Activation of N-Acceptor in MOCVD-ZnSe by Excimer Laser Annealing

1992 ◽  
Vol 281 ◽  
Author(s):  
Nallan Padmapani ◽  
G. F. Neumark ◽  
N. Taskar ◽  
D. Dorman

ABSTRACTThe recent success in obtaining blue-green diode lasers using ZnSe-based heterostructures has been mainly due to the successful p-doping of ZnSe using a N plasma source in an MBE system. P-type ZnSe can also be grown by MOCVD, using NH3 as the dopant source. Dopant concentrations of up to 1018 cm−3 have been obtained but net acceptor concentrations are in the range of only about 1015 cm−3 Activation of the remaining N has been achieved to some extent (NA -ND∼3*1016cm−3 ) by rapid thermal annealing. However, this has had limited success. We have used fast surface annealing by an excimer laser to activate the N. We have observed an increase in the ratio of Acceptor Bound Exciton peak intensity to Free Exciton peak intensity on annealing and this effect increases as we increase the laser power density from 10 to 30 MW/cm2. Electrical measurements ( C-V ) give a net acceptor concentration of ∼2*1016 cm−3 and thus confirm the increase in carrier concentration after annealing.

Author(s):  
X. Du ◽  
J. J. Dubowski ◽  
M. Post ◽  
D. Wang ◽  
J. Tunney

2008 ◽  
Author(s):  
Norie Matsubara ◽  
Tomohiko Ogata ◽  
Takanori Mitani ◽  
Shinji Munetoh ◽  
Teruaki Motooka

1992 ◽  
Vol 283 ◽  
Author(s):  
Hiroshi Iwata ◽  
Tomoyuki Nohda ◽  
Satoshi Ishida ◽  
Takashi Kuwahara ◽  
Keiichi Sano ◽  
...  

ABSTRACTThe grain size of phosphorous (P)-doped poly-Si film has been enlarged to about 5000 Å by controlling the solidification velocity of molten Si during ArF excimer laser annealing. The drastically enlarged grain has few defects inside the grain. It has been confirmed that control of the solidification velocity is effective for P-doped poly-Si similar to the case of non-doped poly-Si films. In addition, a sheet resistance of 80 Ω/□ (ρ = 4 × 10-4 Ω · cm) has been achieved for very thin (500 Å) films by recrystallizing PECVD P-doped a-Si films.


2006 ◽  
Vol 45 (4A) ◽  
pp. 2726-2730 ◽  
Author(s):  
Naoya Kawamoto ◽  
Atsushi Masuda ◽  
Naoto Matsuo ◽  
Yasuhiro Seri ◽  
Toshimasa Nishimori ◽  
...  

1998 ◽  
Vol 136 (4) ◽  
pp. 298-305 ◽  
Author(s):  
A.L Stepanov ◽  
D.E Hole ◽  
A.A Bukharaev ◽  
P.D Townsend ◽  
N.I Nurgazizov

1988 ◽  
Vol 116 ◽  
Author(s):  
A. Georgakilas ◽  
M. Fatemi ◽  
L. Fotiadis ◽  
A. Christou

AbstractOne micron thick AlAs/GaAs structures have been deposited by molecular beam epitaxy onto high resistivity silicon substrates. Subsequent to deposition, it is shown that Excimer laser annealing up to 120mJ/cm2 at 248nm improves the GaAs mobility to approximately 2000cm2 /v-s. Dislocation density, however, did not decrease up to 180mJ/cm2 showing that improvement in transport properties may not be accompanied by an associated decrease in dislocation density at the GaAs/Si interface.


Shinku ◽  
2000 ◽  
Vol 43 (12) ◽  
pp. 1120-1125 ◽  
Author(s):  
Naoto MATSUO ◽  
Hisashi ABE ◽  
Naoya KAWAMOTO ◽  
Ryouhei TAGUCHI ◽  
Tomoyuki NOUDA ◽  
...  

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