Deposition, Defect and Weak Bond Formation Processes in a-Si:H

1998 ◽  
Vol 507 ◽  
Author(s):  
J Robertson ◽  
M J Powell

ABSTRACTThe growth of a-Si:H and the resulting weak bond and defect formation mechanism is analysed in terms of the adsorbed Sill3 model of growth. It is found that this model describes the surface processes well, but it needs further development to correctly describe the temperature dependence of the formation of defects and weak bonds, since the surface defect density decreases monotonically with temperature and does not show a minimum near 250C. We show that the experimentally observed increase in hydrogen content, weak bond and defect density at lower deposition temperatures can be accounted for by a hydrogen evolution reaction from H2* sites.

Nano Letters ◽  
2014 ◽  
Vol 14 (9) ◽  
pp. 5452-5457 ◽  
Author(s):  
Anielle Christine Almeida Silva ◽  
Marcelo José Barbosa Silva ◽  
Felipe Andrés Cordero da Luz ◽  
Danielle Pereira Silva ◽  
Samantha Luara Vieira de Deus ◽  
...  

2017 ◽  
Vol 422 ◽  
pp. 798-808 ◽  
Author(s):  
Mayoorika Shukla ◽  
Pramila ◽  
Tejendra Dixit ◽  
Rajiv Prakash ◽  
I.A. Palani ◽  
...  

2022 ◽  
Author(s):  
Yoshiyuki Abe ◽  
Richard M. Laine

LaTiO2N NP synthesized from flame made LaTiO3 NP exhibits less absorption background above the optical absorption edge than that synthesized from flame made La2Ti2O7 NP, suggesting a low surface defect density.


1999 ◽  
Vol 337 (1-2) ◽  
pp. 32-36 ◽  
Author(s):  
J. Robertson ◽  
M.J. Powell

MRS Advances ◽  
2016 ◽  
Vol 1 (54) ◽  
pp. 3631-3636 ◽  
Author(s):  
Johji Nishio ◽  
Hirokuni Asamizu ◽  
Mitsuhiro Kushibe ◽  
Hidenori Kitai ◽  
Kazutoshi Kojima

ABSTRACT Reduction in background carrier concentration has been investigated for 4H-SiC C-face epitaxial growth in order to be applied for ultra-high voltage power devices. Optimizing epitaxial growth parameters made it possible to achieve 7.6x1013 cm-3 as the background carrier concentration within a whole area of specular 3-inch wafers. In addition to the background carrier concentration reduction, epitaxial film thickness variation, surface defect density and the carrier lifetime have been confirmed to fulfill the requirements for the devices.


2011 ◽  
Vol 291-294 ◽  
pp. 219-222
Author(s):  
Xiang Yu ◽  
Lei Ma ◽  
Yang Liu ◽  
Zhong Zhou Yang ◽  
Hua Meng

Influence of the process parameters of a reactive mid-frequency dual-magnetron sputtering on surface defects of CrxOy film was investigated. The forming mechanisms of the observed droplets and craters were analyzed. The optimal parameter combination for accomplishing fewer surface defects was explored; and the optimized process parameters evidently minimized the surface defects of the film. In the condition of the target current of 16 A, the gases pressure of 0.31 Pa, and the bias voltages in a range of -120~-240 V, an optimized CrxOy film has been synthesized with surface defect density low to 78 defect/mm-2.


The Fischer-Tropsch synthesis of hydrocarbons probably involves an array of carbon-carbon bond-formation processes occurring to unite carbene, carbyne, alkyl, olefin, and related species on a metal surface. In seeking to understand the nature of such processes, model diruthenium complexes have been prepared and the products of their thermolysis and reactions with unsaturated hydrocarbons investigated. The combination at a diruthenium centre of two carbenes, of a carbene and an alkyne, and of a carbyne and an olefin is described, and the possible implications for metal surface processes are emphasized.


2009 ◽  
Vol 615-617 ◽  
pp. 553-556
Author(s):  
Tetsuo Hatakeyama ◽  
Hiroshi Kono ◽  
Takuma Suzuki ◽  
Junji Senzaki ◽  
Kenji Fukuda ◽  
...  

This paper discusses the issues regarding reliability of large-area (up to 9mm2) gate oxide on the C-face of 4H-SiC. We first show that the initial failure in TDDB characteristics of large area gate oxide is strongly correlated with the surface-defect density. Using wafers with low surface-defect density wafers, scaling analysis of the area-dependence of TDDB characteristics has been performed. It has shown that the reliability of a large area gate oxide is dominated by initial and random failures. Further, we have shown that, by optimizing the temperatures of post-oxidation anneal in hydrogen atmosphere, the random failures of TDDB characteristics are substantially reduced.


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