device processing
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2022 ◽  
Vol 32 (1) ◽  
Author(s):  
Masataka Higashiwaki

AbstractRapid progress in β-gallium oxide (β-Ga2O3) material and device technologies has been made in this decade, and its superior material properties based on the very large bandgap of over 4.5 eV have been attracting much attention. β-Ga2O3 appears particularly promising for power switching device applications because of its extremely large breakdown electric field and availability of large-diameter, high-quality wafers manufactured from melt-grown bulk single crystals. In this review, after introducing material properties of β-Ga2O3 that are important for electronic devices, current status of bulk melt growth, epitaxial thin-film growth, and device processing technologies are introduced. Then, state-of-the-art β-Ga2O3 Schottky barrier diodes and field-effect transistors are discussed, mainly focusing on development results of the author’s group.


2021 ◽  
Vol 55 (4) ◽  
pp. 165-170
Author(s):  
Terra A. Kremer ◽  
Daniel Olsen ◽  
Chad Summers ◽  
Alpa Patel ◽  
Julie Hoover ◽  
...  

Abstract Cleaning chemistries are detergent-based formulations that are used during the processing of reusable medical devices. Manufacturers are responsible for demonstrating the safety of cleaning formulations when they are used during a device processing cycle, including the risk of device-associated cytotoxicity over the concentration ranges for recommended use and rinsing during cleaning. However, no regulation currently exists requiring manufacturers to demonstrate such safety. Although manufacturers' safety data sheets (SDSs) provide information on the safe use of chemicals for users, this information may not provide sufficient detail to determine the risks of residual chemicals on device surfaces. SDSs are not required to contain a comprehensive list of chemicals used, only those of risk to the user. They should be supplemented with information on the correct concentrations that should be used for cleaning, as well as instructions on the rinsing required to reduce the levels of chemicals to safe (nontoxic) levels prior to further processing. Supporting data, such as toxicity profiles or cytotoxicity data that support the instructions for use, would provide medical device manufacturers and healthcare personnel with the necessary information to make informed decisions about selection and correct use of detergents. In the current work, cytotoxicity profiles for eight commonly used cleaning formulations available internationally were studied. Although all of these products are indicated for use in the cleaning of reusable medical devices, results vary across the serial dilution curves and are not consistent among detergent types. The information presented here can be leveraged by both medical device manufacturers and processing department personnel to properly assess residual detergent risks during processing. This work also serves as a call to cleaning formulation manufacturers to provide this information for all chemistries.


2021 ◽  
pp. 271-317
Author(s):  
Arash Salemi ◽  
Minseok Kang ◽  
Woongje Sung ◽  
Anant K. Agarwal

2021 ◽  
pp. 633-657
Author(s):  
Hideaki Yamada ◽  
Hiromitsu Kato ◽  
Shinya Ohmagari ◽  
Hitoshi Umezawa

2021 ◽  
Vol 11 (8) ◽  
pp. 3381
Author(s):  
Ivan Shtepliuk ◽  
Rositsa Yakimova

The aim of this Special Issue is to provide a scientific platform for recognized experts in the field of epitaxial graphene on SiC to present their recent studies towards a deeper comprehension of growth mechanisms, property engineering and device processing. This Special Issue gives readers the possibility to gain new insights into the nature of buffer layer formation, control of electronic properties of graphene and usage of epitaxial graphene as a substrate for deposition of different substances, including metals and insulators. We believe that the papers published within the current Special Issue develop cumulative knowledge on matters related to device-quality epaxial graphene on SiC, bringing this material closer to realistic practical applications.


Nanomaterials ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 2208
Author(s):  
Mu-I Chen ◽  
Anoop Kumar Singh ◽  
Jung-Lung Chiang ◽  
Ray-Hua Horng ◽  
Dong-Sing Wuu

Spinel ZnGa2O4 has received significant attention from researchers due to its wide bandgap and high chemical and thermal stability; hence, paving the way for it to have potential in various applications. This review focuses on its physical, optical, mechanical and electrical properties, contributing to the better understanding of this material. The recent trends for growth techniques and processing in the research and development of ZnGa2O4 from bulk crystal growth to thin films are discussed in detail for device performance. This material has excellent properties and is investigated widely in deep-ultraviolet photodetectors, gas sensors and phosphors. In this article, effects of substrate temperature, annealing temperature, oxygen partial pressure and zinc/gallium ratio are discussed for device processing and fabrication. In addition, research progress and future outlooks are also identified.


2020 ◽  
Vol 148 (4) ◽  
pp. 2711-2711
Author(s):  
Michael A. Akeroyd ◽  
Jon P. Barker ◽  
Trevor J. Cox ◽  
John Culling ◽  
Simone Graetzer ◽  
...  

Nanomaterials ◽  
2020 ◽  
Vol 10 (8) ◽  
pp. 1555 ◽  
Author(s):  
Henry H. Radamson ◽  
Huilong Zhu ◽  
Zhenhua Wu ◽  
Xiaobin He ◽  
Hongxiao Lin ◽  
...  

The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.


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