Manufacture of Micropropellers by Means of Ultraprecision Milling Machine

1997 ◽  
Vol 9 (6) ◽  
pp. 475-479 ◽  
Author(s):  
Yoshimi Takeuchi ◽  
◽  
Kiyoshi Sawada ◽  
Toshio Sata ◽  
◽  
...  
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Rotational Axis ◽  
Milling Machine ◽  
End Mill ◽  
Ball End Mill ◽  
Single Crystal Diamond ◽  
Manufacturing Procedure

The requirement for producing metallic microparts for use in micromachines and/or micromechanisms will continue to increase. This study deals with the manufacturing of tiny parts, of mm-size, using micromachining technology and an ultraprecision milling machine, which consists of a z-motion table, a positionable spindle on it as the c-rotational axis, and an x-motion table. The spindle, which has a pseudo ball end mill composed of a single crystal diamond, is mounted on the x-table. A new manufacturing procedure is devised in order to create a propeller, 3 mm in diameter, as a representative micropart, based on the CAD data of the propeller. As a result, it was found that a functional machined propeller, with a surface roughness of 0.1 μm, can be mounted onto a micromotor shaft, 0.7 mm in diameter.

Hydrogen Ion Beam Processing of Single Crystal Diamond Chips

1994 ◽  
Vol 354 ◽  
Author(s):  
Shuji Kiyohara ◽  
Iwao Miyamoto
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Incidence Angle ◽  
Ion Beam ◽  
Etching Rate ◽  
Hydrogen Ion ◽  
Hydrogen Ions ◽  
Ion Beam Etching ◽  
Single Crystal Diamond ◽  
Before And After

AbstractIn order to apply ion beam etching with hydrogen ions to the ultra-precision processing of diamond tools, hydrogen ion beam etching characteristics of single crystal diamond chips with (100) face were investigated. The etching rate of diamond for 500 eV and 1000 eV hydrogen ions increases with the increase of the ion incidence angle, and eventually reaches a maximum at the ion incidence angle of approximately 50°, then may decrease with the increase of the ion incidence angle. The dependence of the etching rate on the ion incidence angle of hydrogen ions is fairly similar to that obtained with argon ions. Furthermore, the surface roughness of diamond chips before and after hydrogen ion beam etching was evaluated using an atomic force microscope. Consequently, the surface roughness after hydrogen ion beam etching decreases with the increase of the ion incidence angle within range of the ion incidence angle of 60°.

On the Flexible Abrasive Tool for Nanofinishing of Complex Surfaces

2019 ◽  
Vol 18 (01) ◽  
pp. 157-166 ◽  
Author(s):  
Mithun Sarkar ◽  
V. K. Jain ◽  
Ajay Sidpara
Keyword(s):  
Surface Roughness ◽  
Corrosion Inhibitor ◽  
Abrasive Tool ◽  
End Mill ◽  
Complex Surfaces ◽  
Ball End Mill ◽  
Workpiece Surface ◽  
Abrasive Particles ◽  
Processing Step ◽  
Finishing Tool

Nanofinishing of complex surfaces is an important but costly processing step for many products for performing their functions satisfactorily. This paper deals with the development of a flexible abrasive tool for nanofinishing of complex surfaces. A flexible finishing tool similar to the ball end mill is developed by curing Polydimethylsiloxane (PDMS). A bowl-shaped copper workpiece is finished to nanometer surface roughness value. Different sizes of abrasive particles are used to reduce surface roughness value of the workpiece. A corrosion inhibitor is mixed with the abrasive slurry to protect the finished copper workpiece surface. A final surface roughness value of 50[Formula: see text]nm has been achieved with a variation up to 70[Formula: see text]nm on different locations of the bowl-shaped workpiece.

scholarly journals B07 Ultra Precision cutting with single crystal diamond end mill

2008 ◽  
Vol 2008.7 (0) ◽  
pp. 39-40
Author(s):  
Naoto ISHIDA ◽  
Toshiro SHIBASAKA ◽  
Hirofumi SUZUKI
Keyword(s):  
Single Crystal ◽  
End Mill ◽  
Single Crystal Diamond ◽  
Ultra Precision

Mechanochemical Polishing of Single Crystal Diamond with Mixture of Oxidizing Agents

2006 ◽  
Vol 315-316 ◽  
pp. 852-855 ◽  
Author(s):  
Cheng Yong Wang ◽  
C. Chen ◽  
Yue Xian Song
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Smooth Surface ◽  
Removal Rate ◽  
Polishing Process ◽  
Iron Plate ◽  
Oxidizing Agents ◽  
Single Crystal Diamond ◽  
Lower Temperature ◽  
And Control

In order to achieve the smooth surface of diamond, several kinds of mixture oxidizing agents have been used to polish the single crystal diamond by a designed polishing apparatus. The existing of graphite and amorphous carbon has been found in the surface of diamond after polishing. The mechanochemical actions of oxidizing agents and the polishing iron plate have been proved. The mixture of oxidizing agents can decrease the polishing temperature so that the super-smooth surface of single crystal diamond can be achieved at lower temperature. The method provided is benefit not only to simplify polishing device and control the polishing process, but also to improve the removal rate and surface roughness.

scholarly journals Fabrication and Characterization of Single-Crystal Diamond Membranes for Quantum Photonics with Tunable Microcavities

Micromachines ◽  
2020 ◽  
Vol 11 (12) ◽  
pp. 1080
Author(s):  
Julia Heupel ◽  
Maximilian Pallmann ◽  
Jonathan Körber ◽  
Rolf Merz ◽  
Michael Kopnarski ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Single Crystal ◽  
Membrane Thickness ◽  
Initial Surface ◽  
Crucial Component ◽  
Single Crystal Diamond ◽  
Fabrication And Characterization ◽  
Etching Parameters ◽  
Quantum Photonics

The development of quantum technologies is one of the big challenges in modern research. A crucial component for many applications is an efficient, coherent spin–photon interface, and coupling single-color centers in thin diamond membranes to a microcavity is a promising approach. To structure such micrometer thin single-crystal diamond (SCD) membranes with a good quality, it is important to minimize defects originating from polishing or etching procedures. Here, we report on the fabrication of SCD membranes, with various diameters, exhibiting a low surface roughness down to 0.4 nm on a small area scale, by etching through a diamond bulk mask with angled holes. A significant reduction in pits induced by micromasking and polishing damages was accomplished by the application of alternating Ar/Cl2 + O2 dry etching steps. By a variation of etching parameters regarding the Ar/Cl2 step, an enhanced planarization of the surface was obtained, in particular, for surfaces with a higher initial surface roughness of several nanometers. Furthermore, we present the successful bonding of an SCD membrane via van der Waals forces on a cavity mirror and perform finesse measurements which yielded values between 500 and 5000, depending on the position and hence on the membrane thickness. Our results are promising for, e.g., an efficient spin–photon interface.

Effect of Ground Surface Roughness of Ball End Mill on Cutting Characteristics

2012 ◽  
Vol 565 ◽  
pp. 359-364 ◽  
Author(s):  
Masahiro Furuno ◽  
Koichi Kitajima ◽  
Takeshi Akamatsu
Keyword(s):  
Surface Roughness ◽  
Cutting Force ◽  
Surface Area ◽  
Ground Surface ◽  
The State ◽  
Cutting Edge ◽  
End Mill ◽  
Ball End Mill ◽  
Ground Surface Roughness ◽  
Flank Surface

The results of an investigation on the effects of surface roughness on ball end mill are reported here. We used grindwheels with varying in grit between #325 and #1000 to grind ball end mill’s rake surface and flank surface, and then coated the end mill with TiAlN film, CrSiN film, and TiSiN film. We measured the state of adhesion on the films on the rake surface in continuous lathe milling as well as the surface roughness and cutting force. The results show that, in generating the cutting cutoff, the optimum grinding roughness differs between the near vicinity of the cutting-edge ridgeline and the part of the rake surface that is further away from the cutting-edge ridgeline. From that fact, we understand that the cutting characteristics of the work material and the surface area of the rake surface that is in contact with the cutting cutoff exert their respective influences during the cutting.

Sign in / Sign up

Export Citation Format

Share Document