The Influence of Temperature and Concentration on Copper Deposition Kinetics in Supercritical Carbon Dioxide
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AbstractThe kinetics of copper deposition by the hydrogen-assisted reduction of bis(2,2,7- trimethyloctane-3,5-dionato)copper in supercritical carbon dioxide was studied as a function of temperature and precursor concentration. The growth rate was found to be as high as 31.5 nm/min. Experiments between 220 °C and 270 °C indicated an apparent activation energy of 51.9 kJ/mol. The deposition kinetics were zero order with respect to precursor at 250 °C and 134 bar and precursor concentrations between 0.016 and 0.38 wt.% in CO2. Zero order kinetics over this large concentration interval likely contributes to the exceptional step coverage obtained from Cu depositions from supercritical fluids.
2009 ◽
Vol 156
(6)
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pp. H443
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2018 ◽
Vol 135
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pp. 137-144
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2014 ◽
Vol 90
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pp. 18-26
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1999 ◽
Vol 38
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pp. 3786-3792
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2012 ◽
Vol 66
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pp. 215-220
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