scholarly journals Strength analysis of solder joints used in microelectronics packaging

2020 ◽  
Vol 22 (2) ◽  
pp. 297-305 ◽  
Author(s):  
Artur Wymysłowski ◽  
Krystian Jankowski
Keyword(s):  
Solder Joints ◽  
Strength Analysis ◽  
Microelectronics Packaging

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

1999 ◽  
Vol 121 (1) ◽  
pp. 8-11 ◽  
Author(s):  
C. Basaran ◽  
R. Chandaroy
Keyword(s):  
Dynamic Analysis ◽  
Solder Joints ◽  
Nonlinear Dynamic Analysis ◽  
Material Model ◽  
Microelectronics Packaging ◽  
Dynamic Stresses ◽  
Surface Mount ◽  
Solder Interconnects ◽  
Disturbed State Concept ◽  
Military Applications

Solder joints are commonly used in surface mount technology microelectronics packaging. It is well known that the dominant failure mode for solder joints is thermal fatigue. When semiconductor devices are used in a vibrating environment, such as in automotive and military applications, dynamic stresses contribute to the failure mechanism and in certain circumstances they can become the dominant failure cause. In this paper a unified constitutive model for Pb40/Sn60 solder joints is developed and then implemented in a finite element dynamic analysis procedure. The purpose of the material model and the implementation is to study the contribution of vibration induced strains to the fatigue life of solder interconnects in low cycle and high cycle fatigue. The proposed material model, which is based on the disturbed state concept (DSC), is used for a dynamic analysis of a solder joint in the following paper, Part II, Basaran and Chandaroy (1998).

A Damage-Mechanics-Based Constitutive Model for Solder Joints

2004 ◽  
Vol 127 (3) ◽  
pp. 208-214 ◽  
Author(s):  
C. Basaran ◽  
Y. Zhao ◽  
H. Tang ◽  
J. Gomez
Keyword(s):  
Damage Mechanics ◽  
Solder Joints ◽  
Kinematic Hardening ◽  
Flow Behavior ◽  
Microelectronics Packaging ◽  
Rate Dependent ◽  
Proposed Model ◽  
Creep Fatigue ◽  
Application Potential ◽  
High Homologous Temperature

Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent material characteristics. The microstructure is often unstable, having significant effects on the flow behavior of solder joints at high homologous temperatures. Such complex behavior makes constitutive modeling an extremely difficult task. A viscoplasticity model unified with a thermodynamics-based damage concept is presented. The proposed model takes into account isotropic and kinematic hardening, and grain size coarsening evolution. The model is verified against various test data, and shows strong application potential for modeling thermal viscoplastic behavior and fatigue life of solder joints in microelectronics packaging.

What Is Right? A Character-Strength Analysis

2009 ◽  
Author(s):  
Linda L. Moore ◽  
Daniel J. Van Ingen
Keyword(s):  
Strength Analysis ◽  
Character Strength

Validation of Numerical Models Used for Designing the Composite Blade for ILX-27 Rotorcraft

2019 ◽  
Vol 2019 (4) ◽  
pp. 23-31
Author(s):  
Jakub Wilk ◽  
Radosław Guzikowski
Keyword(s):  
Epoxy Composite ◽  
Numerical Models ◽  
Experimental Studies ◽  
Strength Analysis ◽  
Laminate Glass ◽  
Composite Blade ◽  
Real Objects ◽  
Validation Procedure ◽  
Research Objects ◽  
Comparison Of The Results

Abstract The paper presents the validation procedure of the model used in the analysis of the composite blade for the rotor of the ILX-27 rotorcraft, designed and manufactured in the Institute of Aviation, by means of numerical analyses and tests of composite elements. Numerical analysis using finite element method and experimental studies of three research objects made of basic materials comprising the blade structure – carbon-epoxy laminate, glass-epoxy composite made of roving and foam filler – were carried out. The elements were in the form of four-point bent beams, and for comparison of the results the deflection arrow values in the middle of the beam and axial deformations on the upper and lower surfaces were selected. The procedure allowed to adjust the discrete model to real objects and to verify and correct the material data used in the strength analysis of the designed blade.

COMPRESSIVE STRENGTH ANALYSIS ON PROBLEMATIC SOILS STABILIZED WITH FLY ASH IN JORDAN

2018 ◽  
Vol 17 (8) ◽  
pp. 1855-1861
Author(s):  
Nicolae Taranu ◽  
Monther Abdelhadi ◽  
Ancuta Rotaru ◽  
Maria Gavrilescu
Keyword(s):  
Compressive Strength ◽  
Fly Ash ◽  
Strength Analysis ◽  
Problematic Soils

Predictive Failure Analysis of Solder Joints with Simultaneous High Speed EBSD and EDS

2018 ◽  
Author(s):  
J. Lindsay ◽  
P. Trimby ◽  
J. Goulden ◽  
S. McCracken ◽  
R. Andrews
Keyword(s):  
High Speed ◽  
Solder Joints ◽  
Phase Distribution ◽  
Bond Failure ◽  
Microstructural Parameters ◽  
Snpb Solder ◽  
Grain Orientations ◽  
Accelerated Thermal Cycling ◽  
The Relationship ◽  
Opening Up

Abstract The results presented here show how high-speed simultaneous EBSD and EDS can be used to characterize the essential microstructural parameters in SnPb solder joints with high resolution and precision. Analyses of both intact and failed solder joints have been carried out. Regions of strain localization that are not apparent from the Sn and Pb phase distribution are identified in the intact bond, providing key insights into the mechanism of potential bond failure. In addition, EBSD provides a wealth of quantitative detail such as the relationship between parent Sn grain orientations and Pb coarsening, the morphology and distribution of IMCs on a sub-micron scale and accurate grain size information for all phases within the joint. Such analyses enable a better understanding of the microstructural developments leading up to failure, opening up the possibility of improved accelerated thermal cycling (ATC) testing and better quality control.

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