scholarly journals Theoretical Analysis of On-chip Vertical Hybrid Plasmonic Nanograting

2021 ◽  
Author(s):  
Mandeep Singh
Keyword(s):  
Numerical Simulation ◽  
Plasmonic Waveguide ◽  
Propagation Loss ◽  
Optical Confinement ◽  
Propagation Length ◽  
3D Finite Element ◽  
Cmos Compatible ◽  
On Chip ◽  
3D Finite Element Method ◽  
Low Dispersion

Abstract a CMOS compatible photonic-plasmonic waveguide with nanoscale optical confinement has been proposed for the infrared (IR)-band applications. The design is based on the multilayer hybrid plasmonic waveguide (Si-SiO2-Au) structure. The 3D-finite element method (FEM) numerical simulation of single slot HPWG confirms 2.5 dB/cm propagation loss and 15 um− 2 confined intensity. Moreover, its application as dual-slot nanograting is studied which shows better propagation length and ultra-low dispersion near the 1550 nm wavelength. Hence, proposed low-dispersion design is suitable for future on-chip nanophotonic components in the IR band.

Numerical Simulation of Hot Die Forging Process of Ti-6Al-4V Alloy Blade

2017 ◽  
Vol 898 ◽  
pp. 1325-1331 ◽  
Author(s):  
Jia Hao Chen ◽  
Jin Shan Li ◽  
Bin Tang ◽  
Li Hua Du ◽  
Hong Chao Kou
Keyword(s):  
Numerical Simulation ◽  
Finite Element Method ◽  
Stress Distribution ◽  
Strain Distribution ◽  
3D Finite Element ◽  
Forging Process ◽  
Die Forging ◽  
3D Finite Element Method ◽  
Deformation Area ◽  
Hot Die Forging

Ti-6Al-4V alloy is used extensively in aerospace industries due to its excellent properties. In this paper, the hot die forging process of the Ti-6Al-4V alloy blade was simulated by using 3D finite element method. Based on the model, the effect of process parameters on the deformation was investigated. The results show that the increase of temperature is beneficial to improving the uniformity of stress distribution. The slower the declining velocity of upper die is, the larger the strain gradient of severe deformation area will be. In addition, the stress distribution gets uniform with velocity decreasing. The large friction coefficient can make strain distribution uneven and cause symmetry of stress distribution. The proposed numerical simulation of hot die forging of blade in the present work may yield important information for the development of hot die forging techniques and the manufacture of blade.

Calibration response simulation of a triaxial induction tool with a metal mandrel

Geophysics ◽  
2016 ◽  
Vol 81 (4) ◽  
pp. D419-D425 ◽  
Author(s):  
Wei Xu ◽  
Shizhen Ke ◽  
Chengfang Yin ◽  
Ming Jiang ◽  
Liangang Ma ◽  
...  
Keyword(s):  
Numerical Simulation ◽  
Azimuthal Angle ◽  
Simulation Method ◽  
Quantitative Agreement ◽  
3D Finite Element ◽  
Induction Logging ◽  
Simulation Results ◽  
Large Water ◽  
3D Finite Element Method ◽  
Water Tanks

The calibration of triaxial induction logging tools is commonly performed in large water tanks, which are costly and complicated to use. In contrast, calibration with a metal loop is relatively economical and convenient. A tilted metal loop is introduced to calibrate all the components of a triaxial induction tool simultaneously. We have evaluated and optimized parameters such as radius, resistance, azimuthal angle, and position of the calibration loop with the 3D finite-element method. For validation, the accuracy of the simulation method is verified with analytical solutions with consideration of the metal mandrel effect. A quantitative agreement is found between the simulation results and the measurements of a realistic triaxial induction tool with a metal mandrel. Numerical simulation results demonstrate that the presence of the metal mandrel causes the nine components of the tool to change nonlinearly with the formation conductivities in the double logarithmic coordinate. This nonlinear effect can be reduced by eliminating the background signals from the metal mandrel. After the optimization of the parameters of the calibration loop, the responses of the triaxial induction tool can be calibrated accurately.

Footprint Analysis of CMOS Compatible Silicon-on-Insulator based Photonic Waveguides

2020 ◽  
Vol 12 ◽  
Author(s):  
Veer Chandra ◽  
Rakesh Ranjan
Keyword(s):  
Silicon On Insulator ◽  
Propagation Loss ◽  
Comsol Multiphysics ◽  
The Finite Element Method ◽  
Propagation Length ◽  
Footprint Analysis ◽  
Photonic Waveguides ◽  
Cmos Compatible ◽  
The Impact ◽  
Slot Waveguides

Aim: Establish the efficient footprint size, i.e., the total substrate width of photonic waveguides (Ridge, Rib, and Slot) under the fundamental mode propagation constraints. Objective: By varying the total substrate width for all photonic waveguides (Ridge, Rib, and Slot) with respect to four major waveguide parameters, namely effective refractive index, propagation loss, propagation length, and confinement percentage, the converged values of these waveguide parameters have to be obtained. Methods: The finite element method (FEM) based simulations, using the COMSOL Multiphysics, have been used to study the modal characteristics of photonic waveguides to achieve their efficient footprint size. Results: The total substrate widths have been obtained for the all four parameters and considering the impact of all these waveguide parameters simultaneously, the efficient total substrate width have been recognized as 2500 nm, 4000 nm, and 3000 nm, respectively for Ridge, Rib, and Slot waveguides. Conclusion: The efficient waveguide footprints, i.e., the total substrate widths for the three photonic waveguides, namely Ridge, Rib and Slot waveguides have been established.

Numerical Simulation of Laser Soldering about Electronic Connectors

2013 ◽  
Vol 668 ◽  
pp. 534-537 ◽  
Author(s):  
Yi Liu ◽  
Xun Bo Li ◽  
Zhi Zeng ◽  
Tao Liu
Keyword(s):  
Numerical Simulation ◽  
Finite Element Method ◽  
Thermal Model ◽  
Temperature Fields ◽  
Ansys Software ◽  
3D Finite Element ◽  
Maximum Deformation ◽  
Laser Soldering ◽  
3D Finite Element Method ◽  
Transient Thermal

A transient thermal model for Micro USB V2.0 electronic connector was created based on 3D finite element method. Then get the laser soldering spots on the temperature and stress the distribution of simulation by ANSYS software. Temperature fields at different time, residual stress in different locations and deformations were analyzed. The result shown that the maximum deformation of metal-pin reached 1.4mm, achieved the process standard.

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