). In the case of a scanning electron microscope (SEM), chromatic aberration does not exist as the restrictive factor for the resolution of the transmitted electron image, for the SEM has no imageforming lens. It is not sure, however, that the equal resolution to the probe diameter can be obtained in the case of a thick specimen. To study the relation between the specimen thickness and the resolution of the trans-mitted electron image obtained by the SEM, the following experiment was carried out.

Characterization of Sputtered Films using the Scanning Electron Microscope

1973 ◽  
Vol 31 ◽  
pp. 44-45
Author(s):  
R. F. Schneidmiller ◽  
W. F. Thrower ◽  
C. Ang
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Sputtered Films ◽  
Plasma Sputtering ◽  
Microelectronic Devices ◽  
Control Film ◽  
Scanning Electron

Solid state materials in the form of thin films have found increasing structural and electronic applications. Among the multitude of thin film deposition techniques, the radio frequency induced plasma sputtering has gained considerable utilization in recent years through advances in equipment design and process improvement, as well as the discovery of the versatility of the process to control film properties. In our laboratory we have used the scanning electron microscope extensively in the direct and indirect characterization of sputtered films for correlation with their physical and electrical properties.Scanning electron microscopy is a powerful tool for the examination of surfaces of solids and for the failure analysis of structural components and microelectronic devices.

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