Specificities of Acoustic Streaming under Isothermal Boundary Conditions in Cavities of Different Diameters

2018 ◽  
Vol 4 (4) ◽  
pp. 105-117 ◽  
Author(s):  
Amir A. Gubaidullin ◽  
Anna V. Pyatkova
Keyword(s):  
Boundary Conditions ◽  
Acoustic Streaming ◽  
Isothermal Boundary ◽  
Different Diameters

Vibration influence on a region with gas under the adiabatic and isothermal boundary conditions

2013 ◽  
Vol 20 (3) ◽  
pp. 277-288 ◽  
Author(s):  
P. T. Zubkov ◽  
A. V. Yakovenko
Keyword(s):  
Boundary Conditions ◽  
Isothermal Boundary

Heat flow in functionally graded pipes with isothermal boundary conditions

2009 ◽  
Vol 45 (8) ◽  
pp. 1137-1140
Author(s):  
John Dryden
Keyword(s):  
Heat Flow ◽  
Boundary Conditions ◽  
Functionally Graded ◽  
Isothermal Boundary

Expriments on shear-induced crystallization with isothermal boundary conditions

1993 ◽  
Vol 271 (3) ◽  
pp. 277-289 ◽  
Author(s):  
�. Larsen ◽  
O. H�nde
Keyword(s):  
Boundary Conditions ◽  
Isothermal Boundary ◽  
Induced Crystallization

Acoustic Streaming under Thermal Boundary Conditions of the Third Kind

2018 ◽  
Vol 64 (3) ◽  
pp. 280-286 ◽  
Author(s):  
A. A. Gubaidullin ◽  
A. V. Pyatkova
Keyword(s):  
Boundary Conditions ◽  
Acoustic Streaming ◽  
The Third ◽  
Thermal Boundary Conditions

Modeling Thermal Microspreading Resistance in Via Arrays

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Michael Fish ◽  
Patrick McCluskey ◽  
Avram Bar-Cohen
Keyword(s):  
Boundary Conditions ◽  
Effective Properties ◽  
Three Dimensional ◽  
Thermal Characteristics ◽  
Simulation Software ◽  
Electronic Packages ◽  
Isothermal Boundary ◽  
Unit Cells ◽  
Flow Through ◽  
Management Techniques

As thermal management techniques for three-dimensional (3D) chip stacks and other high-power density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of conductive vias has increased. To reduce the computational costs and time in the thermal analysis of through-layer via (TXV) structures, much research to date has focused on defining effective anisotropic thermal properties for a pseudohomogeneous medium using isothermal boundary conditions. While such an approach eliminates the need to model heat flow through individual vias, the resulting properties are found to depend on the specific boundary conditions applied to a unit TXV cell. More specifically, effective properties based on isothermal boundary conditions fail to capture the local “microspreading” resistance associated with more realistic heat flux distributions and local hot spots on the surface of these substrates. This work assesses how the thermal microspreading resistance present in arrays of vias in interposers, substrates, and other package components can be properly incorporated into the modeling of these arrays. We present the conditions under which spreading resistance plays a major role in determining the thermal characteristics of a via array and propose methods by which designers can both account for the effects of microspreading resistance and mitigate its contribution to the overall thermal behavior of such substrate–via systems. Finite element modeling (FEM) of TXV unit cells is performed using commercial simulation software (ansys).

Thermal diffusivity measurements using insulating and isothermal boundary conditions

2014 ◽  
Vol 85 (1) ◽  
pp. 015117 ◽  
Author(s):  
H. N. Shekhani ◽  
K. Uchino
Keyword(s):  
Thermal Diffusivity ◽  
Boundary Conditions ◽  
Diffusivity Measurements ◽  
Isothermal Boundary

Modeling Thermal Spreading Resistance in Via Arrays

2015 ◽  
Author(s):  
Michael Fish ◽  
Patrick McCluskey ◽  
Avram Bar-Cohen
Keyword(s):  
Boundary Conditions ◽  
Effective Properties ◽  
Numerical Models ◽  
Thermal Characteristics ◽  
Simulation Software ◽  
Worst Case ◽  
Spreading Resistance ◽  
Isothermal Boundary ◽  
Unit Cells ◽  
Adjustment Factors

As thermal management techniques for 3D chip stacks and other high power density electronic packages continue to evolve, interest in the thermal pathways across substrates containing a multitude of conductive vias has increased. To facilitate the use of numerical models that can reduce computational costs and time in the thermal analysis of through-layer via (TXV) structures, much research to date has focused on defining effective anisotropic thermal properties for a pseudo-homogeneous TXV medium using isothermal boundary conditions. While such an approach eliminates the need to model heat flow through individual vias, the resulting properties can be shown to depend on the specific boundary conditions applied to a unit TXV cell. More specifically, effective properties based on isothermal boundary conditions fail to capture the local “micro-spreading” resistance associated with more realistic heat flux distributions and local hot spots on the surface of these substrates. This work assesses how the thermal spreading resistance present in arrays of vias in interposers, substrates, and other package components can be properly incorporated into the modeling of these arrays. We present the conditions under which spreading resistance plays a major role in determining the thermal characteristics of a via array and propose methods by which designers can both account for the effects of spreading resistance and mitigate its contribution to the overall thermal behavior of such substrate-via systems. Finite element modeling of TXV unit cells is performed using commercial simulation software (ANSYS). Compactly stated, micro-spreading contributes to the total resistance RT = R1d + (fu + fl)Rsp,max, where 0≤ f ≤ 1 are adjustment factors that depend on the conditions at the upper and lower surfaces of the via array layer and Rsp,max occurs under worst-case conditions.

Entropy generation due to mixed convection between vertical parallel plates under isothermal boundary conditions

2009 ◽  
Vol 6 (5) ◽  
pp. 671 ◽  
Author(s):  
Esmail M.A. Mokheimer ◽  
Ali Hassan Al Salim
Keyword(s):  
Boundary Conditions ◽  
Mixed Convection ◽  
Entropy Generation ◽  
Parallel Plates ◽  
Isothermal Boundary
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