Cantilever Epitaxy of GaN on Sapphire: Further Reductions in Dislocation Density

2002 ◽  
Vol 743 ◽  
Author(s):  
D. M. Follstaedt ◽  
P. P. Provencio ◽  
D. D. Koleske ◽  
C. C. Mitchell ◽  
A. A. Allerman ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Processing Conditions ◽  
Optimum Growth ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Threading Dislocation Density

ABSTRACTThe density of vertical threading dislocations at the surface of GaN grown on sapphire by cantilever epitaxy has been reduced with two new approaches. First, narrow mesas (<1 μm wide) were used and {11–22} facets formed over them early in growth to redirect dislocations from vertical to horizontal. Cross-sectional transmission electron microscopy was used to demonstrate this redirection and to identify optimum growth and processing conditions. Second, a GaN nuc-leation layer with delayed 3D → 2D growth transition and inherently lower threading dislocation density was adapted to cantilever epitaxy. Several techniques show that a dislocation density of only 2–3×107/cm2 was achieved by combining these two approaches. We also suggest other developments of cantilever epitaxy for reducing dislocations in heteroepitaxial systems.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

scholarly journals Structural Property Study for GeSn Thin Films

Materials ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 3645
Author(s):  
Liyao Zhang ◽  
Yuxin Song ◽  
Nils von den Driesch ◽  
Zhenpu Zhang ◽  
Dan Buca ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Transmission Electron Microscopy ◽  
Molecular Beam ◽  
Chemical Vapor ◽  
Threading Dislocations ◽  
X Ray Diffraction ◽  
Cross Sectional ◽  
X Ray ◽  
Transmission Electron

The structural properties of GeSn thin films with different Sn concentrations and thicknesses grown on Ge (001) by molecular beam epitaxy (MBE) and on Ge-buffered Si (001) wafers by chemical vapor deposition (CVD) were analyzed through high resolution X-ray diffraction and cross-sectional transmission electron microscopy. Two-dimensional reciprocal space maps around the asymmetric (224) reflection were collected by X-ray diffraction for both the whole structures and the GeSn epilayers. The broadenings of the features of the GeSn epilayers with different relaxations in the ω direction, along the ω-2θ direction and parallel to the surface were investigated. The dislocations were identified by transmission electron microscopy. Threading dislocations were found in MBE grown GeSn layers, but not in the CVD grown ones. The point defects and dislocations were two possible reasons for the poor optical properties in the GeSn alloys grown by MBE.

Threading Dislocations in InxGabxAs/GaAs System

1991 ◽  
Vol 240 ◽  
Author(s):  
M. Tamura ◽  
A. Hashimoto ◽  
Y. Nakatsugawa
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Film Thickness ◽  
Cross Section ◽  
Molecular Beam ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Edge Type ◽  
Transmission Electron ◽  
Fixed Film

ABSTRACTThreading dislocation morphologies and characters, as well as their generation conditions in InxGa1−xAs films grown by molecular-beam epitaxy on GaAs (001) substrates have been examined, mainly using cross-section al transmission electron microscopy (XTEM) as a function of x and film thickness. The formation of severe threading dislocations is detected in epilayers ofx≧0.2 at a fixed film thickness of 3 μm and with film thicknesses greater than 2μmat x=0.2. Most of the observed threading dislocations are 60°- and pure-edge type dislocations along the <211> and [001] directions, respectively. The former type dislocations are mainly observed in layers of x≧0.2; the latter predominantly exist in layers of X≧O.3.

Study of the Origin of Misorientation in GaN Grown by Pendeo-Epitaxy

2002 ◽  
Vol 743 ◽  
Author(s):  
D. N. Zakharov ◽  
Z. Liliental-Weber ◽  
A. M. Roskowski ◽  
S. Einfeldt ◽  
R. F. Davis
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Growth Temperature ◽  
Threading Dislocations ◽  
Transmission Electron ◽  
Edge Dislocations ◽  
Seed Layers

ABSTRACTGrowth of pendeo-epitaxial (PE) layers introduces misorientation between the seed layers and the overgrown wing layers. The origin of this misorientation has been studied by Transmission Electron Microscopy (TEM) using a set of samples in which subsequent procedures utilized in PE were applied, i.e. growth of GaN template, stripe etching, annealing at the growth temperature of the PE layers and final PE growth. It was shown that etching of seed-stripes did not change the type of defects or their distribution. However, heating to the PE growth temperature drastically modified the surface and V-shaped pits were formed. The surface became smooth again after the PE growth took place. Overgrowth of the V-shaped pits resulted in formation of edge threading dislocations over a seed-stripe region with a dislocation density of 8.0×108 cm−2. Formation of new edge dislocations over the seed can have an influence on the misorientation between the PE grown regions.

In situ transmission electron microscopy investigation of threading dislocation motion in passivated thin aluminum films

1999 ◽  
Vol 14 (12) ◽  
pp. 4673-4676 ◽  
Author(s):  
R-M. Keller-Flaig ◽  
M. Legros ◽  
W. Sigle ◽  
A. Gouldstone ◽  
K. J. Hemker ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Motion ◽  
Aluminum Film ◽  
Threading Dislocation ◽  
Cross Sectional ◽  
Aluminum Films ◽  
Transmission Electron ◽  
Microscopy Investigation

In situ transmission electron microscopy (TEM) was performed to study dislocation motion during temperature cycles in aluminum films passivated with a SiO2 layer. The films were cycled from room temperature to 450 °C. Wedge-haped cross-sectional TEM samples were used to retain the constraint of the Si substrate. Besides interactions between dislocations and interfaces, the movement of threading dislocations within the constrained aluminum film was observed. This observation provides an experimental corroboration of the occurrence of threading dislocation motion, which is the basis for rationalizing the high-ield strength of thin films in available models of thin-film plasticity.

Effect of Si Doping on the Crystal Structure of HVPE Grown Boron Phosphide

2012 ◽  
Vol 725 ◽  
pp. 285-288
Author(s):  
Yuji Ino ◽  
Satoru Matsumoto ◽  
Suzuka Nishimura ◽  
Kazutaka Terashima
Keyword(s):  
Dislocation Density ◽  
Optical Emission ◽  
Threading Dislocation ◽  
Cross Sectional ◽  
Si Doping ◽  
Boron Phosphide ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Cubic Gan ◽  
Heavy Doping

Boron Phosphide (BP) layers have been grown on Si (100) as a substrate for cubic GaN heteroepitaxy. Si heavy doping was attempted to reduce the threading dislocation density in the BP. To observe the effect on dislocations in BP by Si doping, we used cross-sectional transmission electron microscopy (XTEM). Also, Glow Discharge-Optical Emission Spectroscopy (GDOES) were used to evaluate the effect of Si doping. For the samples under the conditions (a) and (e), we found the formation of pits at BP surface and an increasing in the proportion of threading dislocations with an angle of 90 ° to the surface. We could not see a significant change in the threading dislocation density by Si doping under the conditions used in this paper.

Transient Diffusion and Gettering of Au and Cu to Cavities in Si

1995 ◽  
Vol 378 ◽  
Author(s):  
J. Wong-Leung ◽  
J. S. Williams ◽  
E. Nygren
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Low Temperature ◽  
Thermal Processing ◽  
Processing Conditions ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Device Processing ◽  
Device Structures ◽  
Internal Cavities

AbstractThis paper addresses the diffusion and gettering of Cu and Au to internal cavities in Si introduced by H-implantation. Rutherford backscattering and channeling and cross-sectional transmission electron microscopy are the main analysis methods used. During annealing at temperatures and times typical of low temperature device processing conditions, we observe a transient gettering regime in which implanted Au and Cu segregate to cavities leaving metal concentrations in the Si lattice well below the solubility level. Longer times and/or higher temperatures are required for equilibrium to be reached. These results may have important implications for developing optimum gettering strategies during thermal processing of device structures.

Microstructure of laser-irradiated, conducting Kapton polyimide

1995 ◽  
Vol 53 ◽  
pp. 502-503
Author(s):  
D. L. Callahan ◽  
Z. Ball ◽  
H. M. Phillips ◽  
R. Sauerbrey
Keyword(s):  
Electron Microscopy ◽  
Phase Transition ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Film Surface ◽  
Cross Sectional ◽  
General Utility ◽  
Transmission Electron ◽  
Considerable Debate ◽  
Potential Applications

Ultraviolet laser-irradiation can be used to induce an insulator-to-conductor phase transition on the surface of Kapton polyimide. Such structures have potential applications as resistors or conductors for VLSI applications as well as general utility electrodes. Although the percolative nature of the phase transformation has been well-established, there has been little definitive work on the mechanism or extent of transformation. In particular, there has been considerable debate about whether or not the transition is primarily photothermal in nature, as we propose, or photochemical. In this study, cross-sectional optical microscopy and transmission electron microscopy are utilized to characterize the nature of microstructural changes associated with the laser-induced pyrolysis of polyimide.Laser-modified polyimide samples initially 12 μm thick were prepared in cross-section by standard ultramicrotomy. Resulting contraction in parallel to the film surface has led to distortions in apparent magnification. The scale bars shown are calibrated for the direction normal to the film surface only.

Ion thinning of integrated circuit transverse specimens for transmission electron microscopy

1992 ◽  
Vol 50 (2) ◽  
pp. 1426-1427
Author(s):  
F. Shaapur
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Integrated Circuit ◽  
Substrate Surface ◽  
Homogeneous Material ◽  
Material System ◽  
Ion Milling ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Motion Profile

Non-uniform ion-thinning of heterogenous material structures has constituted a fundamental difficulty in preparation of specimens for transmission electron microscopy (TEM). A variety of corrective procedures have been developed and reported for reducing or eliminating the effect. Some of these techniques are applicable to any non-homogeneous material system and others only to unidirectionalfy heterogeneous samples. Recently, a procedure of the latter type has been developed which is mainly based on a new motion profile for the specimen rotation during ion-milling. This motion profile consists of reversing partial revolutions (RPR) within a fixed sector which is centered around a direction perpendicular to the specimen heterogeneity axis. The ion-milling results obtained through this technique, as studied on a number of thin film cross-sectional TEM (XTEM) specimens, have proved to be superior to those produced via other procedures.XTEM specimens from integrated circuit (IC) devices essentially form a complex unidirectional nonhomogeneous structure. The presence of a variety of mostly lateral features at different levels along the substrate surface (consisting of conductors, semiconductors, and insulators) generally cause non-uniform results if ion-thinned conventionally.

TEM Sample Preparation Tricks for Advanced DRAMs

2015 ◽  
Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Characterization Of Materials

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.

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