Grain Boundary Grooving as the Mechanism of the Blech Electromigration in Interconnects

1995 ◽  
Vol 391 ◽  
Author(s):  
E.E. Glickman ◽  
L.M. Klinger

AbstractWe present a new approach to understand the mechanism of "homogeneous", or Blech electromigration (EM). This phenomenon describes macroscopically homogeneous displacement of the up-wind edge of thin film lines in microelectronic devices and is responsible for openings at contact windows, "vias" and other sites of perfect diffusion flux divergence.Our SEM, EPMA and EM drift velocity experiments have revealed the gradual transition from the microscopically homogeneous EM displacement to the highly nonhomogeneous mode wherein copious islands of residual material remain behind the drifting cathode edge of aluminum stripes. The transition is shown to occur due to an increase in either the current density, j, or in the stripe length, 1. The latter case suggests, that the transition results from the growth of the net grain boundary (GB) diffusion flux, I=le-Ib ,where Ie∝j and 1b∝1/1 are the EM flux and stress-gradient-driven back flux, respectively.Based upon recent progress in the theory of GB grooving under "external" GB fluxes, with surface diffusion acting as the healing mechanism, grooves' propagation along the line and their merging is considered to be the micromechanism of the "homogeneous" EM. In terms of the simple model described, the transition from the slow receding of the cathode butt edge slightly wrinkled by shallow grooves (A-regime of EM) to the fast extension and merging of slot -like grooves (B-regime) accounts for the transition observed in EM mode, while in both regimes the EM displacement velocity, V, is presumed to represent the groove propagation rate.The theory developed reduces to Blech formulae for V for the truly homogeneous A-regime and predicts quite different EM kinetics for the B-regime of microscopically nonhomogeneous EM. The latter is expected to dominate for films loaded by high current density with large grains and low surface diffusion.The dependence obtained for the residual mass left behind the drifted edge vs the displacement velocity, V, for unpassivated aluminum stripes of various lengths, loaded by j=2-106 A/cm2 at 548K provides a good evidence in support of a new approach.

1994 ◽  
Vol 338 ◽  
Author(s):  
J.R. Lloyd

ABSTRACTElectromigration failure in a near bamboo structure is investigated theoretically. Assuming that the diffusion path is interfacial, a flux divergence can be predicted based on the stress gradient induced by grain boundary electromigration in a sub Blech Length grain cluster. A possible explanation for the recently observed “trans-granular” voids is proposed.


2010 ◽  
Vol 654-656 ◽  
pp. 464-467 ◽  
Author(s):  
Yang Liu ◽  
Lei Wang ◽  
Yu Chen Wang ◽  
Hong Yan Liu ◽  
Xue Jiao Chen ◽  
...  

The effects of electropulsing treatment on the precipitation behaviour of grain boundary carbides in GH3044 alloy were investigated. The results showed that the initial temperature of precipitation of M23C6 type carbides on grain boundary could be decreased by electropulsing treatment under the condition of high current density of 10.0kA/mm2 with a frequency of 5Hz and pulse width of 15s. The volume percentage of M23C6 type carbide was greatly increased to 274.60% comparing with that of the aging treatment at the same temperature. However, the precipitation of M23C6 type carbide was inhibited by electropulsing treatment under the condition of high frequency of 45Hz with the current density of 2kA/mm2 and pulse width of 15s. The volume percentage of M23C6 type carbide was decreased to 18.81% comparing with that of the aging treatment at the same temperature. It has been found that the diffusion of solute atom in the alloy can be promoted by the electric effect with the electropulsing. As a result, the thermodynamic condition and kinetics of the precipitation of M23C6 type carbide were changed, and both the initial and peak temperatures of precipitation were decreased.


2006 ◽  
Vol 968 ◽  
Author(s):  
Yousuke Fujii ◽  
Masanori Tsutsumi ◽  
Junya Inoue ◽  
Toshihiko Koseki

ABSTRACTElectromigration (EM) and stress-induced voiding (SIV) in Cu and Cu alloys thin films were studied separately. The characterization of EM was evaluated in a modified interconnect structure where the effect of current density can be observed in the absence of stress disturbance. SIV, on the other hand, is examined in detail by applying a uniform stress to Cu films without electric current. Results of EM tests clearly showed that void and hillock formations were concentrated mainly in the region with high current density gradient without stress disturbance. SIV test performed under the high stress of 1GPa showed that voids were observed to form at grain boundaries and grain boundary triple junctions. Under the high stress, SIV is shown to be generated in the absence of stress gradient. Also, the effect of alloying to EM and SIV was investigated in detail.


1998 ◽  
Vol 120 (4) ◽  
pp. 360-366 ◽  
Author(s):  
K. Sasagawa ◽  
N. Nakamura ◽  
M. Saka ◽  
H. Abe´

In this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of current density and temperature and also simply considering the line structure of not only polycrystalline, but also bamboo line. For the verification, electromigration phenomenon near the corner of an angled polycrystalline line, which results in two-dimensional distributions of current density and temperature, is treated as an example. The usefulness of the proposed method is discussed in the light of the comparison of prediction of void formation near the corner with the experimental result.


Author(s):  
P. J. Lee ◽  
D. C. Larbalestier

Several features of the metallurgy of superconducting composites of Nb-Ti in a Cu matrix are of interest. The cold drawing strains are generally of order 8-10, producing a very fine grain structure of diameter 30-50 nm. Heat treatments of as little as 3 hours at 300 C (∼ 0.27 TM) produce a thin (1-3 nm) Ti-rich grain boundary film, the precipitate later growing out at triple points to 50-100 nm dia. Further plastic deformation of these larger a-Ti precipitates by strains of 3-4 produces an elongated ribbon morphology (of order 3 x 50 nm in transverse section) and it is the thickness and separation of these precipitates which are believed to control the superconducting properties. The present paper describes initial attempts to put our understanding of the metallurgy of these heavily cold-worked composites on a quantitative basis. The composite studied was fabricated in our own laboratory, using six intermediate heat treatments. This process enabled very high critical current density (Jc) values to be obtained. Samples were cut from the composite at many processing stages and a report of the structure of a number of these samples is made here.


Author(s):  
I-Fei Tsu ◽  
D.L. Kaiser ◽  
S.E. Babcock

A current theme in the study of the critical current density behavior of YBa2Cu3O7-δ (YBCO) grain boundaries is that their electromagnetic properties are heterogeneous on various length scales ranging from 10s of microns to ˜ 1 Å. Recently, combined electromagnetic and TEM studies on four flux-grown bicrystals have demonstrated a direct correlation between the length scale of the boundaries’ saw-tooth facet configurations and the apparent length scale of the electrical heterogeneity. In that work, enhanced critical current densities are observed at applied fields where the facet period is commensurate with the spacing of the Abrikosov flux vortices which must be pinned if higher critical current density values are recorded. To understand the microstructural origin of the flux pinning, the grain boundary topography and grain boundary dislocation (GBD) network structure of [001] tilt YBCO bicrystals were studied by TEM and HRTEM.


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