Phase-Change Media for High-Density Optical Recording

2001 ◽  
Vol 674 ◽  
Author(s):  
Herman Borg ◽  
Martijn Lankhorst ◽  
Erwin Meinders ◽  
Wouter Leibbrandt

ABSTRACTRewritable optical-storage systems are quickly gaining market share in audio, video and data- storage applications. The development of new rewritable optical-storage formats with higher capacity and data rate critically depends on innovations made to the recording media incorporating so-called phase-change materials. These materials allow reversible switching between a low and high reflective state induced by laser heating. In this paper, we highlight phase-change media aspects as optical and thermal design, sputter-deposition, materials optimization, and the development of new recording strategies. Focus is on the speed race in optical recording.

2020 ◽  
Vol 11 (1) ◽  
Author(s):  
Shunsuke Mori ◽  
Shogo Hatayama ◽  
Yi Shuang ◽  
Daisuke Ando ◽  
Yuji Sutou

AbstractDisplacive transformation is a diffusionless transition through shearing and shuffling of atoms. Diffusionless displacive transition with modifications in physical properties can help manufacture fast semiconducting devices for applications such as data storage and switching. MnTe is known as a polymorphic compound. Here we show that a MnTe semiconductor film exhibits a reversible displacive transformation based on an atomic-plane shuffling mechanism, which results in large electrical and optical contrasts. We found that MnTe polycrystalline films show reversible resistive switching via fast Joule heating and enable nonvolatile memory with lower energy and faster operation compared with conventional phase-change materials showing diffusional amorphous-to-crystalline transition. We also found that the optical reflectance of MnTe films can be reversibly changed by laser heating. The present findings offer new insights into developing low power consumption and fast-operation electronic and photonic phase-change devices.


Author(s):  
Yizhang Yang ◽  
Taehee Jeong ◽  
Hendrik F. Hamann ◽  
Jimmy Zhu ◽  
Mehdi Asheghi

Phase-change technology has been widely used in rewritable disks for optical recording applications. Recently, it has also received attention as a candidate for future high storage density non-volatile random access memory, due to its much longer cycle life (∼1013) and fast data access time (∼100ns) compared with the existing Flash memory technology. In this paper, we present thermal conductivity data and models for phase-change GeSbTe material that would be helpful in performance optimization and improvement in the reliability (i.e., enhancement of data rate, cyclability, control of mark-edge jitter) of phase-change-based data storage devices and systems. We perform the thermal characterization of Ge4Sb1Te5 and Ge2Sb2Te5 phase-change materials for the application of optical recording and phase-change memory cell using the techniques of thermoreflectance and electrical resistance thermometry. The limits of lattice and electronic thermal conductivities are investigated to determine their relative contributions as a function of tellurium concentration at different crystalline structures.


2006 ◽  
Vol 96 (5) ◽  
Author(s):  
Zhimei Sun ◽  
Jian Zhou ◽  
Rajeev Ahuja

1995 ◽  
Vol 270 (1-2) ◽  
pp. 60-64 ◽  
Author(s):  
Y. Sripathi ◽  
L.K. Malhotra ◽  
G.B. Reddy

2019 ◽  
Vol 45 (1) ◽  
pp. 244
Author(s):  
Jianbo Wang ◽  
Qian Li ◽  
Shuaipeng Tao ◽  
Zhoubo Xia ◽  
Yuankai Li ◽  
...  

Author(s):  
Y. Yang ◽  
Chun-Teh Li ◽  
S. M. Sadeghipour ◽  
M. Asheghi ◽  
H. Dieker ◽  
...  

Advances in the phase change optical recording technology strongly depend on the optical and thermal optimizations of the metal/ZnS-SiO2/phase change multilayer structure, which requires accurate modeling and thermal characterization of PC media structure. In the present work, the thermal conductivities of the amorphous and crystalline Ge4Sb1Te5 (GST) phase change; and ZnS-SiO2 dielectric layers of thickness in the range of 50 nm to 300 nm have been measured using the transient thermoreflectance technique. The data are between a factor of 2–4 different from the previously measured values for thin film and bulk samples. The thermal boundary resistance at metal/ZnS-SiO2 interface is found to be around 7×10−8 m2W−1. This might have serious implications for the future phase change recording application which attempts to achieve the high writing speeds by decreasing the thickness of ZnS-SiO2 dielectric layer.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.


2007 ◽  
Vol 6 (11) ◽  
pp. 824-832 ◽  
Author(s):  
Matthias Wuttig ◽  
Noboru Yamada

2011 ◽  
Vol 23 (18) ◽  
pp. 2030-2058 ◽  
Author(s):  
Dominic Lencer ◽  
Martin Salinga ◽  
Matthias Wuttig

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