Trapping of Hydrogen in Carbon Nitride Films During or After High Temperature Heat Treatment

2004 ◽  
Vol 854 ◽  
Author(s):  
David C. Ingram ◽  
Asghar Kayani ◽  
William C. Lanter ◽  
Charles A. DeJoseph

ABSTRACTThin films of carbon nitride deposited by ion beam assisted deposition or by magnetron sputter deposition typically contain a significant fraction of hydrogen, 1–30 atomic percent (at.%). In order to improve the thermal stability of the properties of the films, attempts have been made to minimize the hydrogen trapped during deposition. Such films typically have less than 5 at.% hydrogen. On heating these films in ultra high purity (99.999%) argon, it has been found that above 600°C they start to absorb significant amounts of hydrogen, this despite retaining their mechanical integrity. The composition of the films is determined using Rutherford Backscattering Spectroscopy in combination with Elastic Recoil Spectroscopy for detecting the hydrogen isotopes. In this paper, the possible sources of the hydrogen have been investigated by exposing the samples to deuterated water or deuterium gas during or immediately after the heat treatment.

2004 ◽  
Vol 338-340 ◽  
pp. 486-489 ◽  
Author(s):  
A.S. Ferlauto ◽  
A. Champi ◽  
C.A. Figueroa ◽  
C.T.M. Ribeiro ◽  
F.C. Marques ◽  
...  

2006 ◽  
Vol 17 (6) ◽  
pp. 1163-1169 ◽  
Author(s):  
Wilmer Sucasaire ◽  
Masao Matsuoka ◽  
Karina C. Lopes ◽  
Juan C. R. Mittani ◽  
Luis H. Avanci ◽  
...  

2006 ◽  
Vol 200 (20-21) ◽  
pp. 6111-6116 ◽  
Author(s):  
A. Rabiei ◽  
B. Thomas ◽  
C. Jin ◽  
R. Narayan ◽  
J. Cuomo ◽  
...  

1996 ◽  
Vol 74 (3-4) ◽  
pp. 97-101
Author(s):  
C. D. Tucker ◽  
D. E. Brodie

Amorphous silicon carbide (a-Si:C) films were prepared by low-energy ion-beam-assisted deposition (IBAD) in an attempt to remove structural defects in the "lattice" and improve the electrical characteristics of the film. The ion beam was generated by electron cyclotron resonance from an ultra-high-purity argon plasma. The deposition environment was first evacuated to a very high vacuum to eliminate all but trace amounts of water vapour and other gases so that improvements in the electrical and (or) structural properties of the film would be attributable to the influence of the densification by ion bombardment and not to contaminants. The IBAD process does improve the film characteristics by reducing the density of localized states at the Fermi level and the porosity of the film. However, even though these films have the best electrical characteristics obtained thus far for these kind of films, none of them exhibited device quality and none were observed to be photoconducting. A large density (≈1 at.%) of implanted argon atoms may be limiting the reduction in the defect density that might otherwise be achievable.


1997 ◽  
Vol 308-309 ◽  
pp. 239-244 ◽  
Author(s):  
M Kohzaki ◽  
A Matsumuro ◽  
T Hayashi ◽  
M Muramatsu ◽  
K Yamaguchi

1991 ◽  
Vol 239 ◽  
Author(s):  
J. H. Hsieh ◽  
O. O. Ajayi ◽  
A. Erdemir ◽  
F. A. Nichols

ABSTRACTAg and Ag/Ti films were deposited on ZrO2 substrates by ion-beam-assisted deposition. Adhesion of these films was measured before and after heat treatment at 250°C in air. The results show that a graded interface between Ag and Ti was necessary for the Ag films to survive the heat treatment. Reciprocating pin-on-disc tests were performed at 150°C after heat treatment to investigate the relationship between adhesion and tribological properties. The failure of Ag and Ag/Ti (without graded interface) films was also observed during wear tests. However, this Ag film failure did not result in negative effects. All three Ag-coated substrates show better tribological behavior.


1998 ◽  
Vol 64 (1) ◽  
pp. 152-156
Author(s):  
Masao KOKLAKI ◽  
Akihito MATSUMURO ◽  
Mutsuo MURAMATSU ◽  
Toshiyuki HAYASHI ◽  
Katsumi YAMAGUCHI

1997 ◽  
Vol 36 (Part 1, No. 4A) ◽  
pp. 2313-2318 ◽  
Author(s):  
Masao Kohzaki ◽  
Akihito Matsumuro ◽  
Toshiyuki Hayashi ◽  
Mutsuo Muramatsu ◽  
Katsumi Yamaguchi

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