scholarly journals Commercial Design of Custom Front-end Electronics for a High Temperature Fission Chamber

2018 ◽  
Author(s):  
N. Dianne Bull Ezell ◽  
Lorenzo Fabris ◽  
Richard J. Wunderlich ◽  
Padhraic L. Mulligan ◽  
Christian M. Petrie ◽  
...  
Keyword(s):  
High Temperature ◽  
Fission Chamber ◽  
Front End

A Mixed-Signal BiCMOS Front-End Signal Processor for High-Temperature Applications

2006 ◽  
Vol 41 (7) ◽  
pp. 1638-1647 ◽  
Author(s):  
O. Vermesan ◽  
L.-C.J. Blystad ◽  
R. Bahr ◽  
M. Hjelstuen ◽  
L. Beneteau ◽  
...  
Keyword(s):  
High Temperature ◽  
Mixed Signal ◽  
Front End ◽  
Signal Processor ◽  
Temperature Applications

High temperature phased array ultrasonic system with integrated front end electronics

2006 ◽  
Author(s):  
O. Vermesan ◽  
L.-C. Blystad ◽  
R. Bahr ◽  
K. Liang ◽  
B. Froelich ◽  
...  
Keyword(s):  
High Temperature ◽  
Phased Array ◽  
Front End

scholarly journals Characterization and localization of partial-discharge-induced pulses in fission chambers designed for sodium-cooled fast reactors

2018 ◽  
Vol 170 ◽  
pp. 03002
Author(s):  
G. Galli ◽  
H. Hamrita ◽  
C. Jammes ◽  
M.J. Kirkpatrick ◽  
E. Odic ◽  
...  
Keyword(s):  
High Temperature ◽  
Neutron Flux ◽  
Electrical Discharge ◽  
Partial Discharge ◽  
Electrical Signal ◽  
Fast Reactors ◽  
Electrode Gap ◽  
Fission Chamber ◽  
Flux Monitoring ◽  
Fission Chambers

During the operation of the Superphenix and Phenix reactors, an aberrant electrical signal was detected from the fission chambers used for neutron flux monitoring. This signal, thought to be due to partial electrical discharge (PD) is similar to the signal resulting from neutron interactions, and is generated in fission chambers at temperatures above 400 °C. This paper reports work on the characterization and localization of the source of this electrical signal in a High Temperature Fission Chamber (HTFC). The relation between the shape of the PD signal and various parameters (nature and pressure of the chamber filling gas, electrode gap distance, and fission chamber geometry) are first described. Next, experiments designed to identify the location within the chambers where the PD are being generated are presented. After verification and refinement of the results of these localization studies, it should be possible to propose changes to the fission chamber in order to reduce or eliminate the PD signal.

SOI-CMOS precision front-end amplifier for wide range and high temperature (200 °C) operation of smart microsensors

2004 ◽  
Vol 112 (2-3) ◽  
pp. 388-394
Author(s):  
Hidekuni Takao ◽  
Fumie Ina ◽  
Toshiaki Douzaka ◽  
Kazuaki Sawada ◽  
Makoto Ishida
Keyword(s):  
High Temperature ◽  
Front End ◽  
Wide Range ◽  
Soi Cmos

Fiber Optics Based Jet Engine Augmenter Viewing System

1989 ◽  
Vol 111 (2) ◽  
pp. 306-309
Author(s):  
P. J. Murphy ◽  
D. W. Jones ◽  
A. E. Lennert ◽  
R. R. Jones
Keyword(s):  
High Temperature ◽  
Fiber Optics ◽  
Fiber Optic ◽  
Video Camera ◽  
Jet Engine ◽  
Front End ◽  
Lens Assembly ◽  
Color Video ◽  
Engine Testing ◽  
Optic Array

An augmenter viewing system employing a coherent fiber-optic array was developed for use in jet engine testing applications at AEDC. Real-time viewing of the test article afterburner was obtained in a severe environment under high temperature and vibration levels. The optical system consisted of a conventional front-end lens assembly coupled with the fiber-optic array, and a solid-state color video camera mounted inside the test cell. The advantages and problems associated with a fiber-optics-based viewing system will be discussed in comparison with more conventional viewing techniques for this application.

Communications System using a 1K22Monoconductor Cable for Down-hole Measurement Tools

2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000316-000326
Author(s):  
Rito Mijarez ◽  
David Pascacio ◽  
Ricardo Guevara ◽  
Joaquín Rodríguez ◽  
Olimpia Pacheco
Keyword(s):  
High Temperature ◽  
Electronic Device ◽  
Measurement Tool ◽  
Design Modification ◽  
Noise Interference ◽  
Front End ◽  
Bidirectional Communication ◽  
Measurement Tools ◽  
Firm Basis ◽  
Communications System

Progressively deeper and hotter oil wells have driven design modification that enhances the performance in sensors and downhole electronic instruments. Oil reservoirs in Mexico are located at mean depths of 6,000 m; as a consequence, the requirements for measuring thermodynamic and geophysical parameters are challenging. This paper describes a bidirectional communication system that exchanges data from a down-hole high pressure and high temperature (HP/HT) measurement tool to the surface installation. The communication medium is a 7 km mono-conductor 1K22 logging cable used also as a power supply transmission line. The system consists of a proprietary downhole measurement tool, composed of a HT/HP sensor and a high temperature DSP-based electronic device, and a data acquisition equipment located in the surface installation. The system employs a communication algorithm that automatically switches the modulation technique and changes the carrier frequency to avoid issues derived from noise interference, cable attenuation and thermal drift of the front end passive elements. The laboratory tests results provide a firm basis for testing and evaluating the system in the field.

Integrated Rapid Thermal CVD Processing Solutions for 0.18–0.25μm Technologies

1997 ◽  
Vol 470 ◽  
Author(s):  
H. Gilboa ◽  
Y. E. Gilboa ◽  
Z. Atzmon ◽  
S. Levy ◽  
H. Spilberg ◽  
...  
Keyword(s):  
High Temperature ◽  
Flash Memory ◽  
Thermal Processing ◽  
Rapid Thermal Processing ◽  
Chemical Vapor ◽  
Wafer Cleaning ◽  
Front End ◽  
Wafer Processing ◽  
Cluster Tool ◽  
Temperature Applications

ABSTRACTThe evolution of integrated single-wafer processing for high-temperature applications in the front end of the line (FEOL) occurred with the advancements in single-wafer rapid thermal processing and its acceptance as a manufacturing technology. The Integra RTCVD cluster tool for high-temperature applications features wafer cleaning, rapid thermal processing and single wafer chemical vapor deposition steps. The paper presents integrated vapor phase clean and RTCVD applications for FLASH memory gate stack and DRAM cell.

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