Er-Doping in Silicon by Pulsed Laser Irradiation

1993 ◽  
Vol 301 ◽  
Author(s):  
Kenshiro Nakashima
Keyword(s):  
Energy Density ◽  
Laser Irradiation ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Laser Energy Density ◽  
Er Doping ◽  
Erbium Ions ◽  
State Regime ◽  
Er Doped ◽  
Pulsed Laser Irradiation

ABSTRACTErbium ions were successfully doped in silicon by pulsed laser irradiation above the threshold laser energy density. Photoluminescence peaks at 1.54, 1.59 and 1.64 µm from Er-optical centers were observed after annealing of Er-doped samples. The intensity of the 1.54 µm Er-emission band increased upon increase in the laser energy density, and then gradually decreased after reaching the maximum, due to the laser sputtering of the silicon substrate. Oxygen atoms, which were unintentionally codoped with Er-ions, were found to be distributed in the same region as in Er-ions, and were suggested to play roles to activate Er-optical centers. The maximum concentration of Er-ions doped in the solid state regime were estimated to be the order of 1018 cm−3 by the Rutherford backscattering measurements.

Doping of GaAs From Silane Decomposition Under Pulsed Laser Irradiation

1983 ◽  
Vol 29 ◽  
Author(s):  
D. Pribat ◽  
D. Dieumegard ◽  
B. Dessertenne ◽  
J. Chaplart
Keyword(s):  
High Pressure ◽  
Energy Density ◽  
Laser Irradiation ◽  
Sheet Resistance ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Compensation Mechanism ◽  
Yag Laser ◽  
Oxygen Penetration ◽  
Pulsed Laser Irradiation

ABSTRACTWe have studied silicon incorporation in GaAs subsequent to Nd-YAG laser irradiation through high pressure silane atmospheres. The process involves SiH4 pyrolysis at contact with a laser-melted GaAs surface, and incorporation of the released Si atoms in the melt. SIMS analyses have allowed us to study silicon incorporation as a function of SiH4 pressure, laser energy density and number of laser shots. The high sheet resistance of the doped layers indicates that the silicon atoms are poorly electrically activated. A compensation mechanism is discussed based on oxygen penetration from native GaAs oxide layers.

Formation of polytype microstructure in pulsed-laser-irradiated sapphire substrates

1995 ◽  
Vol 53 ◽  
pp. 344-345
Author(s):  
Siqi Cao ◽  
A. J. Pedraza ◽  
L. F. Allard ◽  
D. H. Lowndes
Keyword(s):  
Energy Density ◽  
Laser Irradiation ◽  
Electroless Deposition ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Surface Modifications ◽  
Near Surface ◽  
Sapphire Substrates ◽  
Hcp Structure ◽  
Pulsed Laser Irradiation

Surface modifications of wide-gap materials are produced by pulsed laser irradiation. Under given conditions, these near-surface modifications can promote adhesion enhancement of deposited thin film materials, and activation for electroless deposition. AIN decomposes during laser irradiation leaving a metallic film on the surface. High density dislocations were observed in the surface layer of AIN that was laser melted but not decomposed. The laser melted alumina becomes amorphous at a laser energy density of ~1J/cm2. In sapphire, γ-alumina is formed when the sample is laser irradiated in Ar/4%H2. Here, we report the formation of a new structure in laser-irradiated sapphire.Optically polished c-axis sapphire substrates were laser-irradiated in an Ar/4%H2 atmosphere at 4J/cm2 energy density, using a 308 nm-wavelength laser with a pulse duration of ~40 ns. Sapphire (A12O3) has a space group R 3 c and can be described as an hcp structure having oxygen and aluminum layers alternately stacking along the c-axis.

The Shallow Implantation of Bismuth During the Growth of Bismuth Nanocrystals in Al2O3 by Pulsed Laser Deposition

2003 ◽  
Vol 780 ◽  
Author(s):  
A. Suárez-García ◽  
J-P. Barnes ◽  
R. Serna ◽  
A. K. Petford-Long ◽  
C. N. Afonso ◽  
...  
Keyword(s):  
Energy Density ◽  
Cross Section ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Laser Deposition ◽  
Laser Energy Density ◽  
X Ray ◽  
Continuous Layer ◽  
Transmission Electron ◽  
Order Of Magnitude

AbstractThe effect of the laser energy density used to deposit Bi onto amorphous aluminum oxide (a-Al2O3) on the growth of Bi nanocrystals has been investigated using transmission electron microscopy of cross section samples. The laser energy density on the Bi target was varied by one order of magnitude (0.4 to 5 J cm-2). Across the range of energy densities, in addition to the Bi nanocrystals nucleated on the a-Al2O3 surface, a dark and apparently continuous layer appears below the nanocrystals. Energy dispersive X-ray analysis on the layer have shown it is Bi rich. The separation from the Bi layer to the bottom of the nanocrystals on top is consistent with the implantation range of Bi species in a-Al2O3. As the laser energy density increases, the implantation range has been measured to increase. The early stages of the Bi growth have been analyzed in order to determine how the Bi implanted layer develops.

Formation of Q-carbon by adjusting sp3 content in diamond-like carbon films and laser energy density of pulsed laser annealing

Carbon ◽  
2020 ◽  
Vol 167 ◽  
pp. 504-511 ◽  
Author(s):  
Hiroki Yoshinaka ◽  
Seiko Inubushi ◽  
Takanori Wakita ◽  
Takayoshi Yokoya ◽  
Yuji Muraoka
Keyword(s):  
Energy Density ◽  
Laser Annealing ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Carbon Films ◽  
Laser Energy Density ◽  
Diamond Like Carbon ◽  
Pulsed Laser Annealing

Electrical Properties of Solid Phase Crystallized Silicon Films

2001 ◽  
Vol 664 ◽  
Author(s):  
Tadashi Watanabe ◽  
Hajime Watakabe ◽  
Toshiyuki Sameshima
Keyword(s):  
Heat Treatment ◽  
Electrical Conductivity ◽  
Energy Density ◽  
Laser Irradiation ◽  
Carrier Mobility ◽  
Crystalline Silicon ◽  
Solid Phase ◽  
Laser Energy ◽  
Silicon Films ◽  
Laser Energy Density

ABSTRACTIn this study, the carrier mobility and density for solid phase crystallized (SPC) silicon films fabricated at 600 °C for 48 hours are analyzed by free carrier optical absorption. The carrier mobility is 40 cm2/Vs for SPC films doped with 6×1019-cm−3-phosphorus atoms. This analysis suggests the SPC films have fine crystalline grains closed to single crystalline silicon. In addition, initial carrier density was 3×1019 cm−3, which increased to 6×1019 cm−3by XeCl excimer laser irradiation of 500mJ/cm2. The inactivated regions in SPC films are reduced by laser irradiation. However, the electrical conductivity after laser irradiation for SPC films doped with 6×1018-cm−3-phosphorus atoms decreased from 3.3 to 0.018 S/cm as laser energy density increased to 500mJ/cm2. On the other hand, the electrical conductivity increased from 14.7 to 31.3 S/cm with similar increase of laser energy density after H2O vapor heat treatment at 260°C for 3 hours with 1.3 MPa. Furthermore, the characteristics of n-channel TFTs fabricated with initial SPC films as well as SPC films which was irradiated by laser at 425mJ/cm2 are also researched. The threshold voltage is decreased from 3.8 to 2.0 V by laser irradiation. Threshold voltages of both cases are decreased from 3.8 to 2.4 V for no-laser irradiation and from 2.0 to 0.8 V for laser irradiation, after H2O vapor heat treatment at 310°C for 1 hour with 9.0MPa. Based on the above trial, the defect reduction method combining laser irradiation and H2O vapor heat treatment has proved to be very effective for SPC films and SPC TFTs.

Low-Energy, Pulsed-Laser Irradiation of Amorphous Silicon: Melting and Resolidification at Two Fronts

1984 ◽  
Vol 35 ◽  
Author(s):  
W. Sinke ◽  
F.W. Saris
Keyword(s):  
Amorphous Silicon ◽  
Laser Irradiation ◽  
Surface Segregation ◽  
Crystalline Silicon ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Surface Region ◽  
Low Energy ◽  
Double Peak Structure ◽  
Pulsed Laser Irradiation

ABSTRACTAfter low-energy pulsed-laser irradiation of Cu-implanted silicon, a double-peak structure is observed in the Cu concentration profile, which results from the occurrence of two melts. From Cu surface segregation we calculate the depth of the surface melt. Cu segregation near the position of the amorphous-crystalline interface gives evidence for a self-propagating melt, moving from the surface region towards the crystalline substrate. Measurements of As-redistribution and of sheet resistance as a function of laser energy density in As-implanted silicon are consistent with the crystallization model which is derived from the effects as observed in Cu-implanted silicon.The results imply a large difference in melting temperature, heat conductivity and heat of melting between amorphous silicon and crystalline silicon.

Laser Energy Dependent Structure of Pulsed Laser Deposited Barium Dititanate Films

2009 ◽  
Vol 66 ◽  
pp. 183-186
Author(s):  
L. Li ◽  
Chuan Bin Wang ◽  
Qiang Shen ◽  
Lian Meng Zhang
Keyword(s):  
Energy Density ◽  
Surface Morphology ◽  
Pulsed Laser Deposition ◽  
Laser Energy ◽  
Pulsed Laser ◽  
Preferred Orientation ◽  
Laser Deposition ◽  
Laser Energy Density ◽  
Energy Dependent ◽  
Deposited Films

Barium dititanate (BaTi2O5) films were prepared on MgO (100) substrate by pulsed laser deposition under various laser energy densities. The effect of laser energy on crystallinity, orientation and surface morphology was investigated. The preferred orientation of the as-deposited films changes from (710) to (020) with decreasing laser energy, and the surface morphology is different depending on laser energy too. The b-axis oriented BaTi2O5 film could be obtained at the laser energy density of 2J/cm2, where the film shows a dense surface with an elongated granular texture.

Pulsed Laser Etching of GaN and AIN Films

1997 ◽  
Vol 482 ◽  
Author(s):  
H. Chen ◽  
R. D. Vispute ◽  
V. Talyansky ◽  
R. Enck ◽  
S. B. Ogale ◽  
...  
Keyword(s):  
Energy Density ◽  
Laser Energy ◽  
Etching Rate ◽  
Pulsed Laser ◽  
Dry Etching ◽  
Laser Energy Density ◽  
Etch Depth ◽  
Layer By Layer ◽  
Laser Etching ◽  
Wide Range

AbstractDue to limited success in wet etching of GaN and AIN, dry etching techniques have become more relevant for the processing of the GaN films. Here we demonstrate the results of an alternative dry etching process, namely, pulsed laser etching, for GaN and AIN. In this method, a KrF pulsed excimer laser (λ=248 nm, τ=30 ns) was used to etch epitaxial GaN and AIN films. The dependence of the etching characteristics on the laser energy density and the number of pulses has been studied. The etch depth showed a linear dependence on the number of pulses over a wide range of laser energy densities. The threshold intensity for GaN etching was determined to be 0.33 J/cm2. The etching rate was found to be a strong function of laser energy density. Above the threshold, the etch rate was found to be 300–1400 Å per pulse leading to etching rates of 0.1–1μm/sec depending upon the laser energy density and the pulse repetition rate. It is shown that the etching mechanism is based on laser induced absorption, decomposition and layer by layer removal of the GaN.

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