Applications of CoSi2 to VLSI and ULSI

1993 ◽  
Vol 320 ◽  
Author(s):  
S. P. Murarka
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Integrated Circuits ◽  
Lattice Mismatch ◽  
Electrical Contacts ◽  
High Conductivity ◽  
Low Resistivity ◽  
Polysilicon Films ◽  
Continued Use

ABSTRACTSilicides have found application as high conductivity, high temperature, and corrosion resistance materials that form good electrical contacts to silicon and good low resistivity cladding on polysilicon films used as gate metal. Of various silicides investigated in past CoSi2 offers several advantages including lowest resistivity, self-aligned formation, low lattice mismatch with silicon, stability in presence of dopants and on SiO2, Si3N4, or Sioxynitrides, and reliability to process temperatures ≤900°C even when used in thicknesses as thin as 50-60 nm. Thus, CoSi2 has found an application in VLSI and ULSI. In this paper, the properties, formation and processing, reliability, and applicability of CoSi2 will be reviewed. It will be shown that CoSi2 is only silicide that offers properties and reliability for continued use in sub-0.25 pm VLSI and ULSI integrated circuits.

CRM MOLYBDENUM-50 RHENIUM

Alloy Digest ◽  
1970 ◽  
Vol 19 (12) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Powder Metallurgy ◽  
Melting Point ◽  
Physical Properties ◽  
Heat Treating ◽  
Electrical Contacts ◽  
High Melting ◽  
High Melting Point ◽  
Temperature Performance

Abstract CRM MOLYBDENUM-50 RHENIUM is a high-melting-point alloy for applications such as electronics tube components, electrical contacts, thermionic converters, thermocouples, heating elements and rocket thrusters. All products are produced by powder metallurgy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Mo-11. Producer or source: Chase Brass & Copper Company Inc..

MUELLER ALLOY 1450

Alloy Digest ◽  
1980 ◽  
Vol 29 (2) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Pure Copper ◽  
Heat Treating ◽  
High Conductivity ◽  
General Corrosion ◽  
Temperature Performance ◽  
Screw Machine ◽  
Machining Characteristics

Abstract MUELLER Alloy 1450 (formerly MBCo Alloy 799) is a high-conductivity copper containing sufficient small copper telluride particles to provide free-machining characteristics superior to those of any other high-conductivity copper. It has the same general corrosion resistance as copper. It is used widely for electrical or thermal conductors requiring extensive machining and for screw-machine products requiring a color that matches pure copper. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-389. Producer or source: Mueller Brass Company.

CRM RHENIUM

Alloy Digest ◽  
1970 ◽  
Vol 19 (8) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Powder Metallurgy ◽  
Melting Point ◽  
Heat Treating ◽  
Electrical Contacts ◽  
High Melting ◽  
High Melting Point ◽  
Temperature Performance ◽  
Commercially Pure

Abstract CRM RHENIUM is a commercially pure, high-melting-point metal for applications such as electronics tube components, electrical contacts, thermionic converters, thermocouples, heating elements and rocket thrusters. All products are produced by powder metallurgy. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Re-1. Producer or source: Chase Brass & Copper Company Inc..

AMPCOLOY 910

Alloy Digest ◽  
1975 ◽  
Vol 24 (4) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Elevated Temperatures ◽  
Heat Treating ◽  
High Conductivity ◽  
Good Strength ◽  
Temperature Performance

Abstract AMPCOLOY 910 is copper containing 0.12% zirconium. It retains high conductivity with good strength, hardness and ductility at elevated temperatures. It is used in a variety of applications such as collector rings, current-carrying shafts and bearings. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-295. Producer or source: Ampco Metal Inc..

COPPER ALLOY No. 194

Alloy Digest ◽  
1971 ◽  
Vol 20 (5) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Copper Alloy ◽  
High Strength ◽  
Heat Treating ◽  
High Conductivity ◽  
Temperature Performance

Abstract COPPER ALLOY No. 194 is a relatively high-conductivity, high-strength modified copper which is in general use in the electrical and electronic industries. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep and fatigue. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cu-233. Producer or source: Anaconda American Brass Company.

OFHC COPPER

Alloy Digest ◽  
1964 ◽  
Vol 13 (8) ◽  
Keyword(s):  
Fracture Toughness ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Heat Treating ◽  
High Conductivity ◽  
Ofhc Copper ◽  
Temperature Performance

Abstract OFHC copper is a high conductivity, oxygen free grade of copper furnished in two grades, namely, Regular Grade and Certified Grade. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness and creep. It also includes information on low and high temperature performance, and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cu-144. Producer or source: American Metal Climax Inc..

OLIN STRESCON ALLOY 195

Alloy Digest ◽  
1972 ◽  
Vol 21 (10) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Tensile Properties ◽  
Copper Alloy ◽  
High Strength ◽  
Heat Treating ◽  
High Conductivity ◽  
Temperature Performance

Abstract OLIN STRESCON ALLOY 195 is a high-strength, high-conductivity copper alloy developed for applications in current-carrying parts. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as fatigue. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Cu-260. Producer or source: Olin Corporation, Brass Group.

CLIMELT MOLYBDENUM

Alloy Digest ◽  
1970 ◽  
Vol 19 (10) ◽  
Keyword(s):  
Corrosion Resistance ◽  
High Temperature ◽  
Melting Point ◽  
Physical Properties ◽  
Heat Treating ◽  
Electrical Contacts ◽  
High Melting ◽  
High Melting Point ◽  
Temperature Performance ◽  
Commercially Pure

Abstract CLIMELT MOLYBDENUM is a commercially pure high melting point metal for applications such as electronic tube components, electric furnace elements, electrical contacts, and electrodes. It is produced by arc casting. This datasheet provides information on composition, physical properties, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Mo-10. Producer or source: Climax Molybdenum Company of Michigan, American Metal Climax.

AMCROM

Alloy Digest ◽  
1983 ◽  
Vol 32 (11) ◽  
Keyword(s):  
Electrical Conductivity ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Heat Treating ◽  
Electrical Contacts ◽  
Resistance Welding ◽  
Temperature Performance ◽  
Welding Electrode

Abstract AMCROM is an oxygen-free copper containing chromium. It can be precipitation hardened to enhance its strength and to increase its electrical conductivity. AMCROM is produced by adding chromium to oxygen-free copper. AMCROM copper contains fewer inclusions than conventional chromium copper and as a result, has greater ductility and uniformity. Typical applications of AMCROM include resistance welding electrode tips and wheels, electrical contacts and connectors and high-temperature wire. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as creep. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Cu-466. Producer or source: Amax Copper Inc..

TEM characterization of Au/Polysilicon interactions

1990 ◽  
Vol 48 (4) ◽  
pp. 650-651
Author(s):  
N. David Theodore ◽  
Leslie H. Allen ◽  
C. Barry Carter ◽  
James W. Mayer
Keyword(s):  
Solid Phase ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Electrical Contacts ◽  
Silicon Substrates ◽  
Crystal Silicon ◽  
Transmission Electron ◽  
Polysilicon Films ◽  
The Stability

Metal/polysilicon investigations contribute to an understanding of issues relevant to the stability of electrical contacts in semiconductor devices. These investigations also contribute to an understanding of Si lateral solid-phase epitactic growth. Metals such as Au, Al and Ag form eutectics with Si. reactions in these metal/polysilicon systems lead to the formation of large-grain silicon. Of these systems, the Al/polysilicon system has been most extensively studied. In this study, the behavior upon thermal annealing of Au/polysilicon bilayers is investigated using cross-section transmission electron microscopy (XTEM). The unique feature of this system is that silicon grain-growth occurs at particularly low temperatures ∽300°C).Gold/polysilicon bilayers were fabricated on thermally oxidized single-crystal silicon substrates. Lowpressure chemical vapor deposition (LPCVD) at 620°C was used to obtain 100 to 400 nm polysilicon films. The surface of the polysilicon was cleaned with a buffered hydrofluoric acid solution. Gold was then thermally evaporated onto the samples.

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